Inventor · disambiguated record
Yen-Yi Wu
Also filed as: WU YEN-YI
4 granted patents·4 pending applications·193 citations·filing 2007–2024
76Inventor score
Top patents by PatentIndex Score
8 records- 0196US7642133B2Method of making a semiconductor package and method of making a semiconductor deviceADVANCED SEMICONDUCTOR ENG·Filed 2007·Granted Jan 5, 2010·183 cites·25 claims
- 0288US10275559B2Method for legalizing mixed-cell height standard cells of ICTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 30, 2019·6 cites·20 claims
- 0365US7635917B2Three-dimensional package and method of making the sameADVANCED SEMICONDUCTOR ENG·Filed 2007·Granted Dec 22, 2009·4 cites·13 claims
- 0460US10713410B2Method for legalizing mixed-cell height standard cells of ICTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jul 14, 2020·0 cites·20 claims
- 0551US2025299351A1Depth seed fusion for depth estimationQUALCOMM INC·Filed 2024·Application pending·0 cites
- 0648US2014312496A1Semiconductor package and semiconductor deviceADVANCED SEMICONDUCTOR ENG·Filed 2014·Application pending·0 cites
- 0742US2024185536A1Object depth estimation processes within imaging devicesQUALCOMM INC·Filed 2022·Application pending·0 cites
- 0840US2008164595A1Stackable semiconductor package and the method for making the sameADVANCED SEMICONDUCTOR ENG·Filed 2008·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →