Inventor · disambiguated record
Yeong-Chih Lai
Also filed as: LAI YEONG-CHIH
8 granted patents·197 citations·filing 1999–2000
87Inventor score
Files withUNITED MICROELECTRONICS CORP8
Top patents by PatentIndex Score
8 records- 0187US6103619AMethod of forming a dual damascene structure on a semiconductor waferUNITED MICROELECTRONICS CORP·Filed 1999·Granted Aug 15, 2000·114 cites·10 claims
- 0280US6239043B1Method for modulating uniformity of deposited layer thicknessUNITED MICROELECTRONICS CORP·Filed 2000·Granted May 29, 2001·26 cites·17 claims
- 0358US6204096B1Method for reducing critical dimension of dual damascene process using spin-on-glass processUNITED MICROELECTRONICS CORP·Filed 1999·Granted Mar 20, 2001·24 cites·12 claims
- 0449US6255162B1Method of gap fillingUNITED MICROELECTRONICS CORP·Filed 1999·Granted Jul 3, 2001·15 cites·16 claims
- 0537US6239024B1Method of filling gap with dielectricsUNITED MICROELECTRONICS CORP·Filed 1999·Granted May 29, 2001·7 cites·22 claims
- 0637US6133131AMethod of forming a gate spacer on a semiconductor waferUNITED MICROELECTRONICS CORP·Filed 1999·Granted Oct 17, 2000·6 cites·10 claims
- 0731US6284645B1Controlling improvement of critical dimension of dual damasceue process using spin-on-glass processUNITED MICROELECTRONICS CORP·Filed 1999·Granted Sep 4, 2001·3 cites·10 claims
- 0830US6248662B1Method of improving gap filling characteristics of dielectric layer by implantationUNITED MICROELECTRONICS CORP·Filed 1999·Granted Jun 19, 2001·2 cites·19 claims
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