Inventor · disambiguated record
Hayato Takasago
Also filed as: TAKASAGO HAYATO
26 granted patents·1,342 citations·filing 1984–1995
97Inventor score
Files withMITSUBISHI ELECTRIC CORP26
Top patents by PatentIndex Score
26 records- 0198US5113274AMatrix-type color liquid crystal display deviceMITSUBISHI ELECTRIC CORP·Filed 1989·Granted May 12, 1992·240 cites·8 claims
- 0297US4993148AMethod of manufacturing a circuit boardMITSUBISHI ELECTRIC CORP·Filed 1989·Granted Feb 19, 1991·148 cites·12 claims
- 0391US4914815AMethod for manufacturing hybrid integrated circuitsMITSUBISHI ELECTRIC CORP·Filed 1989·Granted Apr 10, 1990·101 cites·22 claims
- 0489US4942140AMethod of packaging semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1989·Granted Jul 17, 1990·103 cites·24 claims
- 0588US4967261ATape carrier for assembling an IC chip on a substrateMITSUBISHI ELECTRIC CORP·Filed 1989·Granted Oct 30, 1990·86 cites·12 claims
- 0687US6104464ARigid circuit board for liquid crystal display including cut out for providing flexibility to said boardMITSUBISHI ELECTRIC CORP·Filed 1995·Granted Aug 15, 2000·110 cites·4 claims
- 0785US5173844AIntegrated circuit device having a metal substrateMITSUBISHI ELECTRIC CORP·Filed 1991·Granted Dec 22, 1992·68 cites·4 claims
- 0884US5269868AMethod for separating bonded substrates, in particular disassembling a liquid crystal display deviceMITSUBISHI ELECTRIC CORP·Filed 1992·Granted Dec 14, 1993·48 cites·6 claims
- 0984US5029984ALiquid crystal display deviceMITSUBISHI ELECTRIC CORP·Filed 1989·Granted Jul 9, 1991·69 cites·2 claims
- 1080US5081562ACircuit board with high heat dissipations characteristicMITSUBISHI ELECTRIC CORP·Filed 1990·Granted Jan 14, 1992·53 cites·8 claims
- 1175US4685203AHybrid integrated circuit substrate and method of manufacturing the sameMITSUBISHI ELECTRIC CORP·Filed 1984·Granted Aug 11, 1987·22 cites·10 claims
- 1274US5293262ALiquid crystal display device having heat-insulating members and driving circuit boards attached to rear edges of light boxMITSUBISHI ELECTRIC CORP·Filed 1992·Granted Mar 8, 1994·55 cites·3 claims
- 1374US4629681AMethod of manufacturing multilayer circuit boardMITSUBISHI ELECTRIC CORP·Filed 1984·Granted Dec 16, 1986·31 cites·7 claims
- 1473US4643798AComposite and circuit board having conductive layer on resin layer and method of manufacturingMITSUBISHI ELECTRIC CORP·Filed 1985·Granted Feb 17, 1987·33 cites·14 claims
- 1572US5604513ASerial sampling video signal driving apparatus with improved color renditionMITSUBISHI ELECTRIC CORP·Filed 1994·Granted Feb 18, 1997·43 cites·18 claims
- 1671US4854230AScreen printing apparatusMITSUBISHI ELECTRIC CORP·Filed 1988·Granted Aug 8, 1989·28 cites·12 claims
- 1768US4943768ATesting device for electrical circuit boardsMITSUBISHI ELECTRIC CORP·Filed 1989·Granted Jul 24, 1990·25 cites·2 claims
- 1863US4785157AMethod for controlling electric resistance of a compound-type resistorsMITSUBISHI ELECTRIC CORP·Filed 1987·Granted Nov 15, 1988·12 cites·31 claims
- 1958US4783642AHybrid integrated circuit substrate and method of manufacturing the sameMITSUBISHI ELECTRIC CORP·Filed 1987·Granted Nov 8, 1988·14 cites·7 claims
- 2042US4645734AComposite having conductive layer on resin layer and method of manufacturingMITSUBISHI ELECTRIC CORP·Filed 1985·Granted Feb 24, 1987·9 cites·9 claims
- 2140US5034569AMultilayer interconnection circuit boardMITSUBISHI ELECTRIC CORP·Filed 1990·Granted Jul 23, 1991·9 cites·6 claims
- 2240US4963389AMethod for producing hybrid integrated circuit substrateMITSUBISHI ELECTRIC CORP·Filed 1989·Granted Oct 16, 1990·12 cites·5 claims
- 2340US4946709AMethod for fabricating hybrid integrated circuitMITSUBISHI ELECTRIC CORP·Filed 1989·Granted Aug 7, 1990·9 cites·8 claims
- 2433US4898805AMethod for fabricating hybrid integrated circuitMITSUBISHI ELECTRIC CORP·Filed 1988·Granted Feb 6, 1990·6 cites·11 claims
- 2532US5069745AProcess for preparing a combined wiring substrateMITSUBISHI ELECTRIC CORP·Filed 1990·Granted Dec 3, 1991·4 cites·9 claims
- 2631US4887030ATesting device for electrical circuit boardsMITSUBISHI ELECTRIC CORP·Filed 1987·Granted Dec 12, 1989·4 cites·2 claims
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