Inventor · disambiguated record
Akihisa Kuroyanagi
Also filed as: KUROYANAGI AKIHISA
9 granted patents·1 pending application·17 citations·filing 2001–2020
83Inventor score
Technology areasH10W
Top patents by PatentIndex Score
10 records- 0186US10504836B2Fan-out semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Dec 10, 2019·5 cites·20 claims
- 0275US10541187B2Semiconductor package including organic interposerSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Jan 21, 2020·2 cites·18 claims
- 0374US10475776B2Fan-out semiconductor package moduleSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Nov 12, 2019·2 cites·28 claims
- 0469US11195790B2Fan-out semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Dec 7, 2021·1 cites·17 claims
- 0561US10854528B2Semiconductor package including organic interposerSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Dec 1, 2020·0 cites·20 claims
- 0649US6852263B2Semiconductor device and process for producing the same, and tablet comprising epoxy resin compositionNITTO DENKO CORP·Filed 2003·Granted Feb 8, 2005·4 cites·6 claims
- 0746US6646063B2Semiconductor device and process for producing the same, and tablet comprising epoxy resin compositionNITTO DENKO CORP·Filed 2001·Granted Nov 11, 2003·3 cites·10 claims
- 0843US10692791B2Electronic component package with electromagnetic wave shieldingSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Jun 23, 2020·0 cites·20 claims
- 0938US6933618B2Tablet comprising epoxy resin compositionNITTO DENKO CORP·Filed 2004·Granted Aug 23, 2005·0 cites·2 claims
- 1024US2007049679A1Fly ash powder and production method thereof and resin composition for semiconductor encapsulation and semiconductor device using the sameNITTO DENKO CORP·Filed 2004·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →