Inventor · disambiguated record
Ryan David Lane
Also filed as: LANE RYAN · LANE RYAN D · LANE RYAN DAVID
30 granted patents·18 pending applications·273 citations·filing 2003–2024
96Inventor score
Top patents by PatentIndex Score
48 records- 0197US9379090B1System, apparatus, and method for split die interconnectionQUALCOMM INC·Filed 2015·Granted Jun 28, 2016·43 cites·27 claims
- 0296US9263186B2DC/ AC dual function Power Delivery Network (PDN) decoupling capacitorQUALCOMM INC·Filed 2013·Granted Feb 16, 2016·38 cites·34 claims
- 0393US11452246B2Patch substrate configured as a shield located over a cavity of a boardQUALCOMM INC·Filed 2020·Granted Sep 20, 2022·5 cites·23 claims
- 0492US6762495B1Area array package with non-electrically connected solder ballsQUALCOMM INC·Filed 2003·Granted Jul 13, 2004·98 cites·15 claims
- 0590US9577025B2Metal-insulator-metal (MIM) capacitor in redistribution layer (RDL) of an integrated deviceQUALCOMM INC·Filed 2014·Granted Feb 21, 2017·13 cites·32 claims
- 0690US9209131B2Toroid inductor in redistribution layers (RDL) of an integrated deviceQUALCOMM INC·Filed 2014·Granted Dec 8, 2015·11 cites·20 claims
- 0788US10321575B2Integrated circuit (IC) module comprising an integrated circuit (IC) package and an interposer with embedded passive componentsQUALCOMM INC·Filed 2015·Granted Jun 11, 2019·8 cites·26 claims
- 0886US7728564B2Power supply for a load control deviceLUTRON ELECTRONICS CO·Filed 2007·Granted Jun 1, 2010·17 cites·25 claims
- 0985US9368566B2Package on package (PoP) integrated device comprising a capacitor in a substrateQUALCOMM INC·Filed 2014·Granted Jun 14, 2016·7 cites·20 claims
- 1081US9035421B2High quality factor inductor implemented in wafer level packaging (WLP)QUALCOMM INC·Filed 2013·Granted May 19, 2015·5 cites·54 claims
- 1178US9131634B2Radio frequency package on package circuitQUALCOMM INC·Filed 2012·Granted Sep 8, 2015·5 cites·53 claims
- 1277US10008316B2Inductor embedded in a package substrateQUALCOMM INC·Filed 2014·Granted Jun 26, 2018·4 cites·27 claims
- 1371US10170232B2Toroid inductor with reduced electromagnetic field leakageQUALCOMM INC·Filed 2015·Granted Jan 1, 2019·1 cites·16 claims
- 1468US9153560B2Package on package (PoP) integrated device comprising a redistribution layerQUALCOMM INC·Filed 2014·Granted Oct 6, 2015·2 cites·19 claims
- 1563US9484281B2Systems and methods for thermal dissipationQUALCOMM INC·Filed 2014·Granted Nov 1, 2016·1 cites·20 claims
- 1663US9245940B2Inductor design on floating UBM balls for wafer level package (WLP)QUALCOMM INC·Filed 2014·Granted Jan 26, 2016·1 cites·23 claims
- 1762US2025379135A1Package comprising an integrated device and an offset memory deviceQUALCOMM INC·Filed 2024·Application pending·0 cites
- 1861US9514966B2Apparatus and methods for shielding differential signal pin pairsQUALCOMM INC·Filed 2014·Granted Dec 6, 2016·1 cites·15 claims
- 1961US8803305B2Hybrid package construction with wire bond and through silicon viasRADOJCIC RATIBOR·Filed 2009·Granted Aug 12, 2014·3 cites·20 claims
- 2061US2025343176A1Package comprising an interposer package with metallization portions, and a passive device and a bridge between the metallization portionsQUALCOMM INC·Filed 2024·Application pending·0 cites
- 2160US2025246582A1Stacked integrated circuit devices including logic die and memory stacksQUALCOMM INC·Filed 2024·Application pending·0 cites
- 2260US2025201786A1Package comprising integrated devices and a passive deviceQUALCOMM INC·Filed 2023·Application pending·0 cites
- 2359US10231324B2Staggered power structure in a power distribution network (PDN)QUALCOMM INC·Filed 2014·Granted Mar 12, 2019·1 cites·30 claims
- 2458US12160952B2Providing a lower inductance path in a routing substrate for a capacitor, and related electronic devices and fabrication methodsQUALCOMM INC·Filed 2022·Granted Dec 3, 2024·0 cites·28 claims
- 2558US2025293112A1Package comprising substrates, integrated devices and a heat sinkQUALCOMM INC·Filed 2024·Application pending·0 cites
- 2657US2025062285A1Stacked integrated circuit devicesQUALCOMM INC·Filed 2023·Application pending·0 cites
- 2757US2025069965A1Package comprising a substrate with an embedded frameQUALCOMM INC·Filed 2023·Application pending·0 cites
- 2856US2024371736A1Substrate employing core with cavity embedding reduced height electrical device(s), and related integrated circuit (ic) packages and fabrication methodsQUALCOMM INC·Filed 2023·Application pending·0 cites
- 2956US2025096207A1Package comprising a bridge located between metallization portionsQUALCOMM INC·Filed 2023·Application pending·0 cites
- 3056US2024421128A1Semiconductor device with multiple stacked passive devicesQUALCOMM INC·Filed 2023·Application pending·0 cites
- 3154US2024071993A1Package comprising a chiplet located between two metallization portionsQUALCOMM INC·Filed 2022·Application pending·0 cites
- 3254US2024072032A1Package comprising a chiplet located between an integrated device and a metallization portionQUALCOMM INC·Filed 2022·Application pending·0 cites
- 3353US9449762B2Embedded package substrate capacitor with configurable/controllable equivalent series resistanceQUALCOMM INC·Filed 2014·Granted Sep 20, 2016·0 cites·9 claims
- 3452US11605594B2Package comprising a substrate and a high-density interconnect integrated device coupled to the substrateQUALCOMM INC·Filed 2020·Granted Mar 14, 2023·0 cites·26 claims
- 3552US9373583B2High quality factor filter implemented in wafer level packaging (WLP) integrated deviceQUALCOMM INC·Filed 2014·Granted Jun 21, 2016·0 cites·45 claims
- 3652US6891275B2Method for accommodating small minimum die in wire bonded area array packagesQUALCOMM INC·Filed 2003·Granted May 10, 2005·5 cites·12 claims
- 3752US2024038831A1Package with a substrate comprising embedded stacked trench capacitor devicesQUALCOMM INC·Filed 2022·Application pending·0 cites
- 3850US11784157B2Package comprising integrated devices coupled through a metallization layerQUALCOMM INC·Filed 2021·Granted Oct 10, 2023·0 cites·33 claims
- 3948US9324779B2Toroid inductor in an integrated deviceQUALCOMM INC·Filed 2013·Granted Apr 26, 2016·0 cites·30 claims
- 4048US2015092314A1Connector placement for a substrate integrated with a toroidal inductorQUALCOMM INC·Filed 2013·Application pending·0 cites
- 4147US9362218B2Integrated passive device (IPD) on substrateQUALCOMM INC·Filed 2013·Granted Jun 7, 2016·0 cites·30 claims
- 4247US7612449B2Optimized power delivery to high speed, high pin-count devicesQUALCOMM INC·Filed 2004·Granted Nov 3, 2009·4 cites·16 claims
- 4347US2021375845A1Package cavity for enhanced device performance with an integrated passive deviceQUALCOMM INC·Filed 2020·Application pending·0 cites
- 4445US10051741B2Embedded layered inductorQUALCOMM INC·Filed 2013·Granted Aug 14, 2018·0 cites·13 claims
- 4540US2015372425A1Custom orientation of socket pins to achieve high isolation between channels without adding extra reference pinsQUALCOMM INC·Filed 2014·Application pending·0 cites
- 4636US2004195703A1Method for accommodating small minimum die in wire bonded area array packagesFiled 2004·Application pending·0 cites
- 4730US8890143B2Method to optimize and reduce integrated circuit, package design, and verification cycle timeLANE RYAN D·Filed 2010·Granted Nov 18, 2014·0 cites·27 claims
- 4829US2019139852A1Embedded thermal enhancement structures for molded integrated circuit packagesQUALCOMM INC·Filed 2017·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →