Inventor · disambiguated record
Donald T. Tran
Also filed as: TRAN DONALD · TRAN DONALD T · TRAN DONALD TIENDUNG
32 granted patents·8 pending applications·177 citations·filing 2001–2024
96Inventor score
Top patents by PatentIndex Score
40 records- 0198US9118151B2Interconnect cable with edge finger connectorINTEL CORP·Filed 2013·Granted Aug 25, 2015·64 cites·18 claims
- 0291US9265170B2Integrated circuit connectorsINTEL CORP·Filed 2013·Granted Feb 16, 2016·13 cites·10 claims
- 0390US9490560B2Multi-array bottom-side connector using spring biasINTEL CORP·Filed 2014·Granted Nov 8, 2016·10 cites·20 claims
- 0487US10074920B2Interconnect cable with edge finger connectorINTEL CORP·Filed 2015·Granted Sep 11, 2018·7 cites·21 claims
- 0585US9692147B1Small form factor sockets and connectorsINTEL CORP·Filed 2015·Granted Jun 27, 2017·5 cites·11 claims
- 0682US9076698B2Flexible package-to-socket interposerINTEL CORP·Filed 2012·Granted Jul 7, 2015·5 cites·19 claims
- 0781US7361044B1Socket that engages a pin grid arrayINTEL CORP·Filed 2006·Granted Apr 22, 2008·20 cites·15 claims
- 0873US8956193B2Helicoil spring backing socketTRAN DONALD·Filed 2012·Granted Feb 17, 2015·9 cites·35 claims
- 0963US7670167B2Socket that engages a pin grid arrayINTEL CORP·Filed 2008·Granted Mar 2, 2010·2 cites·8 claims
- 1062US11830863B2Dual-sided co-packaged optics for high bandwidth networking applicationsINTEL CORP·Filed 2021·Granted Nov 28, 2023·0 cites·19 claims
- 1161US11217573B2Dual-sided co-packaged optics for high bandwidth networking applicationsINTEL CORP·Filed 2020·Granted Jan 4, 2022·0 cites·25 claims
- 1261US7518872B2Attaching heat sinks to printed circuit boards using preloaded spring assembliesINTEL CORP·Filed 2004·Granted Apr 14, 2009·10 cites·16 claims
- 1360US9674954B2Chip package connector assemblyINTEL CORP·Filed 2013·Granted Jun 6, 2017·3 cites·17 claims
- 1459US9640880B2Cable connectorINTEL CORP·Filed 2014·Granted May 2, 2017·3 cites·18 claims
- 1559US7344918B2Electronic assembly with integrated IO and power contactsINTEL CORP·Filed 2006·Granted Mar 18, 2008·1 cites·20 claims
- 1658US6870251B2High-power LGA socketINTEL CORP·Filed 2002·Granted Mar 22, 2005·7 cites·25 claims
- 1757US2024355702A1Integrated circuit packages with dampeners to reduce vibration effectsGENG PHIL·Filed 2024·Application pending·0 cites
- 1854US11569596B2Pressure features to alter the shape of a socketINTEL CORP·Filed 2020·Granted Jan 31, 2023·0 cites·17 claims
- 1954US10541494B2Connector for processor packageINTEL CORP·Filed 2016·Granted Jan 21, 2020·1 cites·11 claims
- 2054US9929511B2Shielded high density card connectorINTEL CORP·Filed 2016·Granted Mar 27, 2018·1 cites·7 claims
- 2154US9332643B2Interconnect architecture with stacked flex cableINTEL CORP·Filed 2013·Granted May 3, 2016·0 cites·23 claims
- 2254US2024283197A1Sockets having fine pitch 3d featuresINTEL CORP·Filed 2023·Application pending·0 cites
- 2353US10044115B2Universal linear edge connectorINTEL CORP·Filed 2015·Granted Aug 7, 2018·1 cites·7 claims
- 2453US2025218909A1Environmental sealing for electronics chip package socketsINTEL CORP·Filed 2023·Application pending·0 cites
- 2552US2024349457A1Damping assemblies for heat sinks and related methodsGENG PHIL·Filed 2024·Application pending·0 cites
- 2651US6623290B2Coverless ZIF socket for mounting an integrated circuit package on a circuit boardINTEL CORP·Filed 2001·Granted Sep 23, 2003·6 cites·49 claims
- 2750US8915747B2Connector assembly with integrated pitch translationINTEL CORP·Filed 2013·Granted Dec 23, 2014·1 cites·19 claims
- 2849US7182634B2Connector cell having a supported conductive extensionINTEL CORP·Filed 2004·Granted Feb 27, 2007·5 cites·20 claims
- 2949US6734548B1High-power double throw lever zip socketINTEL CORP·Filed 2002·Granted May 11, 2004·2 cites·27 claims
- 3049US2023074269A1Technologies for applying gold-plated contact pads to circuit boardsINTEL CORP·Filed 2021·Application pending·0 cites
- 3148US7402182B2High-power LGA socketINTEL CORP·Filed 2005·Granted Jul 22, 2008·0 cites·5 claims
- 3247US9570386B2Flexible package-to-socket interposerINTEL CORP·Filed 2015·Granted Feb 14, 2017·0 cites·26 claims
- 3345US2021210478A1Packaging solutions for high bandwidth networking applicationsINTEL CORP·Filed 2021·Application pending·0 cites
- 3444US6972213B2High-power double throw lever zip socketINTEL CORP·Filed 2004·Granted Dec 6, 2005·0 cites·18 claims
- 3542US9502800B2Double-mated edge finger connectorINTEL CORP·Filed 2014·Granted Nov 22, 2016·0 cites·7 claims
- 3642US7064422B2Electronic assembly with integrated IO and power contactsINTEL CORP·Filed 2004·Granted Jun 20, 2006·0 cites·26 claims
- 3741US2016248210A1Interconnect architecture with stacked flex cableINTEL CORP·Filed 2016·Application pending·0 cites
- 3840US10109940B2Connector port frame for processor packageINTEL CORP·Filed 2016·Granted Oct 23, 2018·0 cites·22 claims
- 3937US7121838B2Electronic assembly having angled spring portionsINTEL CORP·Filed 2003·Granted Oct 17, 2006·1 cites·17 claims
- 4031US2017179080A1Semiconductor package interposer having encapsulated interconnectsINTEL CORP·Filed 2015·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →