Inventor · disambiguated record
Chun-Yuan Li
Also filed as: LI CHUN-YUAN
14 granted patents·5 pending applications·254 citations·filing 2003–2014
91Inventor score
Files withSILICONWARE PRECISION INDUSTRIES CO LTD13LIN PANG-CHUN4CHAN CHANG-YUEH1SILICONWARE PRECISON IND CO LT1
Top patents by PatentIndex Score
19 records- 0196US7934313B1Package structure fabrication methodSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2010·Granted May 3, 2011·132 cites·32 claims
- 0295US7314820B2Carrier-free semiconductor package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2005·Granted Jan 1, 2008·74 cites·18 claims
- 0381US8304268B2Fabrication method of semiconductor package structureLIN PANG-CHUN·Filed 2010·Granted Nov 6, 2012·5 cites·22 claims
- 0477US9177837B2Fabrication method of semiconductor package having electrical connecting structuresSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted Nov 3, 2015·3 cites·13 claims
- 0573US8618641B2Leadframe-based semiconductor packageCHAN CHANG-YUEH·Filed 2008·Granted Dec 31, 2013·6 cites·28 claims
- 0672US9362217B2Package on package structure and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted Jun 7, 2016·3 cites·10 claims
- 0769US8421199B2Semiconductor package structureLIN PANG-CHUN·Filed 2010·Granted Apr 16, 2013·2 cites·8 claims
- 0869US8390118B2Semiconductor package having electrical connecting structures and fabrication method thereofLIN PANG-CHUN·Filed 2010·Granted Mar 5, 2013·2 cites·9 claims
- 0968US7230323B2Ground-enhanced semiconductor package and lead frame for the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2003·Granted Jun 12, 2007·24 cites·18 claims
- 1054US8981575B2Semiconductor package structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Granted Mar 17, 2015·0 cites·9 claims
- 1154US8716861B2Semiconductor package having electrical connecting structures and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Granted May 6, 2014·0 cites·7 claims
- 1249US9130064B2Method for fabricating leadframe-based semiconductor package with connecting pads top and bottom surfaces of carrierSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Granted Sep 8, 2015·0 cites·15 claims
- 1346US7126229B2Wire-bonding method and semiconductor package using the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2004·Granted Oct 24, 2006·3 cites·9 claims
- 1445US2008303134A1Semiconductor package and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2008·Application pending·0 cites
- 1544US8873244B2Package structureLIN PANG-CHUN·Filed 2010·Granted Oct 28, 2014·0 cites·22 claims
- 1644US2007007669A1Wire-bonding method and semiconductor package using the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2006·Application pending·0 cites
- 1742US2007059863A1Method of manufacturing quad flat non-leaded semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2006·Application pending·0 cites
- 1835US2006151862A1Lead-frame-based semiconductor package and lead frame thereofSILICONWARE PRECISON IND CO LT·Filed 2005·Application pending·0 cites
- 1935US2004217450A1Leadframe-based non-leaded semiconductor package and method of fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2003·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →