Inventor · disambiguated record
Elie A. Maalouf
Also filed as: MAALOUF ELIE · MAALOUF ELIE A
32 granted patents·5 pending applications·185 citations·filing 2007–2024
96Inventor score
Top patents by PatentIndex Score
37 records- 0198US11515842B2Doherty power amplifiers and devices with low voltage driver stage in carrier-path and high voltage driver stage in peaking-pathNXP USA INC·Filed 2020·Granted Nov 29, 2022·14 cites·19 claims
- 0298US9774301B1Multiple-path RF amplifiers with angularly offset signal path directions, and methods of manufacture thereofFREESCALE SEMICONDUCTOR INC·Filed 2016·Granted Sep 26, 2017·49 cites·20 claims
- 0396US10903182B1Amplifier die bond pad design and amplifier die arrangement for compact Doherty amplifier modulesNXP USA INC·Filed 2019·Granted Jan 26, 2021·16 cites·20 claims
- 0494US11610567B1Musical instrument stand support apparatus with rotatable adjustment mechanism to display a guitarMAALOUF ELIE·Filed 2022·Granted Mar 21, 2023·4 cites·7 claims
- 0594US10440813B1Microelectronic modules including thermal extension levels and methods for the fabrication thereofNXP USA INC·Filed 2018·Granted Oct 8, 2019·8 cites·16 claims
- 0693US11264001B1Musical instrument stand support apparatus with rotatable adjustment mechanism to display a guitarMAALOUF ELIE·Filed 2020·Granted Mar 1, 2022·4 cites·10 claims
- 0792US12506446B2Power amplifier modules including topside cooling interfaces and methods for the fabrication thereofNXP USA INC·Filed 2024·Granted Dec 23, 2025·1 cites·12 claims
- 0892US10785862B2Microelectronic modules with sinter-bonded heat dissipation structures and methods for the fabrication thereofNXP USA INC·Filed 2018·Granted Sep 22, 2020·7 cites·20 claims
- 0992US10485091B2Microelectronic modules with sinter-bonded heat dissipation structures and methods for the fabrication thereofNXP USA INC·Filed 2018·Granted Nov 19, 2019·9 cites·20 claims
- 1091US7795980B2Power amplifiers having improved protection against avalanche currentFREESCALE SEMICONDUCTOR INC·Filed 2008·Granted Sep 14, 2010·22 cites·23 claims
- 1188US11990872B2Power amplifier modules including topside cooling interfaces and methods for the fabrication thereofNXP USA INC·Filed 2020·Granted May 21, 2024·2 cites·13 claims
- 1285US12261571B2Bias control circuit for power transistorsNXP USA INC·Filed 2022·Granted Mar 25, 2025·1 cites·16 claims
- 1384US11050388B2Compact three-way Doherty amplifier moduleNXP USA INC·Filed 2019·Granted Jun 29, 2021·4 cites·17 claims
- 1484US8806418B1Scaled sigma samplingJALLEPALLI SRINIVAS·Filed 2013·Granted Aug 12, 2014·17 cites·20 claims
- 1583US12224713B2Multiple-stage Doherty power amplifiers implemented with multiple semiconductor technologiesNXP USA INC·Filed 2021·Granted Feb 11, 2025·1 cites·20 claims
- 1683US11145609B2Doherty amplifier with surface-mount packaged carrier and peaking amplifiersNXP USA INC·Filed 2019·Granted Oct 12, 2021·4 cites·22 claims
- 1782US12184237B2Surface-mount amplifier devicesNXP USA INC·Filed 2021·Granted Dec 31, 2024·1 cites·20 claims
- 1880US11108362B2Multiple-path RF amplifiers with angularly offset signal path directions, and methods of manufacture thereofNXP USA INC·Filed 2020·Granted Aug 31, 2021·1 cites·22 claims
- 1978US10742173B2Systems and methods for fast switching time division duplex operation of power amplifiersNXP USA INC·Filed 2018·Granted Aug 11, 2020·4 cites·20 claims
- 2077US10104759B2Microelectronic modules with sinter-bonded heat dissipation structures and methods for the fabrication thereofNXP USA INC·Filed 2016·Granted Oct 16, 2018·2 cites·20 claims
- 2177US8217511B2Redistributed chip packaging with thermal contact to device backsideTRACHT NEIL T·Filed 2007·Granted Jul 10, 2012·7 cites·11 claims
- 2276US11128269B2Multiple-stage power amplifiers and devices with low-voltage driver stagesNXP USA INC·Filed 2019·Granted Sep 21, 2021·2 cites·20 claims
- 2373US10381984B2Amplifiers and amplifier modules with shunt inductance circuits that include high-Q capacitorsNXP USA INC·Filed 2017·Granted Aug 13, 2019·2 cites·22 claims
- 2472US12494380B2Amplifier modules with power transistor die and peripheral ground connectionsNXP USA INC·Filed 2024·Granted Dec 9, 2025·0 cites·17 claims
- 2572US10972054B2Systems and methods for automatically biasing power amplifiers using a controllable current sourceNXP USA INC·Filed 2019·Granted Apr 6, 2021·2 cites·22 claims
- 2659US10608595B1Systems and methods for automatically biasing power amplifiersNXP USA INC·Filed 2018·Granted Mar 31, 2020·1 cites·24 claims
- 2759US2025317107A1Dual purpose power splitter for doherty power amplifierNXP USA INC·Filed 2024·Application pending·0 cites
- 2858US2025323602A1Radio-frequency amplifiers with automatic bias compensationNXP USA INC·Filed 2024·Application pending·0 cites
- 2957US11990384B2Amplifier modules with power transistor die and peripheral ground connectionsNXP USA INC·Filed 2020·Granted May 21, 2024·0 cites·13 claims
- 3057US11519795B2Systems and methods for calibrating temperature sensorsNXP USA INC·Filed 2019·Granted Dec 6, 2022·0 cites·18 claims
- 3154US10566935B2Multiple-path RF amplifiers with angularly offset signal path directions, and methods of manufacture thereofNXP USA INC·Filed 2017·Granted Feb 18, 2020·0 cites·22 claims
- 3253US2024120321A1Power amplifier packages containing electrically-routed lids and methods for the fabrication thereofNXP USA INC·Filed 2022·Application pending·0 cites
- 3348US2023299720A1Power amplifier bias circuitNXP USA INC·Filed 2022·Application pending·0 cites
- 3447US11194357B2Systems and methods for operating a bias controller for an amplifier circuitNXP USA INC·Filed 2019·Granted Dec 7, 2021·0 cites·18 claims
- 3545US11342887B2Wideband RF power splitters and amplifiers including wideband RF power splittersNXP USA INC·Filed 2019·Granted May 24, 2022·0 cites·15 claims
- 3644US2012252169A1Redistributed chip packaging with thermal contact to device backsideTRACHT NEIL T·Filed 2012·Application pending·0 cites
- 3740US11742809B2Systems and methods for sensing a current in a circuitC/O NXP USA INC·Filed 2020·Granted Aug 29, 2023·0 cites·20 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →