Inventor · disambiguated record
Chen-Fa Lu
Also filed as: LU CHEN-FA
22 granted patents·1 pending application·186 citations·filing 2000–2022
93Inventor score
Top patents by PatentIndex Score
23 records- 0196US9793243B2Buffer layer(s) on a stacked structure having a viaTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Oct 17, 2017·17 cites·20 claims
- 0294US6517413B1Method for a copper CMP endpoint detection systemTAIWAN SEMICONDUCTOR MFG·Filed 2000·Granted Feb 11, 2003·105 cites·32 claims
- 0390US10510723B2Buffer layer(s) on a stacked structure having a viaTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 17, 2019·5 cites·20 claims
- 0488US10269701B2Semiconductor structure with ultra thick metal and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Apr 23, 2019·4 cites·17 claims
- 0583US6555477B1Method for preventing Cu CMP corrosionTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Apr 29, 2003·33 cites·20 claims
- 0681US10128113B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Nov 13, 2018·3 cites·20 claims
- 0777US11270978B2Buffer layer(s) on a stacked structure having a viaTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Mar 8, 2022·1 cites·20 claims
- 0877US8629053B2Plasma treatment for semiconductor devicesLU CHEN-FA·Filed 2010·Granted Jan 14, 2014·4 cites·17 claims
- 0976US12021066B2Buffer layer(s) on a stacked structure having a viaTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jun 25, 2024·0 cites·20 claims
- 1073US11670584B2Semiconductor structure with ultra thick metal and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 6, 2023·0 cites·20 claims
- 1171US9508659B2Method and apparatus to protect a wafer edgeTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Nov 29, 2016·2 cites·17 claims
- 1265US6524959B1Chemical mechanical polish (CMP) planarizing method employing derivative signal end-point monitoring and controlTAIWAN SEMICONDUCTOR MFG·Filed 2000·Granted Feb 25, 2003·11 cites·13 claims
- 1364US11114378B2Semiconductor structure with ultra thick metal and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 7, 2021·0 cites·20 claims
- 1460US8716858B2Bump structure with barrier layer on post-passivation interconnectLU CHEN-FA·Filed 2011·Granted May 6, 2014·1 cites·20 claims
- 1557US10665456B2Semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted May 26, 2020·0 cites·20 claims
- 1657US10534353B2System and method to reduce pre-back-grinding process defectsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Jan 14, 2020·0 cites·20 claims
- 1754US9418955B2Plasma treatment for semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Aug 16, 2016·0 cites·20 claims
- 1851US8636559B2Method for wafer back-grinding controlLU CHEN-FA·Filed 2012·Granted Jan 28, 2014·0 cites·20 claims
- 1950US8571699B2System and method to reduce pre-back-grinding process defectsLU CHEN-FA·Filed 2010·Granted Oct 29, 2013·0 cites·20 claims
- 2048US10134645B2Stress monitoring device and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Nov 20, 2018·0 cites·20 claims
- 2147US8298041B2System and method for wafer back-grinding controlLU CHEN-FA·Filed 2010·Granted Oct 30, 2012·0 cites·10 claims
- 2240US8710458B2UV exposure method for reducing residue in de-taping processHU YU-HSIANG·Filed 2010·Granted Apr 29, 2014·0 cites·16 claims
- 2337US2012032337A1Flip Chip Substrate Package Assembly and Process for Making SameLU CHEN-FA·Filed 2010·Application pending·0 cites
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