Inventor · disambiguated record
Jerome Daviot
Also filed as: DAVIOT JEROME · DAVIOT JÉRÔME
8 granted patents·5 pending applications·120 citations·filing 2001–2018
85Inventor score
Technology areasH10P
Top patents by PatentIndex Score
13 records- 0188US6777380B2Compositions for cleaning organic and plasma etched residues for semiconductor devicesEKC TECHNOLOGY INC·Filed 2001·Granted Aug 17, 2004·59 cites·17 claims
- 0277US7456140B2Compositions for cleaning organic and plasma etched residues for semiconductor devicesEKC TECHNOLOGY INC·Filed 2004·Granted Nov 25, 2008·24 cites·7 claims
- 0376US7235188B2Aqueous phosphoric acid compositions for cleaning semiconductor devicesEKC TECHNOLOGY INC·Filed 2003·Granted Jun 26, 2007·26 cites·35 claims
- 0460US8574418B2Electroplating method for coating a substrate surface with a metalMONCHOIX HERVE·Filed 2006·Granted Nov 5, 2013·2 cites·32 claims
- 0555US9133560B2Electroplating composition for coating a substrate surface with a metalDAVIOT JÉRÔME·Filed 2006·Granted Sep 15, 2015·1 cites·12 claims
- 0652US7012051B2Inhibition of titanium corrosionEKC TECHNOLOGY LTD·Filed 2001·Granted Mar 14, 2006·8 cites·42 claims
- 0748US2007054823A1Removal of post etch residues and copper contamination from low-K dielectrics using supercritical CO2 with diketone additivesEKC TECHNOLOGY INC·Filed 2006·Application pending·0 cites
- 0846US2007062817A1Method of coating a surface of a substrate with a metal by electroplatingALCHIMER·Filed 2005·Application pending·0 cites
- 0945US2007062818A1Electroplating composition intended for coating a surface of a substrate with a metalALCHIMER·Filed 2005·Application pending·0 cites
- 1040US2005107274A1Removal of post etch residues and copper contamination from low-k dielectrics using supercritical CO2 with diketone additivesFiled 2004·Application pending·0 cites
- 1134US10865484B2Solution and method for etching titanium based materialsTECHNIC FRANCE·Filed 2017·Granted Dec 15, 2020·0 cites·8 claims
- 1230US11075073B2Cleaning chemical composition for the removal of an amorphous passivation layer at the surface of crystalline materialsTECHNIC FRANCE·Filed 2018·Granted Jul 27, 2021·0 cites·13 claims
- 1328US2014076356A1Composition of solutions and conditions for use enabling the stripping and complete dissolution of photoresistsDAVIOT JEROME·Filed 2012·Application pending·0 cites
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