Inventor · disambiguated record
Hartmut Mahlkow
Also filed as: MAHLKOW HARTMUT
13 granted patents·2 pending applications·323 citations·filing 1979–2004
93Inventor score
Top patents by PatentIndex Score
15 records- 0191US4248632ASolution and process for the activation of surfaces for metallizationSCHERING AG·Filed 1979·Granted Feb 3, 1981·61 cites·2 claims
- 0287US5882736Apalladium layers deposition processATOTECH DEUTSCHLAND GMBH·Filed 1997·Granted Mar 16, 1999·93 cites·16 claims
- 0381US4517254AAdhesive metallization of polyimideSCHERING AG·Filed 1982·Granted May 14, 1985·46 cites·14 claims
- 0478US6869637B2Bath and method of electroless plating of silver on metal surfacesATOTECH DEUTSCHLAND GMBH·Filed 2001·Granted Mar 22, 2005·21 cites·32 claims
- 0563US6698648B2Method for producing solderable and functional surfaces on circuit carriersATOTECH DEUTSCHLAND GMBH·Filed 2001·Granted Mar 2, 2004·12 cites·18 claims
- 0661US5705219AMethod for coating surfaces with finely particulate materialsATOTECH DEUTSCHLAND GMBH·Filed 1996·Granted Jan 6, 1998·18 cites·23 claims
- 0760US4285991AMethod for producing printed circuitsSCHERING AG·Filed 1980·Granted Aug 25, 1981·18 cites·17 claims
- 0859US6336962B1Method and solution for producing gold coatingATOTECH DEUTSCHLAND GMBH·Filed 1998·Granted Jan 8, 2002·24 cites·8 claims
- 0953US7479305B2Immersion plating of silverATOTECH DEUTSCHLAND GMBH·Filed 2002·Granted Jan 20, 2009·2 cites·15 claims
- 1049US4262085AProcess for preparation of metal patterns on insulating carrier materialsSCHERING AG·Filed 1979·Granted Apr 14, 1981·11 cites·9 claims
- 1137US2005175780A1Acidic solution for silver deposition and method for silver layer deposition on metal surfacesATOTECH DEUTSCHLAND GMBH·Filed 2003·Application pending·0 cites
- 1236US4611554AMethod and device for the treatment of printed circuit boardsSCHERING AG·Filed 1985·Granted Sep 16, 1986·6 cites·8 claims
- 1335US2006189141A1Solution for etching copper surfaces and method of depositing metal on copper surfacesMAHLKOW HARTMUT·Filed 2004·Application pending·0 cites
- 1434US4966786AConditioning means for printed circuitsSCHERING AG·Filed 1988·Granted Oct 30, 1990·5 cites·6 claims
- 1533US4929422AProcess for the adhesive metallization of synthetic materialsSCHERING AG·Filed 1988·Granted May 29, 1990·6 cites·10 claims
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