Inventor · disambiguated record
Chi-Ting Wu
Also filed as: WU CHI · WU CHI-TING
16 granted patents·5 pending applications·49 citations·filing 2013–2024
91Inventor score
Top patents by PatentIndex Score
21 records- 0198US11901239B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2023·Granted Feb 13, 2024·2 cites·12 claims
- 0298US11062954B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2020·Granted Jul 13, 2021·11 cites·5 claims
- 0397US11721591B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2021·Granted Aug 8, 2023·3 cites·5 claims
- 0496US10607882B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2018·Granted Mar 31, 2020·12 cites·9 claims
- 0596US10249488B1Semiconductor devices with same conductive type but different threshold voltages and method of fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2018·Granted Apr 2, 2019·12 cites·7 claims
- 0692US10395991B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2017·Granted Aug 27, 2019·7 cites·20 claims
- 0791US2025113589A1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 0890US2024379451A1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 0989US2024371703A1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 1088US12211751B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2023·Granted Jan 28, 2025·0 cites·12 claims
- 1186US12074070B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2023·Granted Aug 27, 2024·0 cites·7 claims
- 1285US12094783B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2023·Granted Sep 17, 2024·0 cites·9 claims
- 1378US10529825B2Semiconductor device and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2018·Granted Jan 7, 2020·2 cites·18 claims
- 1477US11600531B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2021·Granted Mar 7, 2023·0 cites·12 claims
- 1573US11417564B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2021·Granted Aug 16, 2022·0 cites·12 claims
- 1671US10854502B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2020·Granted Dec 1, 2020·0 cites·15 claims
- 1770US10985048B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2020·Granted Apr 20, 2021·0 cites·11 claims
- 1859US10755919B2Method of fabricating semiconductor devices with same conductive type but different threshold voltagesUNITED MICROELECTRONICS CORP·Filed 2019·Granted Aug 25, 2020·0 cites·5 claims
- 1948US10347526B1Semiconductor structure and method for forming the sameUNITED MICROELECTRONICS CORP·Filed 2018·Granted Jul 9, 2019·0 cites·19 claims
- 2039US2014206188A1Method of forming a metal silicide layerIND TECH RES INST·Filed 2013·Application pending·0 cites
- 2137US2013275721A1Reconfigurable instruction encoding method, execution method, and electronic apparatusIND TECH RES INST·Filed 2013·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →