Inventor · disambiguated record
Shih-Yuan Hsu
Also filed as: HSU SHIH-YUAN
10 granted patents·6 pending applications·16 citations·filing 2011–2015
82Inventor score
Top patents by PatentIndex Score
16 records- 0179US8471287B2LED package and method for making the sameHU PI-CHIANG·Filed 2012·Granted Jun 25, 2013·7 cites·12 claims
- 0277US8569779B2Light emitting diode packageWANG KAI-LUN·Filed 2011·Granted Oct 29, 2013·3 cites·14 claims
- 0372US8952922B2Sensing unit, sensing arrangement and sensing method for touch panel applicationLIN CHIA-HSING·Filed 2011·Granted Feb 10, 2015·4 cites·10 claims
- 0464US8569781B2LED package with light-absorbing layerHU PI-CHIANG·Filed 2011·Granted Oct 29, 2013·2 cites·20 claims
- 0557US8912558B2Light emitting diode packageHU PI-CHIANG·Filed 2014·Granted Dec 16, 2014·0 cites·10 claims
- 0652US8709842B2Light-emitting diode package and method for manufacturing the sameHU PI-CHIANG·Filed 2012·Granted Apr 29, 2014·0 cites·10 claims
- 0751US9075486B2Circuit and method for sensing a capacitanceHUANG CHUN-CHUNG·Filed 2011·Granted Jul 7, 2015·0 cites·28 claims
- 0846US2013283609A1Method for manufacturing supporting boards of light emitting diode modulesINC ADVANCED OPTOELECTRONIC TECHNOLOGY·Filed 2013·Application pending·0 cites
- 0945US9562937B2Circuit and method for sensing a capacitanceELAN MICROELECTRONICS CORP·Filed 2015·Granted Feb 7, 2017·0 cites·14 claims
- 1044US8890192B2Light emitting diode with sidewise light output structure and method for manufacturing the sameHSU SHIH-YUAN·Filed 2012·Granted Nov 18, 2014·0 cites·9 claims
- 1141US8344408B2Light emitting diode package having improved wire bonding structureADVANCED OPTOELECTRONIC TECH·Filed 2011·Granted Jan 1, 2013·0 cites·15 claims
- 1237US2013062642A1Led package deviceHU PI-CHIANG·Filed 2012·Application pending·0 cites
- 1335US2012161179A1Light emitting diode packageFANG JUNG-HSI·Filed 2011·Application pending·0 cites
- 1435US2012175656A1Light emitting diode packageFANG JUNG-HSI·Filed 2011·Application pending·0 cites
- 1535US2012104438A1Light emitting diode package structureWANG KAI-LUN·Filed 2011·Application pending·0 cites
- 1634US2012126265A1Led packageHSU SHIH-YUAN·Filed 2011·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →