Inventor · disambiguated record
Kazuhito Hosokawa
Also filed as: HOSOKAWA KAZUHITO
37 granted patents·10 pending applications·193 citations·filing 1997–2023
97Inventor score
Files withNITTO DENKO CORP36DAINIPPON PRINTING CO LTD3MATSUMURA TAKESHI2MISUMI SADAHITO2C/O NITTO DENKO CORP1
Top patents by PatentIndex Score
47 records- 0194US11241863B2Glass roll with resin filmNITTO DENKO CORP·Filed 2017·Granted Feb 8, 2022·5 cites·11 claims
- 0291US7262514B2Epoxy resin composition for semiconductor encapsulation, semiconductor device using the same, and process for producing semiconductor deviceNITTO DENKO CORP·Filed 2005·Granted Aug 28, 2007·25 cites·8 claims
- 0388US7235888B2Method for manufacturing semiconductor device, adhesive sheet for use therein and semiconductor deviceNITTO DENKO CORP·Filed 2005·Granted Jun 26, 2007·15 cites·13 claims
- 0486US12311645B2Glass film-resin compositeNITTO DENKO CORP·Filed 2023·Granted May 27, 2025·0 cites·10 claims
- 0586US11198274B2Optical laminate having thin glass, polarizer, and protective film with specified modulus of elasticityNITTO DENKO CORP·Filed 2016·Granted Dec 14, 2021·2 cites·3 claims
- 0684US7365441B2Semiconductor device fabricating apparatus and semiconductor device fabricating methodDAINIPPON PRINTING CO LTD·Filed 2006·Granted Apr 29, 2008·15 cites·3 claims
- 0783US10960610B2Production method for film laminateNITTO DENKO CORP·Filed 2017·Granted Mar 30, 2021·1 cites·7 claims
- 0882US11738534B2Glass film-resin compositeNITTO DENKO CORP·Filed 2017·Granted Aug 29, 2023·1 cites·8 claims
- 0979US8278153B2Manufacturing method of semiconductor device, adhesive sheet used therein, and semiconductor device obtained therebyMISUMI SADAHITO·Filed 2010·Granted Oct 2, 2012·4 cites·16 claims
- 1079US7772040B2Manufacturing method of semiconductor device, adhesive sheet used therein, and semiconductor device obtained therebyNITTO DENKO CORP·Filed 2007·Granted Aug 10, 2010·6 cites·16 claims
- 1178US11926140B2Glass roll with resin filmNITTO DENKO CORP·Filed 2021·Granted Mar 12, 2024·0 cites·19 claims
- 1276US7064011B2Semiconductor device fabricating apparatus and semiconductor device fabricating methodNITTO DENKO CORP·Filed 2004·Granted Jun 20, 2006·21 cites·9 claims
- 1375US11999133B2Manufacturing method for glass film with resin tape, and manufacturing method for glass filmNITTO DENKO CORP·Filed 2022·Granted Jun 4, 2024·0 cites·10 claims
- 1475US10859871B2Optical member, and polarizing plate set and liquid crystal display device that use said optical memberNITTO DENKO CORP·Filed 2016·Granted Dec 8, 2020·1 cites·20 claims
- 1574US11731412B2Production method for film laminateNITTO DENKO CORP·Filed 2021·Granted Aug 22, 2023·0 cites·7 claims
- 1671US10809433B2Circularly polarizing plate for organic EL display device, and organic EL display deviceNITTO DENKO CORP·Filed 2016·Granted Oct 20, 2020·1 cites·4 claims
- 1769US6312799B1Pressure-sensitive acrylic adhesive composition for adhesion of polyester film and adhesive sheets thereofNITTO DENKO CORP·Filed 2000·Granted Nov 6, 2001·9 cites·10 claims
- 1868US7232709B2Process for producing a semiconductor deviceNITTO DENKO CORP·Filed 2004·Granted Jun 19, 2007·14 cites·15 claims
- 1965US8018044B2Semiconductor device, substrate for producing semiconductor device and method of producing themDAINIPPON PRINTING CO LTD·Filed 2005·Granted Sep 13, 2011·3 cites·6 claims
- 2064US6858473B2Method for manufacturing semiconductor device, adhesive sheet for use therein and semiconductor deviceNITTO DENKO CORP·Filed 2003·Granted Feb 22, 2005·12 cites·14 claims
- 2164US2021027970A1Optical member, and backlight unit and liquid crystal display device using said optical memberNITTO DENKO CORP·Filed 2020·Application pending·0 cites
- 2263US7132755B2Adhesive film for manufacturing semiconductor deviceNITTO DENKO CORP·Filed 2004·Granted Nov 7, 2006·11 cites·9 claims
- 2363US7115989B2Adhesive sheet for producing a semiconductor deviceNITTO DENKO CORP·Filed 2004·Granted Oct 3, 2006·10 cites·19 claims
- 2463US2019051484A1Optical member, and backlight unit and liquid crystal display device using said optical memberNITTO DENKO CORP·Filed 2017·Application pending·0 cites
- 2560US8962379B2Method of producing CIGS film, and method of producing CIGS solar cell by using sameNISHII HIROTO·Filed 2012·Granted Feb 24, 2015·1 cites·6 claims
- 2657US2019292086A1Manufacturing method for glass film with resin tape, and manufacturing method for glass filmNITTO DENKO CORP·Filed 2017·Application pending·0 cites
- 2753US8975759B2Manufacturing method of semiconductor device, adhesive sheet used therein, and semiconductor device obtained therebyMISUMI SADAHITO·Filed 2012·Granted Mar 10, 2015·0 cites·7 claims
- 2852US6211261B1Thermosetting pressure-sensitive adhesive and adhesive sheet thereofNITTO DENKO CORP·Filed 1999·Granted Apr 3, 2001·18 cites·12 claims
- 2951US11536877B2Laminated optical film, method of producing laminated optical film, optical element, and image displayNITTO DENKO CORP·Filed 2016·Granted Dec 27, 2022·0 cites·12 claims
- 3051US10741776B2Flexible light-emitting device, lighting apparatus, and image displayNITTO DENKO CORP·Filed 2016·Granted Aug 11, 2020·0 cites·7 claims
- 3150US10678083B2Optical member comprising a polarizing plate and a low-refractive index layer having a porous layerNITTO DENKO CORP·Filed 2017·Granted Jun 9, 2020·0 cites·11 claims
- 3250US2009001611A1Adhesive sheet for manufacturing semiconductor device, manufacturing method of semiconductor device using the sheet, and semiconductor device obtained by the methodMATSUMURA TAKESHI·Filed 2007·Application pending·0 cites
- 3350US2019275778A1Production method for film laminateNITTO DENKO CORP·Filed 2017·Application pending·0 cites
- 3448US10688759B2Method for manufacturing optical laminateNITTO DENKO CORP·Filed 2016·Granted Jun 23, 2020·0 cites·19 claims
- 3548US10302994B2Optical memberNITTO DENKO CORP·Filed 2017·Granted May 28, 2019·0 cites·6 claims
- 3648US9153556B2Adhesive sheet for manufacturing semiconductor device, manufacturing method of semiconductor device using the sheet, and semiconductor device obtained by the methodMATSUMURA TAKESHI·Filed 2010·Granted Oct 6, 2015·0 cites·2 claims
- 3746US9147861B2Surface light-emitting objectNAGASE JUNICHI·Filed 2012·Granted Sep 29, 2015·0 cites·8 claims
- 3845US11524481B2Low refractive index layer, laminated film, method for producing low refractive index layer, method for producing laminated film, optical element, and image display deviceNITTO DENKO CORP·Filed 2016·Granted Dec 13, 2022·0 cites·17 claims
- 3945US2020301207A1Optical member, backlight unit using said optical member, and liquid crystal display deviceNITTO DENKO CORP·Filed 2017·Application pending·0 cites
- 4044US8525351B2Semiconductor device, substrate for producing semiconductor device and method of producing themIKENAGA CHIKAO·Filed 2011·Granted Sep 3, 2013·0 cites·6 claims
- 4144US2019092983A1Adhesive tape having wavelength conversion functionNITTO DENKO CORP·Filed 2017·Application pending·0 cites
- 4244US2018207906A1Production method for optical laminateC/O NITTO DENKO CORP·Filed 2016·Application pending·0 cites
- 4343US6130269APressure-sensitive adhesive of (meth)acrylate, unsaturated acid, poly(meth)acrylate and epoxy resinNITTO DENKO CORP·Filed 1997·Granted Oct 10, 2000·12 cites·8 claims
- 4440US2019113664A1Optical member, backlight unit using said optical member, and liquid crystal display deviceNITTO DENKO CORP·Filed 2017·Application pending·0 cites
- 4539US7943427B2Semiconductor device, substrate for producing semiconductor device and method of producing themDAINIPPON PRINTING CO LTD·Filed 2005·Granted May 17, 2011·0 cites·3 claims
- 4639US2018246373A1Liquid crystal display deviceNITTO DENKO CORP·Filed 2016·Application pending·0 cites
- 4735US6261685B1Thermosetting adhesive and adhesive sheet thereofNITTO DENKO CORP·Filed 1999·Granted Jul 17, 2001·6 cites·14 claims
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