Inventor · disambiguated record
Xun Gu
Also filed as: GU XUN · GU XUN W
18 granted patents·4 pending applications·20 citations·filing 2009–2022
88Inventor score
Files withTOKYO ELECTRON LTD3ABB POWER GRIDS SWITZERLAND AG2ABB RESEARCH LTD2ABB SCHWEIZ AG2CALIFORNIA INST OF TECHN2
Top patents by PatentIndex Score
22 records- 0189US10804197B1Memory die containing stress reducing backside contact via structures and method of making the sameSANDISK TECHNOLOGIES LLC·Filed 2019·Granted Oct 13, 2020·9 cites·19 claims
- 0285US10302411B2Closed-loop interferometric sensor using loop gain for determining interference contrastABB SCHWEIZ AG·Filed 2017·Granted May 28, 2019·4 cites·20 claims
- 0384US9581622B2Temperature compensated fiber-optic current sensorABB RESEARCH LTD·Filed 2015·Granted Feb 28, 2017·3 cites·20 claims
- 0477US10553875B2Use and fabrication of microscaffolds and nanoscaffoldsCALIFORNIA INST OF TECHN·Filed 2014·Granted Feb 4, 2020·3 cites·17 claims
- 0569US11658305B2Use and fabrication of microscaffolds and nanoscaffoldsCALIFORNIA INST OF TECHN·Filed 2020·Granted May 23, 2023·0 cites·11 claims
- 0666US10416198B2Gas-tight compartment and optical voltage sensor with coated electro-optic crystalABB SCHWEIZ AG·Filed 2017·Granted Sep 17, 2019·1 cites·28 claims
- 0755US11938536B2Nanotextured metal powders for 3D printing of metalsUNIV LELAND STANFORD JUNIOR·Filed 2022·Granted Mar 26, 2024·0 cites·8 claims
- 0854US12233462B2Solution processed metallic nano-glass filmsUNIV LELAND STANFORD JUNIOR·Filed 2020·Granted Feb 25, 2025·0 cites·4 claims
- 0950US2023049723A1Integrated CircuitHUAWEI TECH CO LTD·Filed 2022·Application pending·0 cites
- 1046US11966079B2Spliced optical fiber with splice protection, current sensor with such spliced optical fiber and method for protecting a spliced optical fiberHITACHI ENERGY LTD·Filed 2019·Granted Apr 23, 2024·0 cites·20 claims
- 1146US2010240283A1Method of Chemical Mechanical PolishingARACA INC·Filed 2009·Application pending·0 cites
- 1245US11611041B2Organic thin film having isomerization generating layer and method for preparing the same, display device and optical deviceHEFEI BOE OPTOELECTRONICS TECH·Filed 2019·Granted Mar 21, 2023·0 cites·19 claims
- 1345US11047885B2Sensor device having an integrated beam splitterABB POWER GRIDS SWITZERLAND AG·Filed 2019·Granted Jun 29, 2021·0 cites·21 claims
- 1445US9543191B2Wiring structure having interlayer insulating film and wiring line without a barrier layer betweenTOKYO ELECTRON LTD·Filed 2013·Granted Jan 10, 2017·0 cites·3 claims
- 1545US9096937B2Method for etching film having transition metalTOKYO ELECTRON LTD·Filed 2014·Granted Aug 4, 2015·0 cites·10 claims
- 1645US8889545B2Method of manufacturing a semiconductor deviceOHMI TADAHIRO·Filed 2011·Granted Nov 18, 2014·0 cites·4 claims
- 1742US10345345B2Fiber-optic current sensor with spun fiber and temperature compensationABB RESEARCH LTD·Filed 2015·Granted Jul 9, 2019·0 cites·21 claims
- 1841US10725073B2Interferometric sensorABB POWER GRIDS SWITZERLAND AG·Filed 2016·Granted Jul 28, 2020·0 cites·20 claims
- 1939US11193959B2Interferometric voltage sensor with error compensationHITACHI ENERGY SWITZERLAND AG·Filed 2017·Granted Dec 7, 2021·0 cites·18 claims
- 2038US2014225263A1Semiconductor device and method for manufacturing semiconductor deviceNEMOTO TAKENAO·Filed 2012·Application pending·0 cites
- 2136US11698568B2Substrate and display panelHEFEI BOE OPTOELECTRONICS TECH·Filed 2020·Granted Jul 11, 2023·0 cites·18 claims
- 2235US2016211145A1Method for etching group iii-v semiconductor and apparatus for etching the sameTOKYO ELECTRON LTD·Filed 2016·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →