Inventor · disambiguated record
Daniel Douriet
Also filed as: DOURIET DANIEL · DOURIET DANIEL F
20 granted patents·2 pending applications·273 citations·filing 1992–2013
95Inventor score
Top patents by PatentIndex Score
22 records- 0187US7765504B2Design method and system for minimizing blind via current loopsIBM·Filed 2007·Granted Jul 27, 2010·15 cites·30 claims
- 0287US7467050B2Method for detecting noise events in systems with time variable operating pointsIBM·Filed 2006·Granted Dec 16, 2008·16 cites·10 claims
- 0386US6215377B1Low cost wideband RF port structure for microwave circuit packages using coplanar waveguide and BGA I/O formatMICROSUBSTRATES CORP·Filed 1998·Granted Apr 10, 2001·96 cites·6 claims
- 0485US7863724B2Circuit substrate having post-fed die side power supply connectionsIBM·Filed 2008·Granted Jan 4, 2011·11 cites·14 claims
- 0578US7607028B2Mitigate power supply noise response by throttling execution units based upon voltage sensingIBM·Filed 2006·Granted Oct 20, 2009·9 cites·20 claims
- 0677US6993739B2Method, structure, and computer program product for implementing high frequency return current paths within electronic packagesIBM·Filed 2003·Granted Jan 31, 2006·23 cites·18 claims
- 0773US5422782AMultiple resonant frequency decoupling capacitorCIRCUIT COMPONENTS INC·Filed 1992·Granted Jun 6, 1995·36 cites·14 claims
- 0869US7671273B2Method and apparatus for facilitating signal transmission using differential transmission linesIBM·Filed 2007·Granted Mar 2, 2010·4 cites·17 claims
- 0968US8586476B2Fabrication method for circuit substrate having post-fed die side power supply connectionsDOURIET DANIEL·Filed 2010·Granted Nov 19, 2013·2 cites·11 claims
- 1068US7376914B2Method and computer program product for designing power distribution system in a circuitIBM·Filed 2006·Granted May 20, 2008·4 cites·2 claims
- 1165US7272809B2Method, apparatus and computer program product for implementing enhanced high frequency return current paths utilizing decoupling capacitors in a package designIBM·Filed 2003·Granted Sep 18, 2007·11 cites·17 claims
- 1264US7920978B2Method for detecting noise events in systems with time variable operating pointsIBM·Filed 2008·Granted Apr 5, 2011·2 cites·9 claims
- 1364US6426686B1Microwave circuit packages having a reduced number of vias in the substrateMICROSUBSTRATES CORP·Filed 1999·Granted Jul 30, 2002·34 cites·18 claims
- 1463US7460986B2System DC Analysis MethodologyIBM·Filed 2006·Granted Dec 2, 2008·2 cites·8 claims
- 1561US7614141B2Fabricating substrates having low inductance via arrangementsIBM·Filed 2006·Granted Nov 10, 2009·2 cites·7 claims
- 1658US7275222B2Method, apparatus, and computer program product for enhancing a power distribution system in a ceramic integrated circuit packageIBM·Filed 2004·Granted Sep 25, 2007·5 cites·16 claims
- 1754US8055486B2Power delivery analysis and designIBM·Filed 2008·Granted Nov 8, 2011·0 cites·8 claims
- 1853US8722536B2Fabrication method for circuit substrate having post-fed die side power supply connectionsIBM·Filed 2013·Granted May 13, 2014·0 cites·14 claims
- 1951US7917870B2Enhancing a power distribution system in a ceramic integrated circuit packageIBM·Filed 2007·Granted Mar 29, 2011·0 cites·20 claims
- 2050US7469199B2Apparatus and method for selectively monitoring multiple voltages in an IC or other electronic chipIBM·Filed 2006·Granted Dec 23, 2008·1 cites·3 claims
- 2139US2008109773A1Analyzing Impedance Discontinuities In A Printed Circuit BoardDOURIET DANIEL·Filed 2006·Application pending·0 cites
- 2237US2006035488A1Connector with conductors exposed to exterior air to facilitate heat removalIBM·Filed 2004·Application pending·0 cites
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