Inventor · disambiguated record
Tsuyoshi Sahoda
Also filed as: SAHODA TSUYOSHI
5 granted patents·7 pending applications·148 citations·filing 2000–2017
82Inventor score
Top patents by PatentIndex Score
12 records- 0195US6800188B2Copper plating bath and plating method for substrate using the copper plating bathEBARA UDYLITE KK·Filed 2002·Granted Oct 5, 2004·81 cites·33 claims
- 0292US7285492B2Method for processing substrateEBARA CORP·Filed 2005·Granted Oct 23, 2007·21 cites·9 claims
- 0385US6217730B1Sputtering deviceULVAC CORP·Filed 2000·Granted Apr 17, 2001·27 cites·11 claims
- 0476US6413392B1Sputtering deviceULVAC CORP·Filed 2000·Granted Jul 2, 2002·19 cites·14 claims
- 0566US2008264798A1Copper Plating Bath and Plating MethodEBARA CORP·Filed 2008·Application pending·0 cites
- 0652US2005072683A1Copper plating bath and plating methodEBARA CORP·Filed 2004·Application pending·0 cites
- 0749US2005208201A1Method and apparatus for determining the concentrations of additives in a plating solutionKUBOTA MAKOTO·Filed 2004·Application pending·0 cites
- 0849US2005126919A1Plating method, plating apparatus and a method of forming fine circuit wiringFiled 2004·Application pending·0 cites
- 0940US2006234499A1Substrate processing method and substrate processing apparatusKODERA AKIRA·Filed 2006·Application pending·0 cites
- 1038US2005045486A1Plating method and plating solutionFiled 2004·Application pending·0 cites
- 1137US11081028B2Light-emitting device assembly, method of producing the same, and display apparatusSONY CORP·Filed 2017·Granted Aug 3, 2021·0 cites·11 claims
- 1237US2006081478A1Plating apparatus and plating methodSAHODA TSUYOSHI·Filed 2005·Application pending·0 cites
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