Inventor · disambiguated record
Phil P. Marcoux
Also filed as: MARCOUX PHIL P
8 granted patents·4 pending applications·457 citations·filing 1997–2011
89Inventor score
Technology areasH10W
Files withCHIPSCALE INC6WAFER LEVEL PACKAGING PORTFOLIO LLC3MARCOUX PHIL P1SAMSUNG ELECTRONICS CO LTD1WAFER LEVEL PACKAGING PORTFOLI1
Top patents by PatentIndex Score
12 records- 0195US6221751B1Wafer fabrication of die-bottom contacts for electronic devicesCHIPSCALE INC·Filed 1998·Granted Apr 24, 2001·203 cites·44 claims
- 0295US5910687AWafer fabrication of die-bottom contacts for electronic devicesCHIPSCALE INC·Filed 1997·Granted Jun 8, 1999·198 cites·44 claims
- 0390US8053898B2Connection for off-chip electrostatic discharge protectionSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Nov 8, 2011·23 cites·13 claims
- 0477US7858512B2Semiconductor with bottom-side wrap-around flange contactWAFER LEVEL PACKAGING PORTFOLIO LLC·Filed 2008·Granted Dec 28, 2010·7 cites·8 claims
- 0564US6833986B2Integrated passive components and package with postsCHIPSCALE INC·Filed 2004·Granted Dec 21, 2004·8 cites·12 claims
- 0657US6946734B2Integrated passive components and package with postsCHIPSCALE INC·Filed 2004·Granted Sep 20, 2005·5 cites·7 claims
- 0751US6414585B1Integrated passive components and package with postsCHIPSCALE INC·Filed 1997·Granted Jul 2, 2002·12 cites·24 claims
- 0850US2010270668A1Dual Interconnection in Stacked Memory and Controller ModuleWAFER LEVEL PACKAGING PORTFOLI·Filed 2009·Application pending·0 cites
- 0945US6954130B2Integrated passive components and package with postsCHIPSCALE INC·Filed 2002·Granted Oct 11, 2005·1 cites·20 claims
- 1044US2011169171A1Dual Interconnection in Stacked Memory and Controller ModuleWAFER LEVEL PACKAGING PORTFOLIO LLC·Filed 2011·Application pending·0 cites
- 1144US2009324906A1Semiconductor with top-side wrap-around flange contactMARCOUX PHIL P·Filed 2008·Application pending·0 cites
- 1243US2010327448A1Semiconductor with Bottom-Side Wrap-Around Flange ContactWAFER LEVEL PACKAGING PORTFOLIO LLC·Filed 2010·Application pending·0 cites
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