Inventor · disambiguated record
Rainer Leuschner
Also filed as: LEUSCHNER RAINER · LEUSCHNER RAINER E · LEUSCHNER RAINER E R
76 granted patents·11 pending applications·1,548 citations·filing 1988–2023
99Inventor score
Top patents by PatentIndex Score
87 records- 0198US9593009B2Apparatus comprising and a method for manufacturing an embedded MEMS deviceINFINEON TECHNOLOGIES AG·Filed 2014·Granted Mar 14, 2017·46 cites·23 claims
- 0297US8183696B2Packaged semiconductor device with encapsulant embedding semiconductor chip that includes contact padsMEYER THORSTEN·Filed 2010·Granted May 22, 2012·47 cites·20 claims
- 0397US5234793AMethod for dimensionally accurate structure transfer in bilayer technique wherein a treating step with a bulging agent is employed after developmentSIEMENS AG·Filed 1990·Granted Aug 10, 1993·144 cites·20 claims
- 0496US7697322B2Integrated circuits; method for manufacturing an integrated circuit; method for decreasing the influence of magnetic fields; memory moduleQIMONDA AG·Filed 2007·Granted Apr 13, 2010·41 cites·24 claims
- 0596US6704230B1Error detection and correction method and apparatus in a magnetoresistive random access memoryIBM·Filed 2003·Granted Mar 9, 2004·126 cites·20 claims
- 0694US7660151B2Method for programming an integrated circuit, method for programming a plurality of cells, integrated circuit, cell arrangementQIMONDA AG·Filed 2007·Granted Feb 9, 2010·34 cites·24 claims
- 0794US6704220B2Layout for thermally selected cross-point MRAM cellINFINEON TECHNOLOGIES AG·Filed 2002·Granted Mar 9, 2004·63 cites·20 claims
- 0893US8741690B2Packaged semiconductor device with encapsulant embedding semiconductor chip that includes contact padsMEYER THORSTEN·Filed 2012·Granted Jun 3, 2014·16 cites·25 claims
- 0993US7855435B2Integrated circuit, method of manufacturing an integrated circuit, and memory moduleQIMONDA AG·Filed 2008·Granted Dec 21, 2010·29 cites·13 claims
- 1093US7643332B2MRAM cell using multiple axes magnetization and method of operationINFINEON TECHNOLOGIES AG·Filed 2006·Granted Jan 5, 2010·32 cites·42 claims
- 1193US5173393AEtch-resistant deep ultraviolet resist process having an aromatic treating step after developmentSIEMENS AG·Filed 1990·Granted Dec 22, 1992·94 cites·9 claims
- 1292US9884757B2MEMS sensor package systems and methodsINFINEON TECHNOLOGIES AG·Filed 2013·Granted Feb 6, 2018·11 cites·21 claims
- 1391US8618620B2Pressure sensor package systems and methodsWINKLER BERNHARD·Filed 2010·Granted Dec 31, 2013·13 cites·19 claims
- 1491US7092284B2MRAM with magnetic via for storage of information and field sensorALTIS SEMICONDUCTOR SNC·Filed 2004·Granted Aug 15, 2006·58 cites·22 claims
- 1590US5250375APhotostructuring processSIEMENS AG·Filed 1991·Granted Oct 5, 1993·66 cites·14 claims
- 1688US7083990B1Method of fabricating MRAM cellsINFINEON TECHNOLOGIES AG·Filed 2005·Granted Aug 1, 2006·13 cites·12 claims
- 1788US6815248B2Material combinations for tunnel junction cap layer, tunnel junction hard mask and tunnel junction stack seed layer in MRAM processingINFINEON TECHNOLOGIES AG·Filed 2002·Granted Nov 9, 2004·32 cites·28 claims
- 1887US8872288B2Apparatus comprising and a method for manufacturing an embedded MEMS deviceFUERGUT EDWARD·Filed 2012·Granted Oct 28, 2014·7 cites·22 claims
- 1986US9614256B2Lithium ion battery, integrated circuit and method of manufacturing a lithium ion batteryINFINEON TECHNOLOGIES AG·Filed 2014·Granted Apr 4, 2017·4 cites·14 claims
- 2086US8665629B2Condensed memory cell structure using a FinFETPARK HUMAN·Filed 2007·Granted Mar 4, 2014·26 cites·14 claims
- 2186US5234794APhotostructuring methodSIEMENS AG·Filed 1992·Granted Aug 10, 1993·50 cites·17 claims
- 2285US6576358B2Method of discharging reaction water in PEM fuel cells and fuel cell for carrying out the methodSIEMENS AG·Filed 2001·Granted Jun 10, 2003·28 cites·7 claims
- 2385US6503655B1Gas diffusion electrode and its productionSIEMENS AG·Filed 2000·Granted Jan 7, 2003·31 cites·30 claims
- 2484US10859457B2Sensor device including sensor unit for a gaseous mediumINFINEON TECHNOLOGIES AG·Filed 2017·Granted Dec 8, 2020·3 cites·24 claims
- 2583US8310866B2MRAM device structure employing thermally-assisted write operations and thermally-unassisted self-referencing operationsLEUSCHNER RAINER·Filed 2008·Granted Nov 13, 2012·10 cites·16 claims
- 2680US12188839B2Sensor device including sensor unit for a gaseous mediumINFINEON TECHNOLOGIES AG·Filed 2023·Granted Jan 7, 2025·0 cites·20 claims
- 2779US9929438B2Method of manufacturing a lithium ion batteryINFINEON TECHNOLOGIES AG·Filed 2017·Granted Mar 27, 2018·1 cites·20 claims
- 2877US9917333B2Lithium ion battery, integrated circuit and method of manufacturing a lithium ion batteryINFINEON TECHNOLOGIES AG·Filed 2014·Granted Mar 13, 2018·2 cites·20 claims
- 2975US7903454B2Integrated circuit, memory cell array, memory module, and method of operating an integrated circuitQIMONDA AG·Filed 2008·Granted Mar 8, 2011·9 cites·18 claims
- 3075US6614048B2Memory element with molecular or polymeric layers, memory cell, memory array, and smart cardINFINEON TECHNOLOGIES AG·Filed 2002·Granted Sep 2, 2003·21 cites·16 claims
- 3174US10102967B2Method of manufacturing an inductor core for a chip assembly and chip assemblyINFINEON TECHNOLOGIES AG·Filed 2014·Granted Oct 16, 2018·3 cites·6 claims
- 3273US8697574B2Through substrate features in semiconductor substratesMACKH GUNTHER·Filed 2009·Granted Apr 15, 2014·5 cites·25 claims
- 3372US7259025B2Ferromagnetic liner for conductive lines of magnetic memory cellsIBM·Filed 2006·Granted Aug 21, 2007·4 cites·26 claims
- 3471US6361666B1Gas diffusion electron, process for producing an electrode an carbonizable compositeSIEMENS AG·Filed 2000·Granted Mar 26, 2002·9 cites·31 claims
- 3570US11774308B2Sensor device including sensor unit for a gaseous mediumINFINEON TECHNOLOGIES AG·Filed 2020·Granted Oct 3, 2023·0 cites·20 claims
- 3670US5556812AConnection and build-up technique for multichip modulesSIEMENS AG·Filed 1995·Granted Sep 17, 1996·40 cites·20 claims
- 3770US5037876APlanarizing dielectricSIEMENS AG·Filed 1990·Granted Aug 6, 1991·46 cites·20 claims
- 3869US8990744B2Electrical measurement based circuit wiring layout modification method and systemINFINEON TECHNOLOGIES AG·Filed 2013·Granted Mar 24, 2015·3 cites·30 claims
- 3969US6171755B1Chemically amplified resistINFINEON TECHNOLOGIES AG·Filed 1998·Granted Jan 9, 2001·26 cites·18 claims
- 4067US10157765B2Methods for processing a semiconductor workpieceINFINEON TECHNOLOGIES AG·Filed 2016·Granted Dec 18, 2018·1 cites·17 claims
- 4167US6933538B2Plasma encapsulation for electronic and microelectronic components such as organic light emitting diodesOSRAM OPTO SEMICONDUCTORS GMBH·Filed 2001·Granted Aug 23, 2005·12 cites·29 claims
- 4266US7344896B2Ferromagnetic liner for conductive lines of magnetic memory cells and methods of manufacturing thereofINFINEON TECHNOLOGIES AG·Filed 2004·Granted Mar 18, 2008·14 cites·31 claims
- 4366US7075807B2Magnetic memory with static magnetic offset fieldALTIS SEMICONDUCTOR SNC·Filed 2004·Granted Jul 11, 2006·14 cites·19 claims
- 4466US6310401B1Substrate for high-voltage modulesSIEMENS AG·Filed 2000·Granted Oct 30, 2001·14 cites·16 claims
- 4565US9159620B2Semiconductor structure and method for making sameINFINEON TECHNOLOGIES AG·Filed 2014·Granted Oct 13, 2015·1 cites·13 claims
- 4663US6110637APhotoresists which are suitable for producing sub-micron size structuresSIEMENS AKTINEGESELLSCHAFT·Filed 1995·Granted Aug 29, 2000·22 cites·20 claims
- 4762US7088612B2MRAM with vertical storage element in two layer-arrangement and field sensorINFINEON TECHNOLOGIES AG·Filed 2004·Granted Aug 8, 2006·11 cites·27 claims
- 4862US6251558B1Chemically amplified resistSIEMENS AG·Filed 1998·Granted Jun 26, 2001·20 cites·13 claims
- 4961US6042993APhotolithographic structure generation processSIEMENS AG·Filed 1996·Granted Mar 28, 2000·35 cites·15 claims
- 5058US11192777B2MEMS sensor package systems and methodsINFINEON TECHNOLOGIES AG·Filed 2018·Granted Dec 7, 2021·0 cites·21 claims
Showing the top 50 of 87 patent records by PatentIndex Score.
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