Inventor · disambiguated record
Yu-Lin Yen
Also filed as: YEN YU-LIN
25 granted patents·134 citations·filing 2002–2015
95Inventor score
Top patents by PatentIndex Score
25 records- 0195US8692382B2Chip packageYEN YU-LIN·Filed 2011·Granted Apr 8, 2014·23 cites·25 claims
- 0294US8525345B2Chip package and method for forming the sameYEN YU-LIN·Filed 2011·Granted Sep 3, 2013·21 cites·18 claims
- 0387US8575634B2Chip package and method for fabricating the sameLIU TSANG-YU·Filed 2010·Granted Nov 5, 2013·9 cites·21 claims
- 0477US9559001B2Chip package and method for forming the sameYEN YU-LIN·Filed 2011·Granted Jan 31, 2017·5 cites·21 claims
- 0577US8698316B2Chip packageYEN YU-LIN·Filed 2011·Granted Apr 15, 2014·3 cites·26 claims
- 0677US7323393B2Method of reducing film stress on overlay markMACRONIX INT CO LTD·Filed 2007·Granted Jan 29, 2008·6 cites·13 claims
- 0776US8581386B2Chip packageYEN YU-LIN·Filed 2012·Granted Nov 12, 2013·4 cites·20 claims
- 0875US7196429B2Method of reducing film stress on overlay markMACRONIX INT CO LTD·Filed 2004·Granted Mar 27, 2007·18 cites·12 claims
- 0974US9136241B2Chip package and manufacturing method thereofYEN YU-LIN·Filed 2012·Granted Sep 15, 2015·4 cites·24 claims
- 1073US9184092B2Chip package and method for forming the sameXINTEC INC·Filed 2014·Granted Nov 10, 2015·2 cites·32 claims
- 1173US8552565B2Chip package and method for forming the sameYEN YU-LIN·Filed 2011·Granted Oct 8, 2013·3 cites·17 claims
- 1270US8951836B2Chip package and method for forming the sameXINTEC INC·Filed 2014·Granted Feb 10, 2015·2 cites·20 claims
- 1370US8536671B2Chip packageLIU TSANG-YU·Filed 2011·Granted Sep 17, 2013·3 cites·28 claims
- 1468US9236429B2Semiconductor structure and manufacturing method thereofXINTEC INC·Filed 2015·Granted Jan 12, 2016·2 cites·12 claims
- 1568US7781126B2Mask and pattern forming method by using the sameMACRONIX INT CO LTD·Filed 2005·Granted Aug 24, 2010·2 cites·6 claims
- 1667US9024437B2Chip package and method for forming the sameYEN YU-LIN·Filed 2012·Granted May 5, 2015·2 cites·19 claims
- 1767US7125741B2Rework process of patterned photo-resist layerMACRONIX INT CO LTD·Filed 2003·Granted Oct 24, 2006·10 cites·16 claims
- 1862US8003442B2Integrated cirucit package and method for fabrication thereofYEN YU-LIN·Filed 2007·Granted Aug 23, 2011·2 cites·13 claims
- 1958US7192845B2Method of reducing alignment measurement errors between device layersMACRONIX INT CO LTD·Filed 2004·Granted Mar 20, 2007·7 cites·17 claims
- 2056US7314813B2Methods of forming planarized multilevel metallization in an integrated circuitMACRONIX INT CO LTD·Filed 2004·Granted Jan 1, 2008·5 cites·18 claims
- 2146US8624383B2Integrated circuit package and method for fabrication thereofYEN YU-LIN·Filed 2010·Granted Jan 7, 2014·0 cites·20 claims
- 2245US8415088B2Method for forming a material layerYEN YU-LIN·Filed 2006·Granted Apr 9, 2013·0 cites·12 claims
- 2344US6960411B2Mask with extended mask clear-out window and method of dummy exposure using the sameMACRONIX INT CO LTD·Filed 2002·Granted Nov 1, 2005·1 cites·16 claims
- 2440US9196589B2Stacked wafer structure and method for stacking a waferXINTEC INC·Filed 2013·Granted Nov 24, 2015·0 cites·10 claims
- 2531US7097921B2Sandwich arc structure for preventing metal to contact from shiftingMACRONIX INT CO LTD·Filed 2003·Granted Aug 29, 2006·0 cites·8 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →