Inventor · disambiguated record
Kuo-Ching Hsu
Also filed as: HSU KUO-CHING · HSU KUO-CHING STEVEN
67 granted patents·23 pending applications·1,873 citations·filing 2007–2025
99Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD52HSU KUO-CHING10TAIWAN SEMICONDUCTOR MFG10NOVATEK MICROELECTRONICS CORP5YU CHEN-HUA4
Top patents by PatentIndex Score
90 records- 0198US9299649B23D packages and methods for forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Mar 29, 2016·902 cites·22 claims
- 0298US7928534B2Bond pad connection to redistribution lines having tapered profilesTAIWAN SEMICONDUCTOR MFG·Filed 2008·Granted Apr 19, 2011·66 cites·20 claims
- 0397US8476769B2Through-silicon vias and methods for forming the sameCHEN CHIH-HUA·Filed 2007·Granted Jul 2, 2013·67 cites·27 claims
- 0497US8288969B2Driving apparatus of light emitting diode and driving method thereofHSU KUO-CHING·Filed 2012·Granted Oct 16, 2012·57 cites·37 claims
- 0597US7956442B2Backside connection to TSVs having redistribution linesTAIWAN SEMICONDUCTOR MFG·Filed 2008·Granted Jun 7, 2011·55 cites·14 claims
- 0697US7633165B2Introducing a metal layer between SiN and TiN to improve CBD contact resistance for P-TSVTAIWAN SEMICONDUCTOR MANFACTUR·Filed 2008·Granted Dec 15, 2009·188 cites·18 claims
- 0796US11069539B23D packages and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 20, 2021·3 cites·20 claims
- 0896US8427081B2Driving apparatus of light emitting diode and driving method thereofHSU KUO-CHING·Filed 2012·Granted Apr 23, 2013·44 cites·24 claims
- 0996US8158489B2Formation of TSV backside interconnects by modifying carrier wafersHUANG HON-LIN·Filed 2010·Granted Apr 17, 2012·47 cites·16 claims
- 1096US8154223B2Driving apparatus of light emitting diode and driving method thereofHSU KUO-CHING·Filed 2009·Granted Apr 10, 2012·55 cites·22 claims
- 1195US11302537B2Chip package structure with conductive adhesive layer and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Apr 12, 2022·3 cites·20 claims
- 1295US9633869B2Packages with interposers and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Apr 25, 2017·15 cites·20 claims
- 1395US9355980B2Three-dimensional chip stack and method of forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted May 31, 2016·19 cites·20 claims
- 1495US8664760B2Connector design for packaging integrated circuitsYU CHEN-HUA·Filed 2012·Granted Mar 4, 2014·18 cites·11 claims
- 1595US8513119B2Method of forming bump structure having tapered sidewalls for stacked diesCHANG HUNG-PIN·Filed 2008·Granted Aug 20, 2013·35 cites·12 claims
- 1694US9343419B2Bump structures for semiconductor packageTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted May 17, 2016·21 cites·13 claims
- 1794US8736050B2Front side copper post joint structure for temporary bond in TSV applicationHUANG HON-LIN·Filed 2010·Granted May 27, 2014·23 cites·14 claims
- 1894US8558229B2Passivation layer for packaged chipJENG SHIN-PUU·Filed 2011·Granted Oct 15, 2013·19 cites·20 claims
- 1993US11854956B2Semiconductor die package with conductive line crack prevention designTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 26, 2023·2 cites·20 claims
- 2093US10269584B23D packages and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 23, 2019·7 cites·19 claims
- 2193US9508666B2Packaging structures and methods with a metal pillarTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Nov 29, 2016·13 cites·17 claims
- 2293US8134304B2Light source driving device capable of dynamically keeping constant current sink and related methodHSU KUO-CHING·Filed 2009·Granted Mar 13, 2012·36 cites·19 claims
- 2393US7679926B2Capacitors with insulating layer having embedded dielectric rodsTAIWAN SEMICONDUCTOR MANFACTUR·Filed 2007·Granted Mar 16, 2010·45 cites·20 claims
- 2492US12027435B2Packages including multiple encapsulated substrate blocks and overlapping redistribution structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 2, 2024·1 cites·20 claims
- 2592US8344661B2LED device with simultaneous open and short detection function and method thereofNOVATEK MICROELECTRONICS CORP·Filed 2009·Granted Jan 1, 2013·26 cites·13 claims
- 2691US12002746B2Chip package structure with metal-containing layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jun 4, 2024·1 cites·20 claims
- 2791US10163756B2Isolation structure for stacked diesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Dec 25, 2018·11 cites·21 claims
- 2891US9570366B2Passivation layer for packaged chipTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Feb 14, 2017·11 cites·20 claims
- 2989US11075173B2Semiconductor device and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jul 27, 2021·5 cites·20 claims
- 3088US10665474B23D packages and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 26, 2020·3 cites·20 claims
- 3188US10276525B2Package structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 30, 2019·5 cites·19 claims
- 3287US9312225B2Bump structure for stacked diesTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Apr 12, 2016·7 cites·21 claims
- 3387US8169156B2Control method capable of preventing flicker effect and light emitting device thereofHSU KUO-CHING·Filed 2009·Granted May 1, 2012·15 cites·38 claims
- 3487US2025323139A1Chip package structure with protection elementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3586US12388003B2Chip package structure with metal-containing layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Aug 12, 2025·0 cites·20 claims
- 3685US8759949B2Wafer backside structures having copper pillarsYU CHEN-HUA·Filed 2010·Granted Jun 24, 2014·8 cites·11 claims
- 3784US9984981B2Packages with interposers and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted May 29, 2018·3 cites·20 claims
- 3884US8461045B2Bond pad connection to redistribution lines having tapered profilesHSU KUO-CHING·Filed 2011·Granted Jun 11, 2013·6 cites·20 claims
- 3983US11244919B2Package structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Feb 8, 2022·3 cites·17 claims
- 4083US2024387192A1Chip package structure with nickel layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4182US12125715B2Chip package structure with nickel layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Oct 22, 2024·0 cites·20 claims
- 4282US12040266B2Package substrate, package using the same, and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 16, 2024·2 cites·20 claims
- 4381US12412827B2Semiconductor die package with conductive line crack prevention designTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 9, 2025·0 cites·20 claims
- 4481US9372951B2Semiconductor device design methods and conductive bump pattern enhancement methodsTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jun 21, 2016·4 cites·21 claims
- 4581US2025309089A1Semiconductor die package with conductive line crack prevention design and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4680US12463150B2Bonding structures in semiconductor packaged device and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Nov 4, 2025·0 cites·19 claims
- 4779US2024321661A1Packages with multiple encapsulated substrate blocksTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4878US8871609B2Thin wafer handling structure and methodYU CHEN-HUA·Filed 2010·Granted Oct 28, 2014·4 cites·18 claims
- 4977US11728180B2Chip package structure with conductive adhesive layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 15, 2023·0 cites·20 claims
- 5077US2024379584A1Semiconductor device and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
Showing the top 50 of 90 patent records by PatentIndex Score.
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