Inventor · disambiguated record
David P. Vallett
Also filed as: VALLETT DAVID P · VALLETT DAVID PAUL
29 granted patents·518 citations·filing 1996–2014
97Inventor score
Files withIBM29
Top patents by PatentIndex Score
29 records- 0196US7240322B2Method of adding fabrication monitors to integrated circuit chipsIBM·Filed 2005·Granted Jul 3, 2007·60 cites·18 claims
- 0294US6014032AMicro probe ring assembly and method of fabricationIBM·Filed 1997·Granted Jan 11, 2000·127 cites·6 claims
- 0388US6232143B1Micro probe ring assembly and method of fabricationIBM·Filed 1999·Granted May 15, 2001·71 cites·10 claims
- 0487US7484423B2Integrated carbon nanotube sensorsIBM·Filed 2007·Granted Feb 3, 2009·12 cites·19 claims
- 0586US6245587B1Method for making semiconductor devices having backside probing capabilityIBM·Filed 2000·Granted Jun 12, 2001·31 cites·4 claims
- 0681US7247877B2Integrated carbon nanotube sensorsIBM·Filed 2004·Granted Jul 24, 2007·24 cites·15 claims
- 0780US7194706B2Designing scan chains with specific parameter sensitivities to identify process defectsIBM·Filed 2004·Granted Mar 20, 2007·24 cites·26 claims
- 0878US7116094B2Apparatus and method for transmission and remote sensing of signals from integrated circuit devicesIBM·Filed 2004·Granted Oct 3, 2006·22 cites·7 claims
- 0976US7202689B2Sensor differentiated fault isolationIBM·Filed 2005·Granted Apr 10, 2007·8 cites·14 claims
- 1074US7511510B2Nanoscale fault isolation and measurement systemIBM·Filed 2005·Granted Mar 31, 2009·4 cites·29 claims
- 1174US5990562ASemiconductor devices having backside probing capabilityIBM·Filed 1997·Granted Nov 23, 1999·38 cites·4 claims
- 1273US7323278B2Method of adding fabrication monitors to integrated circuit chipsIBM·Filed 2007·Granted Jan 29, 2008·3 cites·9 claims
- 1369US7397263B2Sensor differentiated fault isolationIBM·Filed 2007·Granted Jul 8, 2008·5 cites·20 claims
- 1468US7285860B2Method and structure for defect monitoring of semiconductor devices using power bus wiring gridsIBM·Filed 2006·Granted Oct 23, 2007·2 cites·3 claims
- 1567US7089138B1Canary device for failure analysisIBM·Filed 2005·Granted Aug 8, 2006·5 cites·20 claims
- 1667US6452209B2Semiconductor devices having backside probing capabilityIBM·Filed 2001·Granted Sep 17, 2002·9 cites·2 claims
- 1766US7088124B2Utilizing clock shield as defect monitorIBM·Filed 2005·Granted Aug 8, 2006·3 cites·7 claims
- 1864US7620931B2Method of adding fabrication monitors to integrated circuit chipsIBM·Filed 2007·Granted Nov 17, 2009·1 cites·17 claims
- 1963US7005874B2Utilizing clock shield as defect monitorIBM·Filed 2004·Granted Feb 28, 2006·7 cites·14 claims
- 2058US6650768B1Using time resolved light emission from VLSI circuit devices for navigation on complex systemsIBM·Filed 1998·Granted Nov 18, 2003·20 cites·20 claims
- 2156US6307162B1Integrated circuit wiringIBM·Filed 1996·Granted Oct 23, 2001·22 cites·8 claims
- 2255US9140669B2Mapping density and temperature of a chip, in situIBM·Filed 2014·Granted Sep 22, 2015·0 cites·14 claims
- 2354US7671604B2Nanoscale fault isolation and measurement systemIBM·Filed 2008·Granted Mar 2, 2010·0 cites·16 claims
- 2453US7078248B2Method and structure for defect monitoring of semiconductor devices using power bus wiring gridsIBM·Filed 2004·Granted Jul 18, 2006·3 cites·8 claims
- 2551US8987843B2Mapping density and temperature of a chip, in situIBM·Filed 2012·Granted Mar 24, 2015·0 cites·10 claims
- 2646US7230335B2Inspection methods and structures for visualizing and/or detecting specific chip structuresIBM·Filed 2004·Granted Jun 12, 2007·1 cites·3 claims
- 2746US6078057ASemiconductor devices having backside probing capabilityIBM·Filed 1998·Granted Jun 20, 2000·10 cites·5 claims
- 2844US7239167B2Utilizing clock shield as defect monitorIBM·Filed 2006·Granted Jul 3, 2007·0 cites·20 claims
- 2933US6010392ADie thinning apparatusIBM·Filed 1998·Granted Jan 4, 2000·6 cites·12 claims
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