Inventor · disambiguated record
Hideki Hirotsuru
Also filed as: HIROTSURU HIDEKI
29 granted patents·2 pending applications·227 citations·filing 1990–2018
95Inventor score
Files withDENKA COMPANY LTD12DENKI KAGAKU KOGYO KK9HIROTSURU HIDEKI6NAT INST RES INORGANIC MAT2HIGUMA SATOSHI1
Top patents by PatentIndex Score
31 records- 0193US5591685ASuperplastic silicon carbide sintered bodyNAT INST RES INORGANIC MAT·Filed 1995·Granted Jan 7, 1997·105 cites·16 claims
- 0285US8546842B2LED chip assembly, LED package, and manufacturing method of LED packageHIGUMA SATOSHI·Filed 2010·Granted Oct 1, 2013·17 cites·18 claims
- 0381US10487013B2Ceramic resin composite bodyDENKA COMPANY LTD·Filed 2017·Granted Nov 26, 2019·2 cites·10 claims
- 0474US9516741B2Boron nitride/resin composite circuit board, and circuit board including boron nitride/resin composite integrated with heat radiation plateDENKA COMPANY LTD·Filed 2014·Granted Dec 6, 2016·3 cites·13 claims
- 0573US8890189B2Wafer for LED mounting, method for manufacturing same, and LED-mounted structure using the waferHIROTSURU HIDEKI·Filed 2010·Granted Nov 18, 2014·2 cites·19 claims
- 0671US6399187B1Metal-ceramics composite, heat dissipation device employing it, and processes for producing themDENKI KAGAKU KOGYO KK·Filed 2000·Granted Jun 4, 2002·18 cites·13 claims
- 0770US8883564B2Substrate comprising aluminum/graphite composite, heat dissipation part comprising same, and LED luminescent memberHIROTSURU HIDEKI·Filed 2010·Granted Nov 11, 2014·4 cites·10 claims
- 0869US7130174B2Integral-type ceramic circuit board and method of producing sameDENKI KAGAKU KOGYO KK·Filed 2001·Granted Oct 31, 2006·14 cites·11 claims
- 0968US8322398B2Manufacturing method of aluminum-diamond compositeHIROTSURU HIDEKI·Filed 2009·Granted Dec 4, 2012·4 cites·7 claims
- 1067US6447894B1Silicon carbide composite, method for producing it and heat dissipation device employing itDENKI KAGAKU KOGYO KK·Filed 1999·Granted Sep 10, 2002·36 cites·11 claims
- 1163US7993728B2Aluminum/silicon carbide composite and radiating part comprising the sameDENKI KAGAKU KOGYO KK·Filed 2007·Granted Aug 9, 2011·3 cites·13 claims
- 1262US10615096B2Heat dissipation structure for electric circuit deviceDENKA COMPANY LTD·Filed 2017·Granted Apr 7, 2020·1 cites·4 claims
- 1362US7207105B2Method for producing an integral ceramic circuit boardDENKI KAGAKU KOGYO KK·Filed 2005·Granted Apr 24, 2007·2 cites·8 claims
- 1459US11296008B2Aluminum-silicon carbide composite and production method thereforDENKA COMPANY LTD·Filed 2015·Granted Apr 5, 2022·1 cites·8 claims
- 1559US10233125B2Aluminium-silicon carbide composite, and power-module base plateDENKA COMPANY LTD·Filed 2015·Granted Mar 19, 2019·1 cites·8 claims
- 1658US9017824B2Aluminum-diamond composite and manufacturing methodHIROTSURU HIDEKI·Filed 2009·Granted Apr 28, 2015·1 cites·10 claims
- 1757US8025962B2Aluminum-silicon carbide composite and heat dissipation device employing the sameDENKI KAGAKU KOGYO KK·Filed 2006·Granted Sep 27, 2011·1 cites·18 claims
- 1855US10081055B2Composite body and method for producing sameDENKA COMPANY LTD·Filed 2015·Granted Sep 25, 2018·0 cites·13 claims
- 1948US11096278B2Ceramic circuit boardDENKA COMPANY LTD·Filed 2018·Granted Aug 17, 2021·0 cites·11 claims
- 2048US10087112B2Resin-impregnated boron nitride sintered body and use for sameDENKA COMPANY LTD·Filed 2014·Granted Oct 2, 2018·0 cites·8 claims
- 2146US9387532B2Composite substrate for LED light emitting element, method of production of same, and LED light emitting elementHIROTSURU HIDEKI·Filed 2010·Granted Jul 12, 2016·0 cites·13 claims
- 2244US5126295ASilicon nitride powder, silicon nitride sintered body and processes for their productionDENKI KAGAKU KOGYO KK·Filed 1990·Granted Jun 30, 1992·9 cites·21 claims
- 2343US10377676B2Resin-impregnated boron nitride sintered body and use for sameDENKA COMPANY LTD·Filed 2016·Granted Aug 13, 2019·0 cites·6 claims
- 2443US9524918B2Heat dissipating component for semiconductor elementHIROTSURU HIDEKI·Filed 2012·Granted Dec 20, 2016·0 cites·9 claims
- 2542US9879168B2Method for producing hexagonal boron nitride, and heat dissipation sheetDENKA COMPANY LTD·Filed 2015·Granted Jan 30, 2018·0 cites·5 claims
- 2642US9299888B2Clad material for LED light-emitting element holding substrate, and method for manufacturing sameISHIHARA YOSUKE·Filed 2012·Granted Mar 29, 2016·0 cites·13 claims
- 2740US2009075056A1Aluminum-silicon carbide composite body and method for processing the sameDENKI KAGAKU KOGYO KK·Filed 2007·Application pending·0 cites
- 2838US11094648B2Power moduleDENKA COMPANY LTD·Filed 2018·Granted Aug 17, 2021·0 cites·8 claims
- 2932US7838107B2Aluminum-silicon carbide compositeDENKI KAGAKU KOGYO KK·Filed 2005·Granted Nov 23, 2010·0 cites·11 claims
- 3031US5672553ASuperplastic silicon nitride sintered bodyNAT INST RES INORGANIC MAT·Filed 1996·Granted Sep 30, 1997·3 cites·6 claims
- 3131US2017162469A1Silicon carbide complex, method for manufacturing same, and heat dissipation component using sameDENKA COMPANY LTD·Filed 2015·Application pending·0 cites
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