Inventor · disambiguated record
Do Sung Chun
Also filed as: CHUN DO SUNG
7 granted patents·1 pending application·316 citations·filing 1999–2005
88Inventor score
Technology areasH10W
Files withAMKOR TECHNOLOGY INC8
Top patents by PatentIndex Score
8 records- 0196US6798049B1Semiconductor package and method for fabricating the sameAMKOR TECHNOLOGY INC·Filed 2000·Granted Sep 28, 2004·125 cites·30 claims
- 0293US7211900B2Thin semiconductor package including stacked diesAMKOR TECHNOLOGY INC·Filed 2005·Granted May 1, 2007·26 cites·20 claims
- 0393US6515356B1Semiconductor package and method for fabricating the sameAMKOR TECHNOLOGY INC·Filed 2000·Granted Feb 4, 2003·79 cites·12 claims
- 0489US6982488B2Semiconductor package and method for fabricating the sameAMKOR TECHNOLOGY INC·Filed 2003·Granted Jan 3, 2006·45 cites·20 claims
- 0582US6717248B2Semiconductor package and method for fabricating the sameAMKOR TECHNOLOGY INC·Filed 2002·Granted Apr 6, 2004·27 cites·38 claims
- 0670US7190071B2Semiconductor package and method for fabricating the sameAMKOR TECHNOLOGY INC·Filed 2004·Granted Mar 13, 2007·13 cites·9 claims
- 0744USRE40112ESemiconductor package and method for fabricating the sameAMKOR TECHNOLOGY INC·Filed 2004·Granted Feb 26, 2008·1 cites·35 claims
- 0829US2002096253A1Methods Of Attaching A Sheet Of An Adhesive Film To A Substrate In The Course Of Making Integrated Circuit PackagesAMKOR TECHNOLOGY INC·Filed 1999·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →