Inventor · disambiguated record
Hsien-Chieh Lin
Also filed as: LIN HSIEN-CHIEH
9 granted patents·2 pending applications·49 citations·filing 2007–2019
83Inventor score
Files withNAN YA PRINTED CIRCUIT BOARD C3LIN HSIEN-CHIEH2NAN YA PRINTED CIRCUIT BOARD2TATUNG CO2LO HSING-LUN1
Top patents by PatentIndex Score
11 records- 0185US7528482B2Embedded chip package with improved heat dissipation performance and method of making the sameNAN YA PRINTED CIRCUIT BOARD C·Filed 2007·Granted May 5, 2009·18 cites·11 claims
- 0284US8420954B2Printed circuit board and method for fabricating the sameLIN HSIEN-CHIEH·Filed 2010·Granted Apr 16, 2013·21 cites·16 claims
- 0375US7521800B2Solder pad and method of making the sameNAN YA PRINTED CIRCUIT BOARD C·Filed 2007·Granted Apr 21, 2009·9 cites·19 claims
- 0453US7576287B2Lot traceable printed circuit boardNAN YA PRINTED CIRCUIT BOARD C·Filed 2007·Granted Aug 18, 2009·1 cites·7 claims
- 0549US10798828B2Circuit board structures and methods of fabricating the sameNAN YA PRINTED CIRCUIT BOARD CORP·Filed 2019·Granted Oct 6, 2020·0 cites·16 claims
- 0649US8378225B2Printed circuit board and method for fabricating the sameNAN YA PRINTED CIRCUIT BOARD·Filed 2009·Granted Feb 19, 2013·0 cites·19 claims
- 0747US10236395B2Antireflection substrate structure and manufacturing method thereofTATUNG CO·Filed 2015·Granted Mar 19, 2019·0 cites·5 claims
- 0847US9224893B2Antireflection substrate structure and manufacturing method thereofTATUNG CO·Filed 2013·Granted Dec 29, 2015·0 cites·14 claims
- 0945US8243464B2Printed circuit board structureLIN HSIEN-CHIEH·Filed 2009·Granted Aug 14, 2012·0 cites·7 claims
- 1036US2008315398A1Packaging substrate with embedded chip and buried heatsinkLO HSING-LUN·Filed 2007·Application pending·0 cites
- 1133US2011220403A1Side packaged type printed circuit boardNAN YA PRINTED CIRCUIT BOARD·Filed 2010·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →