Inventor · disambiguated record
Yushin Takasawa
Also filed as: TAKASAWA YUSHIN
44 granted patents·7 pending applications·1,128 citations·filing 2001–2025
98Inventor score
Files withHITACHI INT ELECTRIC INC29HITACHI-KOKUSAI ELECTRIC INC4HIROSE YOSHIRO3KOKUSAI ELECTRIC CORP3OTA YOSUKE3
Top patents by PatentIndex Score
51 records- 0198US8415258B2Method of manufacturing semiconductor device, method of processing substrate and substrate processing apparatusAKAE NAONORI·Filed 2011·Granted Apr 9, 2013·480 cites·19 claims
- 0298US8076251B2Method of manufacturing semiconductor device, method of processing substrate and substrate processing apparatusAKAE NAONORI·Filed 2010·Granted Dec 13, 2011·489 cites·17 claims
- 0396US10026607B2Substrate processing apparatus for forming film including at least two different elementsHITACHI INT ELECTRIC INC·Filed 2016·Granted Jul 17, 2018·8 cites·21 claims
- 0494US9443720B2Method of manufacturing semiconductor device for forming film including at least two different elementsHITACHI-KOKUSAI ELECTRIC INC·Filed 2016·Granted Sep 13, 2016·6 cites·18 claims
- 0594US9385013B2Method and apparatus of manufacturing a semiconductor device by forming a film on a substrateHITACHI INT ELECTRIC INC·Filed 2016·Granted Jul 5, 2016·5 cites·9 claims
- 0694US9312123B2Method of manufacturing semiconductor device and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2015·Granted Apr 12, 2016·6 cites·9 claims
- 0793US9384972B2Method of manufacturing semiconductor device by forming a film on a substrateHITACHI INT ELECTRIC INC·Filed 2015·Granted Jul 5, 2016·5 cites·13 claims
- 0893US9384968B2Method of manufacturing a semiconductor device by forming a film on a substrateHITACHI INT ELECTRIC INC·Filed 2015·Granted Jul 5, 2016·5 cites·15 claims
- 0993US9384971B2Method of manufacturing semiconductor device by forming a film on a substrateHITACHI INT ELECTRIC INC·Filed 2015·Granted Jul 5, 2016·5 cites·14 claims
- 1093US9330904B2Method of manufacturing semiconductor device and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2015·Granted May 3, 2016·5 cites·15 claims
- 1192US9487861B2Substrate processing apparatus capable of forming films including at least two different elementsHITACHI-KOKUSAI ELECTRIC INC·Filed 2016·Granted Nov 8, 2016·4 cites·9 claims
- 1291US9478417B2Method of manufacturing semiconductor device for forming film including at least two different elementsHITACHI-KOKUSAI ELECTRIC INC·Filed 2016·Granted Oct 25, 2016·4 cites·18 claims
- 1391US9443719B2Method of manufacturing semiconductor device for forming film including at least two different elementsHITACHI-KOKUSAI ELECTRIC INC·Filed 2016·Granted Sep 13, 2016·4 cites·9 claims
- 1489US9318316B2Method of manufacturing semiconductor device, method of processing substrate and substrate processing apparatus for forming thin film containing at least two different elementsTAKASAWA YUSHIN·Filed 2009·Granted Apr 19, 2016·7 cites·16 claims
- 1589US9018104B2Method for manufacturing semiconductor device, method for processing substrate and substrate processing apparatusHIROSE YOSHIRO·Filed 2011·Granted Apr 28, 2015·8 cites·16 claims
- 1689US7884034B2Method of manufacturing semiconductor device and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2009·Granted Feb 8, 2011·20 cites·14 claims
- 1787US9384969B2Method of manufacturing semiconductor device by forming a film on a substrateHITACHI INT ELECTRIC INC·Filed 2015·Granted Jul 5, 2016·2 cites·14 claims
- 1887US9384970B2Method of manufacturing semiconductor device by forming a film on a substrateHITACHI INT ELECTRIC INC·Filed 2015·Granted Jul 5, 2016·2 cites·15 claims
- 1987US9384966B2Method of manufacturing a semiconductor device by forming a film on a substrateHITACHI INT ELECTRIC INC·Filed 2015·Granted Jul 5, 2016·2 cites·13 claims
- 2086US9384967B2Method of manufacturing a semiconductor device by forming a film on a substrateHITACHI INT ELECTRIC INC·Filed 2015·Granted Jul 5, 2016·2 cites·17 claims
- 2186US8546272B2Method of manufacturing semiconductor device, method of processing substrate and substrate processing apparatusHIROSE YOSHIRO·Filed 2011·Granted Oct 1, 2013·6 cites·9 claims
- 2284US9334567B2Method for manufacturing semiconductor device, method for processing substrate and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2015·Granted May 10, 2016·3 cites·14 claims
- 2384US8809204B2Method of manufacturing semiconductor device and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2012·Granted Aug 19, 2014·4 cites·25 claims
- 2483US9455137B2Method of manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2015·Granted Sep 27, 2016·3 cites·24 claims
- 2583US8367557B2Method of forming an insulation film having low impurity concentrationsHITACHI KOKOSAI ELECTRIC INC·Filed 2009·Granted Feb 5, 2013·8 cites·15 claims
- 2683US8202809B2Method of manufacturing semiconductor device, method of processing substrate, and substrate processing apparatusOTA YOSUKE·Filed 2010·Granted Jun 19, 2012·6 cites·16 claims
- 2782US10720325B2Method of manufacturing semiconductor device, substrate processing apparatus and non-transitory computer-readable recording mediumHITACHI INT ELECTRIC INC·Filed 2018·Granted Jul 21, 2020·3 cites·15 claims
- 2878US8409988B2Method of manufacturing semiconductor device and substrate processing apparatusTAKASAWA YUSHIN·Filed 2011·Granted Apr 2, 2013·4 cites·12 claims
- 2977US9011601B2Substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2014·Granted Apr 21, 2015·2 cites·14 claims
- 3076US8946092B2Method of manufacturing semiconductor device, method of processing substrate and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2013·Granted Feb 3, 2015·2 cites·19 claims
- 3173US8410001B2Method of manufacturing semiconductor device, method of processing substrate, and substrate processing apparatusTAKASAWA YUSHIN·Filed 2011·Granted Apr 2, 2013·3 cites·15 claims
- 3271US10604842B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2019·Granted Mar 31, 2020·1 cites·15 claims
- 3371US9269566B2Substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2015·Granted Feb 23, 2016·1 cites·15 claims
- 3471US2023343580A1Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2023·Application pending·0 cites
- 3569US8679989B2Method of manufacturing semiconductor device including removal of deposits from process chamber and supply portionNAKASHIMA SADAO·Filed 2007·Granted Mar 25, 2014·2 cites·20 claims
- 3669US8410003B2Method of manufacturing semiconductor device, method of processing substrate, and substrate processing apparatusOTA YOSUKE·Filed 2011·Granted Apr 2, 2013·3 cites·12 claims
- 3768US9217199B2Substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2015·Granted Dec 22, 2015·1 cites·15 claims
- 3866US2017200599A1Method of manufacturing semiconductor device and substrate processing apparatus for forming film including at least two different elementsHITACHI INT ELECTRIC INC·Filed 2017·Application pending·0 cites
- 3965US9378943B2Method of manufacturing semiconductor device, method of processing substrate substrate processing apparatus and non-transitory computer-readable recording mediumHIROSE YOSHIRO·Filed 2012·Granted Jun 28, 2016·1 cites·14 claims
- 4063US9136114B2Method of manufacturing semiconductor device, substrate processing method, computer-readable medium with program for executing a substrate processing method, and substrate processing apparatusSASAJIMA RYOTA·Filed 2011·Granted Sep 15, 2015·1 cites·14 claims
- 4157US11735412B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2018·Granted Aug 22, 2023·0 cites·18 claims
- 4257US2015101755A1Substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2014·Application pending·0 cites
- 4357US2025223690A1Method of processing substrate, method of manufacturing semiconductor device, recording medium, and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 4449US6943089B2Semiconductor device manufacturing method and semiconductor manufacturing apparatusKOKUSAI ELECTRIC CO LTD·Filed 2001·Granted Sep 13, 2005·4 cites·15 claims
- 4547US2009117714A1Method of producing semiconductor device, and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2008·Application pending·0 cites
- 4646US2008268644A1Manufacturing method of semiconductor device and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2008·Application pending·0 cites
- 4745US6821871B2Method for manufacturing semiconductor device, substrate treatment method, and semiconductor manufacturing apparatusHITACHI INT ELECTRIC INC·Filed 2001·Granted Nov 23, 2004·1 cites·12 claims
- 4845US2009114146A1Method for Manufacturing Semiconductor Device and Substrate Processing ApparatusHITACHI INT ELECTRIC INC·Filed 2006·Application pending·0 cites
- 4942US10290492B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2017·Granted May 14, 2019·0 cites·18 claims
- 5041US10586698B2Method of manufacturing semiconductor device, substrate processing apparatus and recording mediumHITACHI INT ELECTRIC INC·Filed 2017·Granted Mar 10, 2020·0 cites·16 claims
Showing the top 50 of 51 patent records by PatentIndex Score.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →