Inventor · disambiguated record
Kimberley A. Kelly
Also filed as: KELLY KIMBERLEY A · KELLY KIMBERLEY ANN
14 granted patents·378 citations·filing 1995–2001
94Inventor score
Files withIBM14
Top patents by PatentIndex Score
14 records- 0193US6036809AProcess for releasing a thin-film structure from a substrateIBM·Filed 1999·Granted Mar 14, 2000·112 cites·15 claims
- 0287US6281452B1Multi-level thin-film electronic packaging structure and related methodIBM·Filed 1998·Granted Aug 28, 2001·53 cites·21 claims
- 0382US6183588B1Process for transferring a thin-film structure to a substrateIBM·Filed 1999·Granted Feb 6, 2001·52 cites·15 claims
- 0480US6678949B2Process for forming a multi-level thin-film electronic packaging structureIBM·Filed 2001·Granted Jan 20, 2004·21 cites·8 claims
- 0573US5735452ABall grid array by partitioned lamination processIBM·Filed 1996·Granted Apr 7, 1998·38 cites·12 claims
- 0669US6143117AProcess for transferring a thin-film structure to a temporary carrierIBM·Filed 1999·Granted Nov 7, 2000·28 cites·10 claims
- 0766US6099935AApparatus for providing solder interconnections to semiconductor and electronic packaging devicesIBM·Filed 1995·Granted Aug 8, 2000·24 cites·2 claims
- 0847US6632314B1Method of making a lamination and surface planarization for multilayer thin film interconnectIBM·Filed 1999·Granted Oct 14, 2003·14 cites·11 claims
- 0947US6455331B2Process of top-surface-metallurgy plate-up bonding and rewiring for multilayer devicesIBM·Filed 2001·Granted Sep 24, 2002·3 cites·3 claims
- 1043US5722579ABottom-surface-metallurgy rework process in ceramic modulesIBM·Filed 1996·Granted Mar 3, 1998·13 cites·22 claims
- 1140US6149048AApparatus and method for use in manufacturing semiconductor devicesIBM·Filed 1998·Granted Nov 21, 2000·7 cites·48 claims
- 1236US6448169B1Apparatus and method for use in manufacturing semiconductor devicesIBM·Filed 1995·Granted Sep 10, 2002·5 cites·7 claims
- 1335US6048741ATop-surface-metallurgy plate-up bonding and rewiring for multilayer devicesIBM·Filed 1997·Granted Apr 11, 2000·6 cites·21 claims
- 1430US6248599B1Top-surface-metallurgy plate-up bonding and rewiring for multilayer devicesIBM·Filed 1999·Granted Jun 19, 2001·2 cites·3 claims
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