Inventor · disambiguated record
Chung-Ju Wu
Also filed as: WU CHUNG J · WU CHUNG-JU
26 granted patents·16 pending applications·384 citations·filing 1999–2024
96Inventor score
Top patents by PatentIndex Score
42 records- 0195US6395996B1Multi-layered substrate with a built-in capacitor designSILICON INTEGRATED SYS CORP·Filed 2000·Granted May 28, 2002·104 cites·1 claims
- 0294US7307844B2Heat dissipation mechanism for electronic apparatusSILICON INTEGRATED SYS CORP·Filed 2005·Granted Dec 11, 2007·33 cites·22 claims
- 0387US7209354B2Ball grid array package with heat sink deviceSILICON INTERGRATED SYSTEMS CO·Filed 2003·Granted Apr 24, 2007·47 cites·16 claims
- 0485US6747350B1Flip chip package structureSILICON INTEGRATED SYS CORP·Filed 2003·Granted Jun 8, 2004·51 cites·10 claims
- 0582US6116427ATray for ball grid array devicesSILICON INTEGRATED SYS CORP·Filed 2000·Granted Sep 12, 2000·30 cites·7 claims
- 0673US6524942B2Bond pad structure and its method of fabricatingSILICON INTEGRATED SYS CORP·Filed 2002·Granted Feb 25, 2003·17 cites·10 claims
- 0772US6653574B2Multi-layered substrate with a built-in capacitor design and a method of making the sameSILICON INTEGRATED SYS CORP·Filed 2001·Granted Nov 25, 2003·17 cites·3 claims
- 0872US6509646B1Apparatus for reducing an electrical noise inside a ball grid array packageSILICON INTEGRATED SYS CORP·Filed 2000·Granted Jan 21, 2003·18 cites·7 claims
- 0971US8666456B2Handheld electronic apparatusLIU CHENG-HSI·Filed 2012·Granted Mar 4, 2014·5 cites·8 claims
- 1062US9547282B2Wearable device with wireless transmission and method for manufacturing the sameHTC CORP·Filed 2015·Granted Jan 17, 2017·1 cites·22 claims
- 1162US2024415246A1Wearable device and upper head strap moduleHTC CORP·Filed 2024·Application pending·0 cites
- 1261US12025295B2Wearable device and head strap moduleHTC CORP·Filed 2022·Granted Jul 2, 2024·0 cites·11 claims
- 1360US6933600B2Substrate for semiconductor packageSILICON INTEGRATED SYS CORP·Filed 2002·Granted Aug 23, 2005·10 cites·5 claims
- 1459US6365970B1Bond pad structure and its method of fabricatingSILICON INTEGRATED SYS CORP·Filed 1999·Granted Apr 2, 2002·21 cites·18 claims
- 1558US6765301B2Integrated circuit bonding device and manufacturing method thereofSILICON INTEGRATED SYS CORP·Filed 2002·Granted Jul 20, 2004·9 cites·4 claims
- 1658US6753595B1Substrates for semiconductor devices with shielding for NC contactsSILICON INTEGRATED SYS CORP·Filed 2003·Granted Jun 22, 2004·9 cites·13 claims
- 1757US6882037B2Die paddle for receiving an integrated circuit die in a plastic substrateSILICON INTEGRATED SYS CORP·Filed 2002·Granted Apr 19, 2005·7 cites·18 claims
- 1857US2025009081A1Wearable device and head strap moduleHTC CORP·Filed 2024·Application pending·0 cites
- 1955US11927303B2Wearable deviceHTC CORP·Filed 2022·Granted Mar 12, 2024·0 cites·7 claims
- 2053US9475016B2Fluid mixing structureHTC CORP·Filed 2014·Granted Oct 25, 2016·0 cites·6 claims
- 2153US8539462B2Method for allocating registers for a processor based on cycle informationWU CHUNG JU·Filed 2010·Granted Sep 17, 2013·1 cites·13 claims
- 2247US9669408B2Slight volume collectorHTC CORP·Filed 2014·Granted Jun 6, 2017·0 cites·9 claims
- 2346US8051411B2Method for copy propagations for a processor with distributed register file designNAT UNIV TSING HUA·Filed 2007·Granted Nov 1, 2011·0 cites·10 claims
- 2445US7193314B2Semiconductor devices and substrates used in thereofSILICON INTEGRATED SYS CORP·Filed 2003·Granted Mar 20, 2007·2 cites·19 claims
- 2545US6744128B2Integrated circuit package capable of improving signal qualitySILICON INTEGRATED SYS CORP·Filed 2002·Granted Jun 1, 2004·2 cites·11 claims
- 2645US2016151783A1Analysis device and detecting moduleHTC CORP·Filed 2014·Application pending·0 cites
- 2744US2016067709A1Micro-channel moduleHTC CORP·Filed 2014·Application pending·0 cites
- 2843US2007040279A1Switching device for altering built-in function of IC chipSILICON INTEGRATED SYS CORP·Filed 2005·Application pending·0 cites
- 2941US9897620B2Gas detection device and gas inlet module thereofHTC CORP·Filed 2015·Granted Feb 20, 2018·0 cites·19 claims
- 3041US2007241456A1Conductive structure for electronic deviceSILICON INTEGRATED SYS CORP·Filed 2006·Application pending·0 cites
- 3141US2013024666A1Method of scheduling a plurality of instructions for a processorNAT UNIV TSING HUA·Filed 2011·Application pending·0 cites
- 3239US2007057351A1Structure of IC packaging and method forming the sameSILICON INTEGRATED SYS CORP·Filed 2006·Application pending·0 cites
- 3337US6838756B2Chip-packaging substrateSILICON INTEGRATED SYS CORP·Filed 2002·Granted Jan 4, 2005·0 cites·20 claims
- 3437US2005093136A1Thermal dissipating element of a chipFiled 2003·Application pending·0 cites
- 3537US2005093135A1Thermal dissipating element of a chipFiled 2003·Application pending·0 cites
- 3637US2009029537A1Method for forming semiconductor package and mold cast used for the sameSILICON INTEGRATED SYS CORP·Filed 2007·Application pending·0 cites
- 3735US2003111709A1Packing device for embedding a capacitor on chipSILICON INTEGRATED SYS CORP·Filed 2002·Application pending·0 cites
- 3835US2006226534A1Structure and assembly method of integrated circuit packageSILICON INTEGRATED SYS CORP·Filed 2006·Application pending·0 cites
- 3934US2003067048A1Integrated circuit deviceFiled 2002·Application pending·0 cites
- 4031US2002163073A1Multi-layer substrate for an IC chipFiled 2001·Application pending·0 cites
- 4130US2007277997A1Substrate and layout methodLIANG WEI-AN·Filed 2006·Application pending·0 cites
- 4229US8510539B2Spilling method involving register files based on communication costs and use ratioLU CHIA HAN·Filed 2010·Granted Aug 13, 2013·0 cites·9 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →