Inventor · disambiguated record
Chien-Te Feng
Also filed as: FENG CHIEN-TE
9 granted patents·3 pending applications·29 citations·filing 2008–2023
83Inventor score
Top patents by PatentIndex Score
12 records- 0188US8304871B2Exposed die package for direct surface mountingYU FRANK·Filed 2011·Granted Nov 6, 2012·13 cites·16 claims
- 0283US8470644B2Exposed die package for direct surface mountingTEXAS INSTRUMENTS INC·Filed 2012·Granted Jun 25, 2013·7 cites·4 claims
- 0365US8058706B2Delamination resistant packaged die having support and shaped die having protruding lip on supportFENG CHIEN-TE·Filed 2009·Granted Nov 15, 2011·5 cites·17 claims
- 0461US7928544B2Semiconductor chip package assembly with deflection- resistant leadfingersTEXAS INSTRUMENTS INC·Filed 2008·Granted Apr 19, 2011·3 cites·8 claims
- 0557US8456021B2Integrated circuit device having die bonded to the polymer side of a polymer substrateFENG CHIEN-TE·Filed 2010·Granted Jun 4, 2013·1 cites·21 claims
- 0651US12100649B2Package comprising an integrated device with a back side metal layerQUALCOMM INC·Filed 2021·Granted Sep 24, 2024·0 cites·34 claims
- 0751US2024396227A1Antenna module having antenna in mold layer, and related fabrication methodsQUALCOMM INC·Filed 2023·Application pending·0 cites
- 0848US8039955B2Mold lock on heat spreaderTEXAS INSTRUMENTS INC·Filed 2009·Granted Oct 18, 2011·0 cites·20 claims
- 0942US8008131B2Semiconductor chip package assembly method and apparatus for countering leadfinger deformationTEXAS INSTRUMENTS INC·Filed 2008·Granted Aug 30, 2011·0 cites·15 claims
- 1041US8274140B2Semiconductor chip package assembly with deflection-resistant leadfingersFENG CHIEN-TE·Filed 2011·Granted Sep 25, 2012·0 cites·4 claims
- 1140US2012276692A1Method for Assemblying a Semiconductor Chip Package with Deflection-Resistant LeadfingersFENG CHIEN-TE·Filed 2012·Application pending·0 cites
- 1236US2010295168A1Semiconductor package using conductive plug to replace solder ballFENG CHIEN-TE·Filed 2009·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →