Inventor · disambiguated record
Hyae-Ryoung Lee
Also filed as: LEE HYAE-RYOUNG
9 granted patents·1 pending application·507 citations·filing 1998–2005
91Inventor score
Files withSAMSUNG ELECTRONICS CO LTD9
Top patents by PatentIndex Score
10 records- 0194US6222270B1Integrated circuit bonding pads including closed vias and closed conductive patternsSAMSUNG ELECTRONICS CO LTD·Filed 1998·Granted Apr 24, 2001·191 cites·36 claims
- 0292US6541328B2Method of fabricating metal oxide semiconductor transistor with lightly doped impurity regions formed after removing spacers used for defining higher density impurity regionsSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Apr 1, 2003·125 cites·25 claims
- 0380US6597032B1Metal-insulator-metal (MIM) capacitorsSAMSUNG ELECTRONICS CO LTD·Filed 2000·Granted Jul 22, 2003·33 cites·8 claims
- 0477US6552438B2Integrated circuit bonding pads including conductive layers with arrays of unaligned spaced apart insulating islands therein and methods of forming sameSAMSUNG ELECTRONICS CO LTD·Filed 2000·Granted Apr 22, 2003·34 cites·29 claims
- 0575US6569746B2Methods of forming integrated circuit capacitors having electrodes therein that comprise conductive plugsSAMSUNG ELECTRONICS CO LTD·Filed 2000·Granted May 27, 2003·23 cites·21 claims
- 0674US6465337B1Methods of fabricating integrated circuit bonding pads including intermediate closed conductive layers having spaced apart insulating islands thereinSAMSUNG ELECTRONICS CO LTD·Filed 2000·Granted Oct 15, 2002·18 cites·5 claims
- 0774US6184551B1Method of forming integrated circuit capacitors having electrodes therein that comprise conductive plugsSAMSUNG ELECTRONICS CO LTD·Filed 1998·Granted Feb 6, 2001·44 cites·4 claims
- 0874US6163074AIntegrated circuit bonding pads including intermediate closed conductive layers having spaced apart insulating islands thereinSAMSUNG ELECTRONICS CO LTD·Filed 1999·Granted Dec 19, 2000·39 cites·49 claims
- 0940US7534677B2Method of fabricating a dual gate oxideSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted May 19, 2009·0 cites·19 claims
- 1036US2001009802A1Method of forming integrated bonding pads including closed vias and closed conductive patternsFiled 2001·Application pending·0 cites
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