Inventor · disambiguated record
Rey Torcuato
Also filed as: TORCUATO REY
2 granted patents·1 pending application·42 citations·filing 2000–2011
59Inventor score
Technology areasH10W
Top patents by PatentIndex Score
3 records- 0181US6329278B1Multiple row wire bonding with ball bonds of outer bond pads bonded on the leadsLSI LOGIC CORP·Filed 2000·Granted Dec 11, 2001·40 cites·10 claims
- 0242US6861748B2Test structureLSI LOGIC CORP·Filed 2002·Granted Mar 1, 2005·2 cites·10 claims
- 0331US2012286409A1Utilizing a jumper chip in packages with long bonding wiresSHAH JITESH·Filed 2011·Application pending·0 cites
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