Inventor · disambiguated record
Jose A. Hejase
Also filed as: HEJASE JOSE A
21 granted patents·3 pending applications·28 citations·filing 2014–2023
91Inventor score
Files withIBM24
Top patents by PatentIndex Score
24 records- 0194US10135162B1Method for fabricating a hybrid land grid array connectorIBM·Filed 2017·Granted Nov 20, 2018·8 cites·7 claims
- 0292US10128593B1Connector having a body with a conductive layer common to top and bottom surfaces of the body as well as to wall surfaces of a plurality of holes in the bodyIBM·Filed 2017·Granted Nov 13, 2018·6 cites·12 claims
- 0384US11658378B2Vertically transitioning between substrate integrated waveguides (SIWs) within a multilayered printed circuit board (PCB)IBM·Filed 2019·Granted May 23, 2023·4 cites·14 claims
- 0477US10167879B2Cooling fan coupled with a set of recirculation flapsIBM·Filed 2016·Granted Jan 1, 2019·2 cites·10 claims
- 0576US9638750B2Frequency-domain high-speed bus signal integrity compliance modelIBM·Filed 2015·Granted May 2, 2017·2 cites·11 claims
- 0673US10141623B2Multi-layer printed circuit board having first and second coaxial vias coupled to a core of a dielectric waveguide disposed in the circuit boardIBM·Filed 2016·Granted Nov 27, 2018·2 cites·16 claims
- 0773US9368852B2Method for performing frequency band splittingIBM·Filed 2014·Granted Jun 14, 2016·2 cites·3 claims
- 0866US10181628B2Reduction of crosstalk between dielectric waveguides using split ring resonatorsIBM·Filed 2016·Granted Jan 15, 2019·1 cites·17 claims
- 0966US9893400B2Method for performing frequency band splittingIBM·Filed 2015·Granted Feb 13, 2018·1 cites·3 claims
- 1063US10620253B2Noise modulation for on-chip noise measurementIBM·Filed 2017·Granted Apr 14, 2020·0 cites·20 claims
- 1157US12451448B2Electromagnetic waveguiding through liquid cooling conduitIBM·Filed 2022·Granted Oct 21, 2025·0 cites·12 claims
- 1257US12266598B2Dense via pitch interconnect to increase wiring densityIBM·Filed 2022·Granted Apr 1, 2025·0 cites·20 claims
- 1357US9835665B2Noise modulation for on-chip noise measurementIBM·Filed 2014·Granted Dec 5, 2017·0 cites·11 claims
- 1457US9797938B2Noise modulation for on-chip noise measurementIBM·Filed 2014·Granted Oct 24, 2017·0 cites·14 claims
- 1555US10167878B2Cooling fan coupled with a set of recirculation flapsIBM·Filed 2015·Granted Jan 1, 2019·0 cites·10 claims
- 1655US2024321802A1Processor package substrate with high-speed top-surface connection to cable interconnectIBM·Filed 2023·Application pending·0 cites
- 1752US11399428B2PCB with substrate integrated waveguides using multi-band monopole antenna feeds for high speed communicationIBM·Filed 2019·Granted Jul 26, 2022·0 cites·17 claims
- 1852US9733305B2Frequency-domain high-speed bus signal integrity compliance modelIBM·Filed 2015·Granted Aug 15, 2017·0 cites·6 claims
- 1951US9686053B2Frequency-domain high-speed bus signal integrity compliance modelIBM·Filed 2015·Granted Jun 20, 2017·0 cites·7 claims
- 2050US9673941B2Frequency-domain high-speed bus signal integrity compliance modelIBM·Filed 2015·Granted Jun 6, 2017·0 cites·10 claims
- 2146US10879575B2Embedded filtering in PCB integrated ultra high speed dielectric waveguides using photonic band gap structuresIBM·Filed 2018·Granted Dec 29, 2020·0 cites·20 claims
- 2246US10199706B2Communication system having a multi-layer PCB including a dielectric waveguide layer with a core and cladding directly contacting ground planesIBM·Filed 2016·Granted Feb 5, 2019·0 cites·17 claims
- 2338US2018228023A1Angled fiberglass cloth weavesIBM·Filed 2017·Application pending·0 cites
- 2438US2018113974A1Neural Network Based Prediction of PCB Glass Weave Induced SkewIBM·Filed 2016·Application pending·0 cites
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