Inventor · disambiguated record
Yen-Yao Chi
Also filed as: Chi Yen-Yao
14 granted patents·3 pending applications·39 citations·filing 2015–2023
90Inventor score
Top patents by PatentIndex Score
17 records- 0196US9508664B1Semiconductor device structure comprising a plurality of metal oxide fibers and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Nov 29, 2016·11 cites·20 claims
- 0293US11742564B2Fan-out package structure with integrated antennaMEDIATEK INC·Filed 2021·Granted Aug 29, 2023·2 cites·5 claims
- 0393US11574881B2Semiconductor package structure with antennaMEDIATEK INC·Filed 2021·Granted Feb 7, 2023·2 cites·13 claims
- 0491US11081453B2Semiconductor package structure with antennaMEDIATEK INC·Filed 2019·Granted Aug 3, 2021·6 cites·16 claims
- 0589US11043730B2Fan-out package structure with integrated antennaMEDIATEK INC·Filed 2019·Granted Jun 22, 2021·5 cites·19 claims
- 0688US11652273B2Innovative air gap for antenna fan out packageMEDIATEK INC·Filed 2022·Granted May 16, 2023·1 cites·17 claims
- 0787US11024954B2Semiconductor package with antenna and fabrication method thereofMEDIATEK INC·Filed 2019·Granted Jun 1, 2021·5 cites·25 claims
- 0887US10163817B2Semiconductor device structure comprising a plurality of metal oxide fibers and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 25, 2018·3 cites·20 claims
- 0984US11450606B2Chip scale package structure and method of forming the sameMEDIATEK INC·Filed 2019·Granted Sep 20, 2022·3 cites·11 claims
- 1081US11508678B2Semiconductor package structure including antennaMEDIATEK INC·Filed 2020·Granted Nov 22, 2022·1 cites·20 claims
- 1173US11824020B2Semiconductor package structure including antennaMEDIATEK INC·Filed 2022·Granted Nov 21, 2023·0 cites·20 claims
- 1269US11854784B2Chip scale package structure and method of forming the sameMEDIATEK INC·Filed 2022·Granted Dec 26, 2023·0 cites·12 claims
- 1368US11791266B2Chip scale package structure and method of forming the sameMEDIATEK INC·Filed 2022·Granted Oct 17, 2023·0 cites·16 claims
- 1463US10943873B2Semiconductor device structure comprising a plurality of metal oxide fibers and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Mar 9, 2021·0 cites·20 claims
- 1559US2020312732A1Chip scale package structure and method of forming the sameMEDIATEK INC·Filed 2020·Application pending·0 cites
- 1656US2019348747A1Innovative air gap for antenna fan out packageMEDIATEK INC·Filed 2019·Application pending·0 cites
- 1756US2024178112A1Semiconductor package structure and method of forming the sameMEDIATEK INC·Filed 2023·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →