Inventor · disambiguated record
Chun-Chih Lin
Also filed as: LIN CHUN · LIN CHUN-CHIH
47 granted patents·17 pending applications·85 citations·filing 1999–2025
97Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD42CHILISIN ELECTRONICS CORP6WISTRON CORP6TAIWAN SEMICONDUCTOR MFG4CELL POWER CO LTD1
Top patents by PatentIndex Score
64 records- 0194US11437477B1Fluorine-free interface for semiconductor device performance gainTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 6, 2022·3 cites·20 claims
- 0294US10134790B1Image sensor and fabrication method thereforTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Nov 20, 2018·12 cites·20 claims
- 0391US10504737B2Methods of enhancing surface topography on a substrate for inspectionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 10, 2019·5 cites·20 claims
- 0490US10446662B2Reducing metal gate overhang by forming a top-wide bottom-narrow dummy gate electrodeTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Oct 15, 2019·6 cites·20 claims
- 0587US11398393B2Vapor shield replacement system and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 26, 2022·2 cites·20 claims
- 0686US2025331275A1Fluorine-free interface for semiconductor device performance gainTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0785US12363985B2Fluorine-free interface for semiconductor device performance gainTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jul 15, 2025·0 cites·20 claims
- 0884US12048944B2Method of operating drippage prevention systemTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 30, 2024·1 cites·20 claims
- 0983US11381129B2Motor stator with winding configuration using hairpin wiresDELTA ELECTRONICS INC·Filed 2019·Granted Jul 5, 2022·2 cites·20 claims
- 1083US10844477B2Electromagnetic module for physical vapor depositionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Nov 24, 2020·3 cites·20 claims
- 1183US10345716B2Metrology method in reticle transportationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 9, 2019·2 cites·20 claims
- 1281US10658315B2Redistribution layer metallic structure and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted May 19, 2020·2 cites·20 claims
- 1380US12059692B2Nozzle assembly for use with liquid dispensing systemTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Aug 13, 2024·0 cites·20 claims
- 1480US2024359194A1Liquid dispensing system and methodsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1579US2025357319A1Semiconductor device structure and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1678US12040293B2Redistribution layer metallic structure and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 16, 2024·0 cites·20 claims
- 1778US10784114B2Methods of enhancing surface topography on a substrate for inspectionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 22, 2020·1 cites·20 claims
- 1878US10497729B2Image sensor having conductive layer and protective layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 3, 2019·2 cites·20 claims
- 1978US2024342745A1Method of operating drippage prevention systemTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2077US12362095B2Method for producing magnetic deviceCHILISIN ELECTRONICS CORP·Filed 2024·Granted Jul 15, 2025·0 cites·5 claims
- 2177US11908909B2Fluorine-free interface for semiconductor device performance gainTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 20, 2024·0 cites·20 claims
- 2276US10916517B2Redistribution layer metallic structure and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Feb 9, 2021·1 cites·20 claims
- 2376US2025385037A1Inductor and method for manufacturing the sameCHILISIN ELECTRONICS CORP·Filed 2025·Application pending·0 cites
- 2475US12094648B1Method for producing a magnetic deviceCHILISIN ELECTRONICS CORP·Filed 2023·Granted Sep 17, 2024·0 cites·7 claims
- 2575US10354965B2Bonding pad process with protective layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jul 16, 2019·2 cites·20 claims
- 2674US12230517B2Exhaust system and process equipmentTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 18, 2025·0 cites·20 claims
- 2773US11823919B2Multi-shield plate and control systemTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 21, 2023·0 cites·20 claims
- 2873US10792697B2Drippage prevention system and method of operating sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Oct 6, 2020·1 cites·20 claims
- 2972US11502050B2Redistribution layer metallic structure and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 15, 2022·0 cites·20 claims
- 3072US8377503B2Method for real-time monitoring thickness chance of coating filmFORWARD ELECTRONICS CO LTD·Filed 2010·Granted Feb 19, 2013·1 cites·9 claims
- 3172US2025167014A1Method of using exhaust system and method of using process equipmentTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3271US11222788B2Methods of enhancing surface topography on a substrate for inspectionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jan 11, 2022·0 cites·20 claims
- 3370US11642682B2Pipe design for prevent dripTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 9, 2023·0 cites·20 claims
- 3470US6407368B1System for maintaining a flat zone temperature profile in LP vertical furnaceTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Jun 18, 2002·18 cites·13 claims
- 3570US2025174393A1InductorCHILISIN ELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 3669US12142664B2Reducing metal gate overhang by forming a top-wide bottom-narrow dummy gate electrodeTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 12, 2024·0 cites·20 claims
- 3767US2025174387A1Inductor and method for manufacturing the sameCHILISIN ELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 3866US11396695B2Electromagnetic module for physical vapor depositionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 26, 2022·0 cites·20 claims
- 3966US11177365B2Semiconductor device with adhesion layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 16, 2021·0 cites·20 claims
- 4066US11164957B2Semiconductor device with adhesion layer and method of makingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 2, 2021·0 cites·20 claims
- 4166US2025095917A1Inductive component and method for fabricating the sameCHILISIN ELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 4265US2023013102A1Semiconductor device structure and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 4364US10068693B2Multi-layer wiring structure, magnetic element and manufacturing method thereofCYNTEC CO LTD·Filed 2015·Granted Sep 4, 2018·1 cites·17 claims
- 4463US7704190B2Power generation device for exercise equipmentKING I TECH CORP·Filed 2009·Granted Apr 27, 2010·4 cites·7 claims
- 4562US11387123B2Metrology method in wafer transportationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 12, 2022·0 cites·20 claims
- 4661US11348811B2Thermal chamber exhaust structure and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 31, 2022·0 cites·20 claims
- 4760US10490649B2Method of fabricating semiconductor device with adhesion layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Nov 26, 2019·0 cites·20 claims
- 4858US10864533B2Integrated circuit, system for and method of forming an integrated circuitTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 15, 2020·0 cites·20 claims
- 4955US10366909B2Thermal chamber exhaust structure and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jul 30, 2019·0 cites·20 claims
- 5054US10811285B2Vapor shield replacement system and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Oct 20, 2020·0 cites·20 claims
Showing the top 50 of 64 patent records by PatentIndex Score.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →