Inventor · disambiguated record
Eiichi Soda
Also filed as: SODA EIICHI
14 granted patents·7 pending applications·111 citations·filing 1998–2019
91Inventor score
Top patents by PatentIndex Score
21 records- 0195US9391086B1Nonvolatile semiconductor memory device and method of manufacturing nonvolatile semiconductor memory deviceTOSHIBA KK·Filed 2015·Granted Jul 12, 2016·31 cites·8 claims
- 0290US8586478B2Method of making a semiconductor deviceSODA EIICHI·Filed 2012·Granted Nov 19, 2013·14 cites·13 claims
- 0388US9941137B2Substrate planarizing method and dropping amount calculating methodTOSHIBA MEMORY CORP·Filed 2015·Granted Apr 10, 2018·6 cites·4 claims
- 0484US7799693B2Method for manufacturing a semiconductor deviceNEC ELECTRONICS CORP·Filed 2005·Granted Sep 21, 2010·11 cites·25 claims
- 0578US10153176B2Manufacturing method of semiconductor device and template for nanoimprintTOSHIBA MEMORY CORP·Filed 2016·Granted Dec 11, 2018·3 cites·4 claims
- 0678US7439171B2Method for manufacturing electronic deviceNEC ELECTRONICS CORP·Filed 2005·Granted Oct 21, 2008·9 cites·18 claims
- 0769US7488691B2Method of fabricating semiconductor deviceNEC ELECTRONICS CORP·Filed 2007·Granted Feb 10, 2009·3 cites·10 claims
- 0868US7754543B2Method of patterning multiple-layered resist film and method of manufacturing semiconductor deviceNEC ELECTRONICS CORP·Filed 2006·Granted Jul 13, 2010·4 cites·2 claims
- 0967US8124322B2Method for manufacturing semiconductor device, and method for processing etching-target filmSODA EIICHI·Filed 2008·Granted Feb 28, 2012·3 cites·16 claims
- 1057US6103631AMethod of manufacturing semiconductor deviceNEC CORP·Filed 1998·Granted Aug 15, 2000·21 cites·20 claims
- 1150US7229915B2Method for manufacturing semiconductor deviceNEC ELECTRONICS CORP·Filed 2004·Granted Jun 12, 2007·3 cites·20 claims
- 1250US6391772B1Method for forming interconnects in semiconductor deviceNEC CORP·Filed 2000·Granted May 21, 2002·3 cites·11 claims
- 1346US11152329B2Method of separating bonded substrate, method of manufacturing semiconductor storage device, and substrate separation apparatusTOSHIBA MEMORY CORP·Filed 2019·Granted Oct 19, 2021·0 cites·12 claims
- 1441US2006094219A1Method for manufacturing electronic deviceNEC ELECTRONICS CORP·Filed 2005·Application pending·0 cites
- 1539US2005153536A1Method for manufacturing semiconductor deviceSEMICONDUCTOR LEADING EDGE TEC·Filed 2004·Application pending·0 cites
- 1637US2003190807A1Method for manufacturing semiconductor deviceNEC ELECTRONICS CORP·Filed 2003·Application pending·0 cites
- 1736US2003054656A1Method for manufacturing semiconductor device including two-step ashing process of N2 plasma gas and N2/H2 plasma gasNEC CORP·Filed 2002·Application pending·0 cites
- 1835US2002119677A1Semiconductor device manufacturing methodFiled 2002·Application pending·0 cites
- 1933US2001036728A1Method of manufacturing semiconductor deviceNEC CORP·Filed 2001·Application pending·0 cites
- 2033US2016313644A1Pattern formation methodTOSHIBA KK·Filed 2015·Application pending·0 cites
- 2131US7541281B2Method for manufacturing electronic deviceNEC ELECTRONICS CORP·Filed 2005·Granted Jun 2, 2009·0 cites·11 claims
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