Inventor · disambiguated record
Ruey Kae Zang
Also filed as: ZANG RUEY KAE
5 granted patents·8 pending applications·32 citations·filing 2009–2018
75Inventor score
Technology areasH10W
Top patents by PatentIndex Score
13 records- 0188US10321575B2Integrated circuit (IC) module comprising an integrated circuit (IC) package and an interposer with embedded passive componentsQUALCOMM INC·Filed 2015·Granted Jun 11, 2019·8 cites·26 claims
- 0285US8952552B2Semiconductor package assembly systems and methods using DAM and trench structuresZANG RUEY KAE·Filed 2009·Granted Feb 10, 2015·20 cites·12 claims
- 0370US9041176B2Hybrid semiconductor module structureQUALCOMM INC·Filed 2013·Granted May 26, 2015·3 cites·30 claims
- 0459US10231324B2Staggered power structure in a power distribution network (PDN)QUALCOMM INC·Filed 2014·Granted Mar 12, 2019·1 cites·30 claims
- 0547US2019043817A1Land grid based multi size pad packageQUALCOMM INC·Filed 2018·Application pending·0 cites
- 0643US2015228594A1Via under the interconnect structures for semiconductor devicesQUALCOMM INC·Filed 2014·Application pending·0 cites
- 0743US2018053740A1Land grid based multi size pad packageQUALCOMM INC·Filed 2016·Application pending·0 cites
- 0840US2015364438A1Balanced current distribution structure for large current deliveryQUALCOMM INC·Filed 2014·Application pending·0 cites
- 0938US2010270061A1Floating Metal Elements in a Package SubstrateQUALCOMM INC·Filed 2009·Application pending·0 cites
- 1038US2010263914A1Floating Metal Elements in a Package SubstrateQUALCOMM INC·Filed 2009·Application pending·0 cites
- 1132US2017084594A1Embedding die technologyQUALCOMM INC·Filed 2015·Application pending·0 cites
- 1232US2017373032A1Redistribution layer (rdl) fan-out wafer level packaging (fowlp) structureQUALCOMM INC·Filed 2016·Application pending·0 cites
- 1330US8890143B2Method to optimize and reduce integrated circuit, package design, and verification cycle timeLANE RYAN D·Filed 2010·Granted Nov 18, 2014·0 cites·27 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →