Inventor · disambiguated record
Ming-Sheng Yang
Also filed as: YANG MING · YANG MING-SHENG
68 granted patents·20 pending applications·1,392 citations·filing 1995–2020
99Inventor score
Files withUNITED MICROELECTRONICS CORP46NEC LAB AMERICA INC7HUANG CHAO-YUAN6IPENVAL CONSULTANT INC3PERSONAL GENOMICS INC2
Top patents by PatentIndex Score
88 records- 0197US7253095B2Air gap formation method for reducing undesired capacitive coupling between interconnects in an integrated circuit deviceUNITED MICROELECTRONICS CORP·Filed 2005·Granted Aug 7, 2007·59 cites·16 claims
- 0296US8582807B2Systems and methods for determining personal characteristicsYANG MING·Filed 2010·Granted Nov 12, 2013·93 cites·20 claims
- 0395US8379920B2Real-time clothing recognition in surveillance videosNEC LAB AMERICA INC·Filed 2011·Granted Feb 19, 2013·42 cites·20 claims
- 0494US8345984B23D convolutional neural networks for automatic human action recognitionNEC LAB AMERICA INC·Filed 2010·Granted Jan 1, 2013·137 cites·18 claims
- 0594US6365527B1Method for depositing silicon carbide in semiconductor devicesUNITED MICROELECTRONICS CORP·Filed 2000·Granted Apr 2, 2002·77 cites·13 claims
- 0693US7138329B2Air gap for tungsten/aluminum plug applicationsUNITED MICROELECTRONICS CORP·Filed 2002·Granted Nov 21, 2006·74 cites·34 claims
- 0791US6383913B1Method for improving surface wettability of low k materialUNITED MICROELECTRONICS CORP·Filed 2001·Granted May 7, 2002·62 cites·20 claims
- 0891US6323123B1Low-K dual damascene integration processUNITED MICROELECTRONICS CORP·Filed 2000·Granted Nov 27, 2001·71 cites·19 claims
- 0990US7449407B2Air gap for dual damascene applicationsUNITED MICROELECTRONICS CORP·Filed 2002·Granted Nov 11, 2008·59 cites·25 claims
- 1090US6917109B2Air gap structure and formation method for reducing undesired capacitive coupling between interconnects in an integrated circuit deviceUNITED MICORELECTRONICS CORP·Filed 2002·Granted Jul 12, 2005·61 cites·20 claims
- 1188US8890607B2Stacked chip systemHUANG CHAO-YUAN·Filed 2013·Granted Nov 18, 2014·12 cites·16 claims
- 1286US6410446B1Method for gap fillingUNITED MICROELECTRONICS CORP·Filed 2000·Granted Jun 25, 2002·29 cites·10 claims
- 1385US8878595B2Switchable readout deviceUNIV NAT CHI NAN·Filed 2013·Granted Nov 4, 2014·7 cites·6 claims
- 1484US6429115B1Method of manufacturing multilevel interconnects including performing a surface treatment to form a hydrophilic surface layerUNITED MICROELECTRONICS CORP·Filed 2001·Granted Aug 6, 2002·39 cites·24 claims
- 1579US8787682B2Fast image classification by vocabulary tree based image retrievalYANG MING·Filed 2011·Granted Jul 22, 2014·9 cites·18 claims
- 1678US9012847B2Switchable readout deviceUNIV NAT CHI NAN·Filed 2014·Granted Apr 21, 2015·4 cites·6 claims
- 1778US6001733AMethod of forming a dual damascene with dummy metal linesUNITED MICROELECTRONICS CORP·Filed 1998·Granted Dec 14, 1999·54 cites·8 claims
- 1877US6077147AChemical-mechanical polishing station with end-point monitoring deviceUNITED MICROELECTRONICS CORP·Filed 1999·Granted Jun 20, 2000·42 cites·10 claims
- 1976US6429152B1Method of forming a thin film on a semiconductor waferUNITED MICROELECTRONICS CORP·Filed 2001·Granted Aug 6, 2002·18 cites·19 claims
- 2075US9812597B2Optical sensor and manufacturing method thereofPERSONAL GENOMICS INC·Filed 2015·Granted Nov 7, 2017·2 cites·8 claims
- 2175US6344408B1Method for improving non-uniformity of chemical mechanical polishing by over coatingUNITED MICROELECTRONICS CORP·Filed 1999·Granted Feb 5, 2002·44 cites·20 claims
- 2273US11546234B2Network quality determining method and apparatus and storage mediumHUAWEI TECH CO LTD·Filed 2020·Granted Jan 3, 2023·1 cites·20 claims
- 2373US6440861B1Method of forming dual damascene structureUNITED MICROELECTRONICS CORP·Filed 2000·Granted Aug 27, 2002·21 cites·15 claims
- 2472US8762390B2Query specific fusion for image retrievalNEC LAB AMERICA INC·Filed 2012·Granted Jun 24, 2014·4 cites·11 claims
- 2572US6905938B2Method of forming interconnect structure with low dielectric constantUNITED MICROELECTRONICS CORP·Filed 2002·Granted Jun 14, 2005·17 cites·17 claims
- 2672US6365228B1Process for spin-on coating with an organic material having a low dielectric constantUNITED MICROELECTRONICS CORP·Filed 2000·Granted Apr 2, 2002·14 cites·11 claims
- 2771US8891908B2Semantic-aware co-indexing for near-duplicate image retrievalNEC LAB AMERICA INC·Filed 2013·Granted Nov 18, 2014·3 cites·18 claims
- 2870US8952500B2Semiconductor deviceIPENVAL CONSULTANT INC·Filed 2013·Granted Feb 10, 2015·3 cites·15 claims
- 2970US6790742B2Chemical mechanical polishing in forming semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2002·Granted Sep 14, 2004·14 cites·23 claims
- 3069US6197681B1Forming copper interconnects in dielectric materials with low constant dielectricsUNITED MICROELECTRONICS CORP·Filed 1999·Granted Mar 6, 2001·38 cites·17 claims
- 3169US6169028B1Method fabricating metal interconnected structureUNITED MICROELECTRONICS CORP·Filed 1999·Granted Jan 2, 2001·34 cites·18 claims
- 3269US5487485ALiner for a cargo containerCHI MEI CORP·Filed 1995·Granted Jan 30, 1996·53 cites·17 claims
- 3367US6858487B2Method of manufacturing a semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2003·Granted Feb 22, 2005·10 cites·22 claims
- 3467US6677231B1Method for increasing adhesion ability of dielectric material in semiconductorUNITED MICROELECTRONICS CORP·Filed 2000·Granted Jan 13, 2004·10 cites·24 claims
- 3567US6406978B1Method of removing silicon carbideUNITED MICROELECTRONICS CORP·Filed 2000·Granted Jun 18, 2002·11 cites·20 claims
- 3666US9030025B2Integrated circuit layoutHUANG CHAO-YUAN·Filed 2013·Granted May 12, 2015·2 cites·20 claims
- 3764US6461230B1Chemical-mechanical polishing methodUNITED MICROELECTRONICS CORP·Filed 2000·Granted Oct 8, 2002·9 cites·13 claims
- 3862US6723609B2Method of preventing leakage current of a metal-oxide semiconductor transistorUNITED MICROELECTRONICS CORP·Filed 2002·Granted Apr 20, 2004·10 cites·19 claims
- 3961US8892542B2Contextual weighting and efficient re-ranking for vocabulary tree based image retrievalWANG XIAOYU·Filed 2011·Granted Nov 18, 2014·2 cites·14 claims
- 4061US6455432B1Method for removing carbon-rich particles adhered on a copper surfaceUNITED MICROELECTRONICS CORP·Filed 2000·Granted Sep 24, 2002·8 cites·35 claims
- 4161US6387813B1Method for stripping a low dielectric film with high carbon contentUNITED MICROELECTRONICS CORP·Filed 2000·Granted May 14, 2002·7 cites·9 claims
- 4261US6376394B1Method of forming inter-metal dielectric layerUNITED MICROELECTRONICS CORP·Filed 2000·Granted Apr 23, 2002·9 cites·19 claims
- 4361US6214745B1Method of improving surface planarity of chemical-mechanical polishing operation by forming shallow dummy patternUNITED MICROELECTRONICS CORP·Filed 1998·Granted Apr 10, 2001·21 cites·15 claims
- 4460US10566476B2Optical sensor and manufacturing method thereofPERSONAL GENOMICS INC·Filed 2017·Granted Feb 18, 2020·0 cites·13 claims
- 4560US9042601B2Selective max-pooling for object detectionNEC LAB AMERICA INC·Filed 2013·Granted May 26, 2015·2 cites·15 claims
- 4660US6380069B1Method of removing micro-scratch on metal layerUNITED MICROELECTRONICS CORP·Filed 2000·Granted Apr 30, 2002·10 cites·18 claims
- 4757US9678169B2Testing assembly for testing magnetic sensor and method for testing magnetic sensorVOLTAFIELD TECH CORP·Filed 2014·Granted Jun 13, 2017·1 cites·8 claims
- 4855US9020248B2Window dependent feature regions and strict spatial layout for object detectionNEC LAB AMERICA INC·Filed 2013·Granted Apr 28, 2015·1 cites·18 claims
- 4953US6410106B2Method of forming an intermetal dielectric layerUNITED MICROELECTRONICS CROP·Filed 2001·Granted Jun 25, 2002·3 cites·1 claims
- 5053US6036356AIn-situ slurry mixing apparatusUNITED MICROELECTRONICS CORP·Filed 1998·Granted Mar 14, 2000·17 cites·18 claims
Showing the top 50 of 88 patent records by PatentIndex Score.
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