Inventor · disambiguated record
Michael C. Harmes
Also filed as: HARMES MICHAEL C
5 granted patents·2 pending applications·57 citations·filing 2002–2012
81Inventor score
Technology areasH10W
Top patents by PatentIndex Score
7 records- 0193US8421225B2Three-dimensional stacked substrate arrangementsRAMANATHAN SHRIRAM·Filed 2012·Granted Apr 16, 2013·14 cites·8 claims
- 0287US7973407B2Three-dimensional stacked substrate arrangementsINTEL CORP·Filed 2008·Granted Jul 5, 2011·12 cites·12 claims
- 0381US6870270B2Method and structure for interfacing electronic devicesINTEL CORP·Filed 2002·Granted Mar 22, 2005·25 cites·26 claims
- 0480US8203208B2Three-dimensional stacked substrate arrangementsRAMANATHAN SHRIRAM·Filed 2011·Granted Jun 19, 2012·4 cites·7 claims
- 0565US7348217B2Method and structure for interfacing electronic devicesINTEL CORP·Filed 2006·Granted Mar 25, 2008·2 cites·4 claims
- 0646US2005184400A1Method and structure for interfacing electronic devicesFiled 2005·Application pending·0 cites
- 0740US2005003650A1Three-dimensional stacked substrate arrangementsFiled 2003·Application pending·0 cites
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