Inventor · disambiguated record
Kazuo Arita
Also filed as: ARITA KAZUO
26 granted patents·12 pending applications·41 citations·filing 1976–2023
93Inventor score
Top patents by PatentIndex Score
38 records- 0187US11760711B2Epoxy compound, composition, cured product and laminateDAINIPPON INK & CHEMICALS·Filed 2018·Granted Sep 19, 2023·2 cites·24 claims
- 0281US9441069B2Epoxy resin, method for producing epoxy resin, epoxy resin composition, cured product thereof, and heat-dissipating resin materialDAINIPPON INK & CHEMICALS·Filed 2013·Granted Sep 13, 2016·2 cites·14 claims
- 0373US7985822B2Epoxy resin composition,cured article thereof, semiconductor sealing material, novel phenol resin, novel epoxy resin,method for producing novel phenol resin, and method for producing novel epoxy resinDAINIPPON INK & CHEMICALS·Filed 2005·Granted Jul 26, 2011·5 cites·2 claims
- 0470US2025320180A1Hydroxyl group-containing compound, curable resin composition, cured product, and layered productDAINIPPON INK & CHEMICALS·Filed 2023·Application pending·0 cites
- 0570US2025277081A1Glycidyl ether group-containing compound, curable resin composition, cured object, and laminateDAINIPPON INK & CHEMICALS·Filed 2023·Application pending·0 cites
- 0669US8168731B2Curable resin composition, cured product thereof, printed wiring board, epoxy resin, and process for producing the sameSATOU YUTAKA·Filed 2009·Granted May 1, 2012·4 cites·18 claims
- 0769US2025277080A1Phenolic hydroxy group-containing compound, curable resin composition, cured product, and laminateDAINIPPON INK & CHEMICALS·Filed 2023·Application pending·0 cites
- 0869US2025122411A1Epoxy resin composition, and cured product and laminate thereofDAINIPPON INK & CHEMICALS·Filed 2022·Application pending·0 cites
- 0965US11104788B2Composition, cured product and laminateDAINIPPON INK & CHEMICALS·Filed 2017·Granted Aug 31, 2021·1 cites·14 claims
- 1065US10981865B2Substituted or unsubstituted allyl group-containing maleimide compound, production method therefor, and composition and cured product using said compoundDAINIPPON INK & CHEMICALS·Filed 2017·Granted Apr 20, 2021·1 cites·19 claims
- 1165US10059798B2Active ester resin, epoxy resin composition, cured product thereof, prepreg, circuit board, and build-up filmDAINIPPON INK & CHEMICALS·Filed 2013·Granted Aug 28, 2018·2 cites·6 claims
- 1265US8263714B2Epoxy resin composition, cured article thereof, semiconductor sealing material, novel phenol resin, novel epoxy resin, method for producing novel phenol resin, and method for producing novel epoxy resinOGURA ICHIRO·Filed 2011·Granted Sep 11, 2012·2 cites·6 claims
- 1365US8084567B2Epoxy resin composition and cured article thereof, novel epoxy resin and production method thereof, and novel phenol resinOGURA ICHIROU·Filed 2009·Granted Dec 27, 2011·3 cites·3 claims
- 1464US8669333B2Thermosetting resin composition, cured product thereof, active ester resin, semiconductor encapsulating material, prepreg, circuit board, and build-up filmARITA KAZUO·Filed 2011·Granted Mar 11, 2014·2 cites·12 claims
- 1564US2024059827A1Epoxy resin composition, cured product thereof, and laminateDAINIPPON INK & CHEMICALS·Filed 2021·Application pending·0 cites
- 1663US2025179237A1Glycidyl ether group-containing compound, curable resin composition, cured product, and laminateDAINIPPON INK & CHEMICALS·Filed 2023·Application pending·0 cites
- 1763US2025223396A1Glycidyl ether group-containing compound, curable resin composition, cured product, and laminateDAINIPPON INK & CHEMICALS·Filed 2023·Application pending·0 cites
- 1862US10399312B2Oxazine compound, composition and cured productDAINIPPON INK & CHEMICALS·Filed 2016·Granted Sep 3, 2019·1 cites·18 claims
- 1959US9217053B2Active ester resin, thermosetting resin composition, cured product of same, semiconductor encapsulation material, prepreg, circuit board, and build-up filmDAINIPPON INK & CHEMICALS·Filed 2013·Granted Dec 22, 2015·1 cites·9 claims
- 2059US8791214B2Active ester resin, method for producing the same, thermosetting resin composition, cured product of the thermosetting resin composition, semiconductor encapsulating material, pre-preg, circuit board, and build-up filmTAKEUCHI KAN·Filed 2012·Granted Jul 29, 2014·2 cites·23 claims
- 2159US2025026928A1Crosslinkable resin composition, cured product, laminate and heat-resistant memberDAINIPPON INK & CHEMICALS·Filed 2022·Application pending·0 cites
- 2258US4090375AConstant velocity universal jointNISSAN MOTOR·Filed 1976·Granted May 23, 1978·13 cites·14 claims
- 2357US11685807B2Resin composition, cured product, laminate, and electronic memberDAINIPPON INK & CHEMICALS·Filed 2019·Granted Jun 27, 2023·0 cites·14 claims
- 2449US9963544B2Active ester resin containing phosphorus atom, epoxy resin composition and cured product thereof, prepreg, circuit board, and build-up filmDAINIPPON INK & CHEMICALS·Filed 2014·Granted May 8, 2018·0 cites·6 claims
- 2548US7718741B2Epoxy resin composition and cured article thereof, novel epoxy resin and production method thereof, and novel phenol resinDAINIPPON INK & CHEMICALS·Filed 2006·Granted May 18, 2010·0 cites·12 claims
- 2648US2009088535A1Method of producing phenol resin and method of producing epoxy resinDAINIPPON INK & CHEMICALS·Filed 2006·Application pending·0 cites
- 2747US8729192B2Epoxy resin composition, cured article thereof, novel epoxy resin, novel phenol resin and semiconductor-encapsulating materialARITA KAZUO·Filed 2006·Granted May 20, 2014·0 cites·15 claims
- 2845US10577307B2Methods for producing polycyclic aromatic aminophenol compound and resin composition, and polycyclic aromatic aminophenol compound, resin composition, and cured productDAINIPPON INK & CHEMICALS·Filed 2017·Granted Mar 3, 2020·0 cites·7 claims
- 2945US10301471B2Curable resin composition, cured product thereof, semiconductor encapsulating material, semiconductor device, prepreg, circuit board, build-up film, build-up substrate, fiber-reinforced composite material, and fiber-reinforced resin molded productDAINIPPON INK & CHEMICALS·Filed 2015·Granted May 28, 2019·0 cites·21 claims
- 3045US8394911B2Phenol resin composition, production method therefor, curable resin composition, cured product thereof, and printed circuit boardSATOU YUTAKA·Filed 2011·Granted Mar 12, 2013·0 cites·16 claims
- 3140US6794478B2Preparing epoxy resin by distilling two fractions to recover and reuse epihalohydrin without glycidolDAINIPPON INK & CHEMICALS·Filed 2002·Granted Sep 21, 2004·0 cites·3 claims
- 3236US11117873B2Oxazine compound, composition, and cured productDAINIPPON INK & CHEMICALS·Filed 2016·Granted Sep 14, 2021·0 cites·17 claims
- 3336US11028059B2Oxazine compound, composition and cured productDAINIPPON INK & CHEMICALS·Filed 2016·Granted Jun 8, 2021·0 cites·14 claims
- 3436US2020325100A1Substituted or unsubstituted allyl group-containing maleimide compound, production method therefor, and composition and cured product using said compoundDAINIPPON INK & CHEMICALS·Filed 2017·Application pending·0 cites
- 3535US11117872B2Oxazine compound, composition and cured productDAINIPPON INK & CHEMICALS·Filed 2016·Granted Sep 14, 2021·0 cites·17 claims
- 3635US10913725B2Oxazine compound, composition and cured productDAINIPPON INK & CHEMICALS·Filed 2016·Granted Feb 9, 2021·0 cites·18 claims
- 3734US2018327541A1Thermosetting resin composition, cured product obtained therefrom, and active ester resin for use thereinDAINIPPON INK & CHEMICALS·Filed 2015·Application pending·0 cites
- 3833US2017320994A1Epoxy resin composition and cured product thereofDAINIPPON INK & CHEMICALS·Filed 2015·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →