Inventor · disambiguated record
Baik Woo Lee
Also filed as: LEE BAIK-WOO
18 granted patents·8 pending applications·97 citations·filing 2006–2025
92Inventor score
Top patents by PatentIndex Score
26 records- 0193US8872041B2Multilayer laminate package and method of manufacturing the sameLEE BAIK-WOO·Filed 2011·Granted Oct 28, 2014·24 cites·23 claims
- 0291US8861205B2Folded stacked package and method of manufacturing the sameLEE BAIK-WOO·Filed 2011·Granted Oct 14, 2014·18 cites·20 claims
- 0388US10074799B2Magneto-resistive chip package including shielding structureJANG JAE GWON·Filed 2016·Granted Sep 11, 2018·7 cites·19 claims
- 0488US8335084B2Embedded actives and discrete passives in a cavity within build-up layersLEE BAIK-WOO·Filed 2006·Granted Dec 18, 2012·27 cites·9 claims
- 0586US9431374B2Semiconductor packageLEE BAIK-WOO·Filed 2015·Granted Aug 30, 2016·6 cites·19 claims
- 0685US9893020B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Feb 13, 2018·5 cites·10 claims
- 0784US2025332613A1Chip-on-array with interposer for a multidimensional transducer arraySIEMENS MEDICAL SOLUTIONS USA INC·Filed 2025·Application pending·0 cites
- 0883US9775230B2Printed circuit board and semiconductor packages including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Sep 26, 2017·4 cites·20 claims
- 0976US12370576B2Chip-on-array with interposer for a multidimensional transducer arraySIEMENS MEDICAL SOLUTIONS USA INC·Filed 2022·Granted Jul 29, 2025·0 cites·15 claims
- 1076US9627327B2Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Apr 18, 2017·2 cites·13 claims
- 1174US11965961B2Direct chip-on-array for a multidimensional transducer arraySIEMENS MEDICAL SOLUTIONS USA INC·Filed 2023·Granted Apr 23, 2024·0 cites·20 claims
- 1270US9082693B2Nitride semiconductor based power converting deviceSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Jul 14, 2015·2 cites·16 claims
- 1368US8963325B2Power device and power device moduleSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Feb 24, 2015·2 cites·30 claims
- 1464US11656355B2Direct chip-on-array for a multidimensional transducer arraySIEMENS MEDICAL SOLUTIONS USA INC·Filed 2020·Granted May 23, 2023·0 cites·20 claims
- 1559US11498096B2Chip-on-array with interposer for a multidimensional transducer arraySIEMENS MEDICAL SOLUTIONS USA INC·Filed 2018·Granted Nov 15, 2022·0 cites·16 claims
- 1657US2024215951A1Connection for a multi-dimensional matrix transducerSIEMENS MEDICAL SOLUTIONS USA INC·Filed 2023·Application pending·0 cites
- 1753US10923650B2Magneto-resistive chip package including shielding structureSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Feb 16, 2021·0 cites·20 claims
- 1851US11101424B2Ultrasound transducer and manufacturing method thereofSIEMENS MEDICAL SOLUTIONS USA INC·Filed 2018·Granted Aug 24, 2021·0 cites·16 claims
- 1951US9520377B2Semiconductor device package including bonding layer having Ag3SnSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Dec 13, 2016·0 cites·17 claims
- 2048US9087833B2Power semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Jul 21, 2015·0 cites·14 claims
- 2148US2021138506A1Interposer for an Ultrasound Transducer ArraySIEMENS MEDICAL SOLUTIONS USA INC·Filed 2019·Application pending·0 cites
- 2243US2015001726A1Power semiconductor moduleSAMSUNG ELECTRONICS CO LTD·Filed 2013·Application pending·0 cites
- 2340US2013026655A1Chip package structure and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2012·Application pending·0 cites
- 2436US2017294407A1Passive element package and semiconductor module comprising the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Application pending·0 cites
- 2535US2016276288A1Semiconductor package and semiconductor device including electromagnetic wave shield layerSAMSUNG ELECTRONICS CO LTD·Filed 2015·Application pending·0 cites
- 2633US2006258327A1Organic based dielectric materials and methods for minaturized RF components, and low temperature coefficient of permittivity composite devices having tailored filler materialsLEE BAIK-WOO·Filed 2006·Application pending·0 cites
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