Inventor · disambiguated record
Lee Choon Kuan
Also filed as: KUAN LEE C · KUAN LEE CHOON
22 granted patents·1 pending application·387 citations·filing 2000–2014
96Inventor score
Top patents by PatentIndex Score
23 records- 0195US7767913B2Electronic devices including conductive vias having two or more conductive elements for providing electrical communication between traces in different planes in a substrate, and accompanying methodsMICRON TECHNOLOGY INC·Filed 2006·Granted Aug 3, 2010·33 cites·28 claims
- 0294US6913476B2Temporary, conformable contacts for microelectronic componentsMICRON TECHNOLOGY INC·Filed 2002·Granted Jul 5, 2005·75 cites·64 claims
- 0393US6507114B2BOC semiconductor package including a semiconductor die and a substrate bonded circuit side down to the dieMICRON TECHNOLOGY INC·Filed 2001·Granted Jan 14, 2003·87 cites·35 claims
- 0489US6784525B2Semiconductor component having multi layered leadframeMICRON TECHNOLOGY INC·Filed 2002·Granted Aug 31, 2004·44 cites·43 claims
- 0587US8125092B2Semiconductor device packages and assembliesCORISIS DAVID J·Filed 2008·Granted Feb 28, 2012·15 cites·22 claims
- 0684US8384200B2Semiconductor device assemblies including face-to-face semiconductor dice and systems including such assembliesMICRON TECHNOLOGY INC·Filed 2006·Granted Feb 26, 2013·9 cites·35 claims
- 0783US6835599B2Method for fabricating semiconductor component with multi layered leadframeMICRON TECHNOLOGY INC·Filed 2003·Granted Dec 28, 2004·29 cites·22 claims
- 0881US7691682B2Build-up-package for integrated circuit devices, and methods of making sameMICRON TECHNOLOGY INC·Filed 2007·Granted Apr 6, 2010·7 cites·8 claims
- 0977US6903449B2Semiconductor component having chip on board leadframeMICRON TECHNOLOGY INC·Filed 2003·Granted Jun 7, 2005·20 cites·48 claims
- 1075US7465488B2Bow control in an electronic packageMICRON TECHNOLOGY INC·Filed 2006·Granted Dec 16, 2008·5 cites·22 claims
- 1173US9269695B2Semiconductor device assemblies including face-to-face semiconductor dice and related methodsMICRON TECHNOLOGY INC·Filed 2014·Granted Feb 23, 2016·2 cites·20 claims
- 1273US7049173B2Method for fabricating semiconductor component with chip on board leadframeMICRON TECHNOLOGY INC·Filed 2004·Granted May 23, 2006·15 cites·27 claims
- 1371US9673121B2Carrierless chip package for integrated circuit devices, and methods of making sameCORISIS DAVID J·Filed 2008·Granted Jun 6, 2017·3 cites·25 claims
- 1468US7459778B2Chip on board leadframe for semiconductor components having area arrayMICRON TECHNOLOGY INC·Filed 2006·Granted Dec 2, 2008·3 cites·28 claims
- 1566US7504285B2Carrierless chip package for integrated circuit devices, and methods of making sameMICRON TECHNOLOGY INC·Filed 2007·Granted Mar 17, 2009·2 cites·30 claims
- 1666US6972214B2Method for fabricating a semiconductor package with multi layered leadframeMICRON TECHNOLOGY INC·Filed 2004·Granted Dec 6, 2005·10 cites·21 claims
- 1762US6617201B2U-shape tape for BOC FBGA package to improve moldabilityMICRON TECHNOLOGY INC·Filed 2002·Granted Sep 9, 2003·11 cites·9 claims
- 1858US8444044B2Apparatus and methods for forming wire bondsWANG LOW PENG·Filed 2008·Granted May 21, 2013·4 cites·24 claims
- 1954US6486536B1U-shape tape for BOC FBGA package to improve moldabilityMICRON TECHNOLOGY INC·Filed 2000·Granted Nov 26, 2002·8 cites·13 claims
- 2053US9355992B2Land grid array semiconductor device packagesMICRON TECHNOLOGY INC·Filed 2014·Granted May 31, 2016·0 cites·22 claims
- 2153US7161236B2Bow control in an electronic packageMICRON TECHNOLOGY INC·Filed 2002·Granted Jan 9, 2007·4 cites·36 claims
- 2250US2007216033A1Carrierless chip package for integrated circuit devices, and methods of making sameCORISIS DAVID J·Filed 2006·Application pending·0 cites
- 2345US7235872B2Bow control in an electronic packageMICRON TECHNOLOGY INC·Filed 2004·Granted Jun 26, 2007·1 cites·59 claims
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