Inventor · disambiguated record
Ning-Cheng Lee
Also filed as: LEE NING · LEE NING C · LEE NING-CHENG
42 granted patents·15 pending applications·200 citations·filing 2001–2024
97Inventor score
Top patents by PatentIndex Score
57 records- 0195US8348139B2Composite solder alloy preformINDIUM CORP·Filed 2010·Granted Jan 8, 2013·25 cites·13 claims
- 0289US7435808B2Polynucleotides encoding novel adiponectin receptor variant, AdipoR2v2BRISTOL MYERS SQUIBB CO·Filed 2004·Granted Oct 14, 2008·18 cites·17 claims
- 0388US11267080B2Low temperature melting and mid temperature melting lead-free solder paste with mixed solder alloy powdersINDIUM CORP·Filed 2019·Granted Mar 8, 2022·5 cites·19 claims
- 0488US7223557B2Polynucleotide encoding a TRP channel family member, TRP-PLIK2BRISTOL MYERS SQUIBB CO·Filed 2002·Granted May 29, 2007·18 cites·21 claims
- 0587US7344882B2Polynucleotides encoding variants of the TRP channel family member, LTRPC3BRISTOL MYERS SQUIBB CO·Filed 2004·Granted Mar 18, 2008·13 cites·17 claims
- 0686US6610559B2Integrated void-free process for assembling a solder bumped chipINDIUM CORP AMERICA·Filed 2001·Granted Aug 26, 2003·51 cites·13 claims
- 0784US11752579B2High reliability leadfree solder alloys for harsh service conditionsINDIUM CORP·Filed 2020·Granted Sep 12, 2023·1 cites·20 claims
- 0884US9741676B1Tin-indium based low temperature solder alloyINDIUM CORP·Filed 2016·Granted Aug 22, 2017·3 cites·20 claims
- 0984US2025001530A1High reliability lead-free solder alloys for harsh environment electronics applicationsINDIUM CORP·Filed 2024·Application pending·0 cites
- 1083US7459532B2Variants of the TRP channel family member, LTRPC3GBRISTOL MYERS SQUIBB CO·Filed 2007·Granted Dec 2, 2008·4 cites·11 claims
- 1182US9175368B2MN doped SN-base solder alloy and solder joints thereof with superior drop shock reliabilityLIU WEIPING·Filed 2012·Granted Nov 3, 2015·2 cites·15 claims
- 1280US12240060B2SnIn solder alloysINDIUM CORP·Filed 2022·Granted Mar 4, 2025·0 cites·19 claims
- 1379US12090579B2High reliability lead-free solder alloys for harsh environment electronics applicationsINDIUM CORP·Filed 2022·Granted Sep 17, 2024·0 cites·12 claims
- 1479US7598348B2Adiponectin receptor variant, AdipoR2v2BRISTOL MYERS SQUIBB CO·Filed 2008·Granted Oct 6, 2009·2 cites·10 claims
- 1579US7017795B2Solder pastes for providing high elasticity, low rigidity solder jointsINDIUM CORP AMERICA·Filed 2004·Granted Mar 28, 2006·26 cites·19 claims
- 1678US9636784B2Mixed alloy solder pasteINDIUM CORP·Filed 2015·Granted May 2, 2017·3 cites·34 claims
- 1776US11738411B2Lead-free solder paste with mixed solder powders for high temperature applicationsINDIUM CORP·Filed 2021·Granted Aug 29, 2023·1 cites·18 claims
- 1874US7504481B2TRP channel family member, LTRPC3 polypeptidesBRISTOL MYERS CO·Filed 2003·Granted Mar 17, 2009·2 cites·12 claims
- 1972US11999018B2SnBi and SnIn solder alloysINDIUM CORP·Filed 2019·Granted Jun 4, 2024·0 cites·12 claims
- 2072US9260768B2Lead-free solder alloys and solder joints thereof with improved drop impact resistanceLIU WEIPING·Filed 2006·Granted Feb 16, 2016·1 cites·20 claims
- 2171US11229979B2High reliability lead-free solder alloys for harsh environment electronics applicationsINDIUM CORP·Filed 2016·Granted Jan 25, 2022·1 cites·12 claims
- 2271US10888958B2Hybrid high temperature lead-free solder preformINDIUM CORP·Filed 2018·Granted Jan 12, 2021·2 cites·19 claims
- 2370US11712762B2Low temperature melting and mid temperature melting lead-free solder paste with mixed solder alloy powdersINDIUM CORP·Filed 2022·Granted Aug 1, 2023·0 cites·21 claims
- 2470US10328533B2Hybrid lead-free solder wireINDIUM CORP·Filed 2017·Granted Jun 25, 2019·0 cites·25 claims
- 2570US7749340B2Technique for increasing the compliance of lead-free solders containing silverINDIUM CORP AMERICA·Filed 2006·Granted Jul 6, 2010·4 cites·28 claims
- 2665US11413709B2High reliability lead-free solder alloys for harsh environment electronics applicationsINDIUM CORP·Filed 2019·Granted Aug 16, 2022·0 cites·5 claims
- 2765US7705133B2Antibodies which bind variants of the TRP channel family member, LTRPC3BRISTOL MYERS SQUIBB CO·Filed 2008·Granted Apr 27, 2010·0 cites·22 claims
- 2864US10118260B2Mixed alloy solder pasteINDIUM CORP·Filed 2015·Granted Nov 6, 2018·1 cites·27 claims
- 2964US7767418B2Polynucleotide encoding a novel TRP channel family member, LTRPC3, and splice variants thereofBRISTOL MYERS SQUIBB CO·Filed 2008·Granted Aug 3, 2010·0 cites·16 claims
- 3064US7749336B2Technique for increasing the compliance of tin-indium soldersINDIUM CORP AMERICA·Filed 2006·Granted Jul 6, 2010·2 cites·7 claims
- 3163US9802274B2Hybrid lead-free solder wireINDIUM CORP·Filed 2016·Granted Oct 31, 2017·0 cites·22 claims
- 3260US7541434B2Polypeptide for a TRP channel family member, TRP-PLIK2, and splice variantsBRISTOL MYERS SQUIBB CO·Filed 2007·Granted Jun 2, 2009·0 cites·13 claims
- 3360US6677179B2Method of applying no-flow underfillINDIUM CORP AMERICA·Filed 2001·Granted Jan 13, 2004·13 cites·13 claims
- 3456US9017446B2Mixed alloy solder pasteZHANG HONGWEN·Filed 2010·Granted Apr 28, 2015·1 cites·27 claims
- 3554US2017373034A1Tin-indium based low temperature solder alloyINDIUM CORP·Filed 2017·Application pending·0 cites
- 3653US9190377B2Metal coating for indium bump bondingCHEN SIHAI·Filed 2011·Granted Nov 17, 2015·1 cites·18 claims
- 3751US2010116376A1Anti-tombstoning lead free alloys for surface mount reflow solderingHUANG BENLIH·Filed 2009·Application pending·0 cites
- 3851US2007256761A1Alloy compositions and techniques for reducing intermetallic compound thickness and oxidation of metals and alloysINDIUM CORP AMERICA·Filed 2007·Application pending·0 cites
- 3950US9120930B2Heat dissipating paint with high thermal radiating capabilityCHEN SIHAI·Filed 2012·Granted Sep 1, 2015·0 cites·17 claims
- 4050US2011273847A1Alloy compositions and techniques for reducing intermetallic compound thicknesses and oxidation of metals and alloysHWANG HONG-SIK·Filed 2011·Application pending·0 cites
- 4147US11807536B2Method for preparing graphite sheets with piercing treatment to enhance thermal conductionINDIUM CORP·Filed 2020·Granted Nov 7, 2023·0 cites·10 claims
- 4246US2003162189A1Polynucleotide encoding a novel TRP channel family member, LTRPC3, and splice variants thereofFiled 2002·Application pending·0 cites
- 4344US10756039B2Fluxes effective in suppressing non-wet-open at BGA assemblyINDIUM CORP·Filed 2018·Granted Aug 25, 2020·0 cites·13 claims
- 4444US2023241725A1Solder pastes and methods of using the sameLEE NING CHENG·Filed 2022·Application pending·0 cites
- 4543US11581239B2Lead-free solder paste as thermal interface materialINDIUM CORP·Filed 2020·Granted Feb 14, 2023·0 cites·11 claims
- 4643US9875983B2Nanomicrocrystallite paste for pressureless sinteringINDIUM CORP·Filed 2016·Granted Jan 23, 2018·0 cites·20 claims
- 4743US2007071634A1Low melting temperature compliant soldersINDIUM CORP AMERICA·Filed 2006·Application pending·0 cites
- 4841US10813228B2Preventing post reflow interconnect failures in VIPPO solder joints via utilization of adhesive materialINDIUM CORP·Filed 2019·Granted Oct 20, 2020·0 cites·19 claims
- 4941US10010981B2Materials having increased mobility after heatingLEE NING CHENG·Filed 2008·Granted Jul 3, 2018·0 cites·25 claims
- 5038US2005100474A1Anti-tombstoning lead free alloys for surface mount reflow solderingFiled 2004·Application pending·0 cites
Showing the top 50 of 57 patent records by PatentIndex Score.
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