Inventor · disambiguated record
Jui-Pin Hung
Also filed as: HUNG JUI-PIN
137 granted patents·6 pending applications·7,025 citations·filing 2006–2025
99Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD89TAIWAN SEMICONDUCTOR MFG28LIN JING-CHENG8YU CHEN-HUA6HUNG JUI-PIN3
Top patents by PatentIndex Score
143 records- 0199US9263511B2Package with metal-insulator-metal capacitor and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Feb 16, 2016·1k cites·20 claims
- 0299US9048222B2Method of fabricating interconnect structure for package-on-package devicesTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jun 2, 2015·1.1k cites·20 claims
- 0399US8877554B2Packaged semiconductor devices, methods of packaging semiconductor devices, and PoP devicesTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Nov 4, 2014·621 cites·20 claims
- 0499US8829676B2Interconnect structure for wafer level packageYU CHEN-HUA·Filed 2011·Granted Sep 9, 2014·610 cites·20 claims
- 0599US8785299B2Package with a fan-out structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Jul 22, 2014·583 cites·19 claims
- 0699US8703542B2Wafer-level packaging mechanismsLIN JING-CHENG·Filed 2012·Granted Apr 22, 2014·584 cites·20 claims
- 0798US9460987B2Interconnect structure for package-on-package devices and a method of fabricatingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Oct 4, 2016·22 cites·20 claims
- 0898US9378982B2Die package with openings surrounding end-portions of through package vias (TPVs) and package on package (PoP) using the die packageTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jun 28, 2016·45 cites·20 claims
- 0998US9373527B2Chip on package structure and methodTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Jun 21, 2016·46 cites·20 claims
- 1098US9159678B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Oct 13, 2015·42 cites·18 claims
- 1198US9111914B2Fan out package, semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Aug 18, 2015·40 cites·20 claims
- 1298US9064879B2Packaging methods and structures using a die attach filmHUNG JUI-PIN·Filed 2011·Granted Jun 23, 2015·836 cites·20 claims
- 1398US9000584B2Packaged semiconductor device with a molding compound and a method of forming the sameLIN JING-CHENG·Filed 2011·Granted Apr 7, 2015·1k cites·20 claims
- 1498US8952544B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Feb 10, 2015·42 cites·17 claims
- 1598US8779599B2Packages including active dies and dummy dies and methods for forming the sameLIN JING-CHENG·Filed 2011·Granted Jul 15, 2014·48 cites·14 claims
- 1697US9985006B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 29, 2018·14 cites·20 claims
- 1797US9935080B2Three-layer Package-on-Package structure and method forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 3, 2018·15 cites·10 claims
- 1897US9922903B2Interconnect structure for package-on-package devices and a method of fabricatingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Mar 20, 2018·12 cites·20 claims
- 1997US9425121B2Integrated fan-out structure with guiding trenches in buffer layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Aug 23, 2016·25 cites·20 claims
- 2096US10269778B2Package on package (PoP) bonding structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 23, 2019·14 cites·20 claims
- 2196US9553000B2Interconnect structure for wafer level packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jan 24, 2017·13 cites·20 claims
- 2296US9431367B2Method of forming a semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Aug 30, 2016·17 cites·19 claims
- 2395US10079225B2Die package with openings surrounding end-portions of through package vias (TPVs) and package on package (PoP) using the die packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Sep 18, 2018·10 cites·20 claims
- 2495US9368438B2Package on package (PoP) bonding structuresTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jun 14, 2016·18 cites·20 claims
- 2594US10269685B2Interconnect structure for package-on-package devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 23, 2019·6 cites·20 claims
- 2693US10276516B2Semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 30, 2019·6 cites·20 claims
- 2793US9978657B2Semiconductor package device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 22, 2018·7 cites·19 claims
- 2893US8927412B1Multi-chip package and method of formationTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jan 6, 2015·12 cites·20 claims
- 2992US11037861B2Interconnect structure for package-on-package devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 15, 2021·4 cites·20 claims
- 3092US10163876B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 25, 2018·5 cites·20 claims
- 3191US10163860B2Semiconductor package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 25, 2018·8 cites·20 claims
- 3291US9997471B2Semiconductor package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jun 12, 2018·6 cites·20 claims
- 3391US8941244B1Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jan 27, 2015·12 cites·19 claims
- 3491US8916972B2Adhesion between post-passivation interconnect structure and polymerTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Dec 23, 2014·15 cites·20 claims
- 3590US10515930B2Three-layer package-on-package structure and method forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 24, 2019·4 cites·20 claims
- 3689US10515875B2Interconnect structure for package-on-package devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 24, 2019·3 cites·20 claims
- 3789US10368442B2Integrated circuit structure and method of formingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jul 30, 2019·4 cites·20 claims
- 3889US10050024B2Semiconductor package and manufacturing method of the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Aug 14, 2018·5 cites·20 claims
- 3989US8946742B2Semiconductor package with through silicon viasYU CHEN-HUA·Filed 2010·Granted Feb 3, 2015·7 cites·20 claims
- 4089US8872326B2Three dimensional (3D) fan-out packaging mechanismsLIN JING-CHENG·Filed 2012·Granted Oct 28, 2014·6 cites·20 claims
- 4188US9633895B2Integrated fan-out structure with guiding trenches in buffer layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 25, 2017·4 cites·20 claims
- 4288US9595510B1Structure and formation method for chip packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Mar 14, 2017·4 cites·20 claims
- 4388US9337063B2Package for three dimensional integrated circuitTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted May 10, 2016·8 cites·18 claims
- 4488US8827695B2Wafer's ambiance controlHSIAO YI-LI·Filed 2009·Granted Sep 9, 2014·14 cites·20 claims
- 4588US8109407B2Apparatus for storing substratesHSIAO YI-LI·Filed 2007·Granted Feb 7, 2012·14 cites·21 claims
- 4687US9142432B2Integrated fan-out package structures with recesses in molding compoundTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Sep 22, 2015·5 cites·20 claims
- 4787US8936966B2Packaging methods for semiconductor devicesHUNG JUI-PIN·Filed 2012·Granted Jan 20, 2015·8 cites·20 claims
- 4886US9960125B2Method of forming a semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 1, 2018·3 cites·20 claims
- 4986US9691706B2Multi-chip fan out package and methods of forming the sameYU CHEN-HUA·Filed 2012·Granted Jun 27, 2017·6 cites·18 claims
- 5086US8703539B2Multiple die packaging interposer structure and methodYU CHEN-HUA·Filed 2012·Granted Apr 22, 2014·7 cites·15 claims
Showing the top 50 of 143 patent records by PatentIndex Score.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →