Inventor · disambiguated record
Hyo-Bin Park
Also filed as: PARK HYO BIN
3 granted patents·3 pending applications·12 citations·filing 2009–2018
64Inventor score
Technology areasH10W
Top patents by PatentIndex Score
6 records- 0179US9040838B2Method for forming solder resist and substrate for packageSAMSUNG ELECTRO MECH·Filed 2013·Granted May 26, 2015·6 cites·6 claims
- 0278US10553452B2Printed circuit board, method, and semiconductor packageSAMSUNG ELECTRO MECH·Filed 2016·Granted Feb 4, 2020·4 cites·7 claims
- 0359US8206530B2Manufacturing method of printed circuit board having electro componentLEE DOO-HWAN·Filed 2009·Granted Jun 26, 2012·2 cites·7 claims
- 0443US2014331493A1Method of fabricating a package substrateSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 0541US2013168853A1Package substrate and method of fabricating the sameSAMSUNG ELECTRO MECH·Filed 2012·Application pending·0 cites
- 0638US2019355813A1Semiconductor device including device isolation layerSAMSUNG ELECTRONICS CO LTD·Filed 2018·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →