Inventor · disambiguated record
Akio Katsumata
Also filed as: KATSUMATA AKIO
21 granted patents·6 pending applications·707 citations·filing 1979–2019
96Inventor score
Top patents by PatentIndex Score
27 records- 0195US6153448ASemiconductor device manufacturing methodTOSHIBA KK·Filed 1999·Granted Nov 28, 2000·176 cites·5 claims
- 0293US5977641ASemiconductor device and method for manufacturing the sameTOSHIBA KK·Filed 1998·Granted Nov 2, 1999·134 cites·11 claims
- 0391US4916547AColor image forming apparatusRICOH KK·Filed 1988·Granted Apr 10, 1990·90 cites·8 claims
- 0484US5223739APlastic molded semiconductor device having waterproof capTOSHIBA KK·Filed 1990·Granted Jun 29, 1993·82 cites·6 claims
- 0582US8872350B2Semiconductor device and manufacturing method thereofSAWACHI SHIGENORI·Filed 2012·Granted Oct 28, 2014·11 cites·12 claims
- 0681US4770403APaper feeder usable with a copier and othersRICOH KK·Filed 1986·Granted Sep 13, 1988·29 cites·3 claims
- 0780US10000070B1Printer and printer control methodTOSHIBA TEC KK·Filed 2017·Granted Jun 19, 2018·1 cites·4 claims
- 0876US5479467AHistory recording apparatusTOKYO ELECTRIC CO LTD·Filed 1994·Granted Dec 26, 1995·33 cites·7 claims
- 0973US5564846APrinter with sheet positioning marks controlTOKYO ELECTRIC CO LTD·Filed 1995·Granted Oct 15, 1996·31 cites·12 claims
- 1072US4279501ACleaning device for photoelectrostatic copying apparatusRICOH KK·Filed 1979·Granted Jul 21, 1981·14 cites·4 claims
- 1171US10596825B2Printer and printer control methodTOSHIBA TEC KK·Filed 2019·Granted Mar 24, 2020·0 cites·9 claims
- 1268US9059143B2Semiconductor deviceIMAIZUMI YUKARI·Filed 2011·Granted Jun 16, 2015·5 cites·15 claims
- 1365US5723901AStacked semiconductor device having peripheral through holesTOSHIBA KK·Filed 1995·Granted Mar 3, 1998·34 cites·16 claims
- 1465US4951160AImage reproducing apparatusRICOH KK·Filed 1989·Granted Aug 21, 1990·20 cites·16 claims
- 1565US2018264843A1Printer and printer control methodTOSHIBA TEC KK·Filed 2018·Application pending·0 cites
- 1660US5563773ASemiconductor module having multiple insulation and wiring layersTOSHIBA KK·Filed 1994·Granted Oct 8, 1996·28 cites·5 claims
- 1756US8897051B2Semiconductor storage device and method for producing the sameJ DEVICES CORP·Filed 2013·Granted Nov 25, 2014·1 cites·5 claims
- 1851US9147671B2Semiconductor device, semiconductor stacked module structure, stacked module structure and method of manufacturing sameINOUE HIROSHI·Filed 2014·Granted Sep 29, 2015·0 cites·9 claims
- 1949US2010156615A1Device and method for issuing rfid holding medium and computer-readable recording mediumTOSHIBA TEC KK·Filed 2009·Application pending·0 cites
- 2045US9196507B1Semiconductor device, semiconductor stacked module structure, stacked module structure and method of manufacturing sameINOUE HIROSHI·Filed 2015·Granted Nov 24, 2015·0 cites·1 claims
- 2144US5923357ALine thermal printerTOKYO ELECTRIC CO LTD·Filed 1997·Granted Jul 13, 1999·9 cites·21 claims
- 2241US9627289B2Semiconductor deviceJ-DEVICES CORP·Filed 2015·Granted Apr 18, 2017·0 cites·6 claims
- 2339US5420756AMemory card including stacked semiconductor memory elements located on a printed circuit board having a straight wiring patternTOSHIBA KK·Filed 1993·Granted May 30, 1995·9 cites·15 claims
- 2439US2012224014A1Label printing device and label printing methodKATSUMATA AKIO·Filed 2012·Application pending·0 cites
- 2538US2010219253A1Rfid printerTOSHIBA TEC KK·Filed 2010·Application pending·0 cites
- 2638US2018009249A1Label printer and method for improving detection precision by the sameTOSHIBA TEC KK·Filed 2017·Application pending·0 cites
- 2732US2013026650A1Semiconductor device, semiconductor module structure configured by vertically stacking semiconductor devices, and manufacturing method thereofYAMAGATA OSAMU·Filed 2012·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →