Inventor · disambiguated record
Takafumi Ogiwara
Also filed as: OGIWARA TAKAFUMI
15 granted patents·17 pending applications·43 citations·filing 2011–2022
87Inventor score
Files withHAMAMATSU PHOTONICS KK26IWAKI HIROYUKI2IWATANI CORP2KYORITSU CHEMICAL & CO LTD1SAKAMOTO TAKESHI1
Top patents by PatentIndex Score
32 records- 0193US8755107B2Laser processing systemSAKAMOTO TAKESHI·Filed 2011·Granted Jun 17, 2014·15 cites·6 claims
- 0292US8816245B2Method of cutting object to be processedIWAKI HIROYUKI·Filed 2011·Granted Aug 26, 2014·14 cites·8 claims
- 0389US8950217B2Method of cutting object to be processed, method of cutting strengthened glass sheet and method of manufacturing strengthened glass memberIWAKI HIROYUKI·Filed 2011·Granted Feb 10, 2015·12 cites·8 claims
- 0476US10290545B2Laser processing methodHAMAMATSU PHOTONICS KK·Filed 2016·Granted May 14, 2019·2 cites·16 claims
- 0560US12502730B2Laser processing device, and laser processing methodHAMAMATSU PHOTONICS KK·Filed 2020·Granted Dec 23, 2025·0 cites·4 claims
- 0657US2024238905A1Laser machining device and laser machining methodHAMAMATSU PHOTONICS KK·Filed 2021·Application pending·0 cites
- 0757US2024238897A1Laser machining apparatus and laser machining methodHAMAMATSU PHOTONICS KK·Filed 2021·Application pending·0 cites
- 0856US2022410311A1Laser processing deviceHAMAMATSU PHOTONICS KK·Filed 2020·Application pending·0 cites
- 0956US2022355413A1Laser processing device, and laser processing methodHAMAMATSU PHOTONICS KK·Filed 2020·Application pending·0 cites
- 1054US10755980B2Laser processing methodHAMAMATSU PHOTONICS KK·Filed 2019·Granted Aug 25, 2020·0 cites·16 claims
- 1152US12272577B2Inspection device and processing systemHAMAMATSU PHOTONICS KK·Filed 2021·Granted Apr 8, 2025·0 cites·11 claims
- 1252US2024375210A1Laser processing device and laser processing methodHAMAMATSU PHOTONICS KK·Filed 2022·Application pending·0 cites
- 1351US2025105011A1Laser processing method and laser processing deviceHAMAMATSU PHOTONICS KK·Filed 2022·Application pending·0 cites
- 1451US2025050454A1Laser processing methodHAMAMATSU PHOTONICS KK·Filed 2022·Application pending·0 cites
- 1551US2025025963A1Laser processing device and laser processing methodHAMAMATSU PHOTONICS KK·Filed 2022·Application pending·0 cites
- 1649US2024051067A1Laser processing device and laser processing methodHAMAMATSU PHOTONICS KK·Filed 2021·Application pending·0 cites
- 1749US2024033859A1Laser machining methodHAMAMATSU PHOTONICS KK·Filed 2021·Application pending·0 cites
- 1849US2024082959A1Laser processing apparatus and laser processing methodHAMAMATSU PHOTONICS KK·Filed 2021·Application pending·0 cites
- 1948US12246397B2Laser processing device for forming a modified region in an object and laser processing methodHAMAMATSU PHOTONICS KK·Filed 2020·Granted Mar 11, 2025·0 cites·7 claims
- 2047US2023294212A1Laser processing device and laser processing methodHAMAMATSU PHOTONICS KK·Filed 2021·Application pending·0 cites
- 2146US2023154774A1Inspection device and inspection methodHAMAMATSU PHOTONICS KK·Filed 2021·Application pending·0 cites
- 2246US2023146811A1Laser processing device and inspection methodHAMAMATSU PHOTONICS KK·Filed 2021·Application pending·0 cites
- 2345US2023109456A1Inspection device and inspection methodHAMAMATSU PHOTONICS KK·Filed 2021·Application pending·0 cites
- 2445US2023113051A1Inspection device and inspection methodHAMAMATSU PHOTONICS KK·Filed 2021·Application pending·0 cites
- 2544US11380586B2Cutting methodIWATANI CORP·Filed 2018·Granted Jul 5, 2022·0 cites·12 claims
- 2643US11007607B2Laser processing device and laser processing methodHAMAMATSU PHOTONICS KK·Filed 2015·Granted May 18, 2021·0 cites·12 claims
- 2742US12269125B2Laser processing device and laser processing methodHAMAMATSU PHOTONICS KK·Filed 2022·Granted Apr 8, 2025·0 cites·20 claims
- 2842US11482455B2Cutting method of workpiece by forming reformed region and dry etching processIWATANI CORP·Filed 2018·Granted Oct 25, 2022·0 cites·2 claims
- 2939US2021053157A1Workpiece cutting methodHAMAMATSU PHOTONICS KK·Filed 2018·Application pending·0 cites
- 3037US11806805B2Workpiece cutting methodKYORITSU CHEMICAL & CO LTD·Filed 2018·Granted Nov 7, 2023·0 cites·11 claims
- 3135US11103959B2Laser processing method, and laser processing deviceHAMAMATSU PHOTONICS KK·Filed 2016·Granted Aug 31, 2021·0 cites·3 claims
- 3234US12128498B2Laser processing method, and laser processing deviceHAMAMATSU PHOTONICS KK·Filed 2016·Granted Oct 29, 2024·0 cites·5 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →