Inventor · disambiguated record
Kai Schillinger
Also filed as: SCHILLINGER KAI
8 granted patents·2 pending applications·0 citations·filing 2016–2021
71Inventor score
Files withNEXWAFE GMBH10
Top patents by PatentIndex Score
10 records- 0163US11915922B2Silicon wafer for an electronic component and method for the production thereofNEXWAFE GMBH·Filed 2021·Granted Feb 27, 2024·0 cites·8 claims
- 0249US10985005B2Silicon wafer for an electronic component and method for the production thereofNEXWAFE GMBH·Filed 2017·Granted Apr 20, 2021·0 cites·7 claims
- 0345US11560316B2Process and apparatus for removal of impurities from chlorosilanesNEXWAFE GMBH·Filed 2018·Granted Jan 24, 2023·0 cites·9 claims
- 0444US10943826B2Method for arranging a plurality of seed substrates on a carrier element and carrier element having seed substratesNEXWAFE GMBH·Filed 2017·Granted Mar 9, 2021·0 cites·18 claims
- 0540US11862462B2Method and apparatus for the continuous vapor deposition of silicon on substratesNEXWAFE GMBH·Filed 2018·Granted Jan 2, 2024·0 cites·11 claims
- 0639US2022406590A1Method and carrier element for producing a wafer layerNEXWAFE GMBH·Filed 2020·Application pending·0 cites
- 0737US10508365B2Method and device for producing a semiconductor layerNEXWAFE GMBH·Filed 2016·Granted Dec 17, 2019·0 cites·14 claims
- 0835US11519094B2Apparatus and method for etching one side of a semiconductor layer of a workpieceNEXWAFE GMBH·Filed 2019·Granted Dec 6, 2022·0 cites·21 claims
- 0935US10975490B2Apparatus and method for etching one side of a semiconductor substrateNEXWAFE GMBH·Filed 2016·Granted Apr 13, 2021·0 cites·13 claims
- 1031US2021363632A1Process chamber guide, process chamber, and method for guiding a substrate carrier in a process positionNEXWAFE GMBH·Filed 2018·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →