Inventor · disambiguated record
Chien-Min Lin
Also filed as: LIN CHIEN · LIN CHIEN MIN
15 granted patents·6 pending applications·128 citations·filing 2001–2025
91Inventor score
Files withXINTEC INC5HIGH TECH COMP CORP3HTC CORP3TAIWAN SEMICONDUCTOR MFG CO LTD3SILICONWARE PRECISION INDUSTRIES CO LTD1
Top patents by PatentIndex Score
21 records- 0193US7679926B2Capacitors with insulating layer having embedded dielectric rodsTAIWAN SEMICONDUCTOR MANFACTUR·Filed 2007·Granted Mar 16, 2010·45 cites·20 claims
- 0286US8513795B23D IC configuration with contactless communicationYANG PING-LIN·Filed 2011·Granted Aug 20, 2013·9 cites·16 claims
- 0379US2025364274A1Semiconductor package structure and method of manufacturing thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0478US9899982B2On-chip electromagnetic bandgap (EBG) structure for noise suppressionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Feb 20, 2018·3 cites·20 claims
- 0577US6410865B1Mechanism for ejecting stylusHIGH TECH COMP CORP·Filed 2001·Granted Jun 25, 2002·26 cites·5 claims
- 0675US9947716B2Chip package and manufacturing method thereofXINTEC INC·Filed 2016·Granted Apr 17, 2018·2 cites·10 claims
- 0769US9334156B2Chip package and method thereofXINTEC INC·Filed 2015·Granted May 10, 2016·2 cites·19 claims
- 0865US6816740B2Recharge apparatus for holding the rechargeable deviceHIGH TECH COMP CORP·Filed 2001·Granted Nov 9, 2004·21 cites·13 claims
- 0965US6622920B2Operating button with multiple functions for a handheld productHIGH TECH COMP CORP·Filed 2001·Granted Sep 23, 2003·12 cites·18 claims
- 1065US2023369070A1Semiconductor package structure and method of manufacturing thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 1162US2024415246A1Wearable device and upper head strap moduleHTC CORP·Filed 2024·Application pending·0 cites
- 1257US2025009081A1Wearable device and head strap moduleHTC CORP·Filed 2024·Application pending·0 cites
- 1356US8373250B2On-chip inductor structure and method for manufacturing the sameUNIV NAT CHIAO TUNG·Filed 2009·Granted Feb 12, 2013·1 cites·10 claims
- 1451US8921160B23D IC configuration with contactless communicationTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Dec 30, 2014·0 cites·20 claims
- 1550US7136682B2Portable electronic system equipped with a spare battery deviceHTC CORP·Filed 2002·Granted Nov 14, 2006·7 cites·12 claims
- 1649US11038077B2Chip package and manufacturing method thereofXINTEC INC·Filed 2019·Granted Jun 15, 2021·0 cites·20 claims
- 1741US9613904B2Semiconductor structure and manufacturing method thereofXINTEC INC·Filed 2016·Granted Apr 4, 2017·0 cites·12 claims
- 1840US2002140684A1Stylus for personal digital assistantFiled 2001·Application pending·0 cites
- 1937US9403672B2Chip package and method of manufacturing the sameXINTEC INC·Filed 2015·Granted Aug 2, 2016·0 cites·22 claims
- 2032US8669658B2Crosstalk-free WLCSP structure for high frequency applicationTSAI MON-CHIN·Filed 2007·Granted Mar 11, 2014·0 cites·11 claims
- 2129US2016050753A1Interposer and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Application pending·0 cites
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