Inventor · disambiguated record
Ji-Seok Hong
Also filed as: HONG JI-SEOK
30 granted patents·10 pending applications·143 citations·filing 2008–2024
96Inventor score
Top patents by PatentIndex Score
40 records- 0197US11145626B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Oct 12, 2021·19 cites·6 claims
- 0296US11056432B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Jul 6, 2021·14 cites·20 claims
- 0396US10886255B2Die stack structure, semiconductor package having the same and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Jan 5, 2021·17 cites·20 claims
- 0493US8901727B2Semiconductor packages, methods of manufacturing semiconductor packages, and systems including semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Dec 2, 2014·30 cites·27 claims
- 0590US11329024B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted May 10, 2022·2 cites·20 claims
- 0690US9054228B2Semiconductor packages including a heat spreader and methods of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Jun 9, 2015·12 cites·20 claims
- 0788US10790264B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Sep 29, 2020·4 cites·20 claims
- 0885US11581257B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Feb 14, 2023·1 cites·20 claims
- 0981US8552546B2Semiconductor package, semiconductor package structure including the semiconductor package, and mobile phone including the semiconductor package structureSONG IN-SANG·Filed 2010·Granted Oct 8, 2013·11 cites·19 claims
- 1079US11658148B2Semiconductor package and a method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted May 23, 2023·1 cites·20 claims
- 1179US8254140B2Mounting substrateLEE KWANG-YONG·Filed 2009·Granted Aug 28, 2012·8 cites·17 claims
- 1277US10910346B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Feb 2, 2021·2 cites·20 claims
- 1377US8940557B2Method of fabricating wafer level packageSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Jan 27, 2015·4 cites·17 claims
- 1477US8288210B2Semiconductor package, electrical and electronic apparatus including the semiconductor package, and method of manufacturing the semiconductor packageLEE JONG-GI·Filed 2011·Granted Oct 16, 2012·4 cites·13 claims
- 1577US2024332255A1Semiconductor package and a method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1676US12040313B2Semiconductor package and a method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Jul 16, 2024·0 cites·20 claims
- 1773US12014977B2Interconnection structure, method of fabricating the same, and semiconductor package including interconnection structureSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Jun 18, 2024·0 cites·20 claims
- 1873US8958011B2Bi-directional camera module and flip chip bonder including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Feb 17, 2015·2 cites·15 claims
- 1972US11984425B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted May 14, 2024·0 cites·20 claims
- 2072US11088038B2Semiconductor package including test padSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Aug 10, 2021·1 cites·11 claims
- 2169US8420989B2Coil and semiconductor apparatus having the sameKIM MINILL·Filed 2009·Granted Apr 16, 2013·6 cites·4 claims
- 2268US8816509B2Semiconductor package including underfill layersSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Aug 26, 2014·2 cites·9 claims
- 2365US8324522B2Reflow apparatus, reflow method, and package apparatusKIM MINILL·Filed 2009·Granted Dec 4, 2012·3 cites·17 claims
- 2463US11887900B2Semiconductor package including test padSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jan 30, 2024·0 cites·18 claims
- 2563US11887968B2Method of manufacturing a semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jan 30, 2024·0 cites·12 claims
- 2663US11688679B2Interconnection structure, method of fabricating the same, and semiconductor package including interconnection structureSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jun 27, 2023·0 cites·17 claims
- 2760US2025079393A1Semiconductor package and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2858US2024413104A1Semiconductor device and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2953US11824006B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Nov 21, 2023·0 cites·20 claims
- 3051US8536045B2Reflow methodSAMSUNG ELECTRONICS CO LTD·Filed 2012·Granted Sep 17, 2013·0 cites·20 claims
- 3150US8664762B2Semiconductor package, electrical and electronic apparatus including the semiconductor package, and method of manufacturing the semiconductor packageLEE JONG-GI·Filed 2012·Granted Mar 4, 2014·0 cites·9 claims
- 3246US12328869B2Semiconductor memory devices and methods for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jun 10, 2025·0 cites·15 claims
- 3346US9159659B2Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Oct 13, 2015·0 cites·16 claims
- 3446US2010144137A1Method of interconnecting chips using capillary motionSAMSUNG ELECTRONICS CO LTD·Filed 2009·Application pending·0 cites
- 3546US2010096754A1Semiconductor package, semiconductor module, and method for fabricating the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2009·Application pending·0 cites
- 3645US2008308913A1Stacked semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 3745US2009026596A1Lead frame, semiconductor package, and stacked semiconductor package having the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 3845US2015130078A1Semiconductor chip and semiconductor package having sameHONG JI-SEOK·Filed 2014·Application pending·0 cites
- 3942US2014239478A1Semiconductor device and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Application pending·0 cites
- 4033US2012234497A1Debonder to manufacture semiconductor and debonding method thereofHAN IL YOUNG·Filed 2012·Application pending·0 cites
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