Inventor · disambiguated record
Lee Wang Lai
Also filed as: LAI LEE WANG
7 granted patents·153 citations·filing 2002–2010
87Inventor score
Technology areasH10W
Top patents by PatentIndex Score
7 records- 0196US7205656B2Stacked device package for peripheral and center device pad layout deviceMICRON TECHNOLOGY INC·Filed 2005·Granted Apr 17, 2007·58 cites·30 claims
- 0289US6784525B2Semiconductor component having multi layered leadframeMICRON TECHNOLOGY INC·Filed 2002·Granted Aug 31, 2004·44 cites·43 claims
- 0383US6835599B2Method for fabricating semiconductor component with multi layered leadframeMICRON TECHNOLOGY INC·Filed 2003·Granted Dec 28, 2004·29 cites·22 claims
- 0480US7425463B2Stacked die package for peripheral and center device pad layout deviceMICRON TECHNOLOGY INC·Filed 2006·Granted Sep 16, 2008·7 cites·36 claims
- 0576US7846768B2Stacked die package for peripheral and center device pad layout deviceMICRON TECHNOLOGY INC·Filed 2008·Granted Dec 7, 2010·5 cites·20 claims
- 0666US6972214B2Method for fabricating a semiconductor package with multi layered leadframeMICRON TECHNOLOGY INC·Filed 2004·Granted Dec 6, 2005·10 cites·21 claims
- 0743US8269328B2Stacked die package for peripheral and center device pad layout deviceKIM DALSON YE SENG·Filed 2010·Granted Sep 18, 2012·0 cites·20 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →